EMI suppression inductors

Abstract

A novel array configuration for an EMI suppression inductor is disclosed. Exemplary embodiments of the EMI suppression inductor are also disclosed. In an exemplary embodiment, the inductor includes a magnetic core comprising opposing first and second sides. An opening extends from the first side through the magnetic core to the second side. Signal lines extend through the opening in the magnetic core. The signal lines include pins partially embedded within dielectric members spaced apart from each other along the pins, such that first and second ends of the pins are exposed and not embedded within the dielectric members. The dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation and / or maintain sufficient distance between the pins such that insulation between the pins is provided by air between the pins and by the dielectric members.

Description

EMI suppression inductor EMI SUPPRESSION INDUCTORS Technical Field

[0001] This work generally relates to EMI (electromagnetic interference) suppression inductors and methods for constructing EMI suppression inductors. Prior Technology

[0002] This section provides background information related to the content of this work, which is not necessarily prior art.

[0003] Traditional local area network (LAN) magnetic common-mode choke (CMC) components face challenges in Power over Ethernet (PoE) applications. For example, increasing power capacity can be problematic because the small enameled wire and its winding process may struggle to maintain the high currents associated with PoE applications.

[0004] A common-mode choke is a component of the LAN magnet between the MAC and PHY ICs (Media Access Control (MAC) and Physical Layer (PHY) integrated circuits) and the input / output (I / O) ports. The common-mode choke is responsible for suppressing common-mode noise, including electrostatic discharge (ESD) protection. According to the LAN 802.XX protocol, typically eight wires are retained in a twisted cable to transmit and receive data in differential mode. Summary of the Invention

[0005] One embodiment of this application relates to an inductor comprising: a magnetic core including opposing first and second sides, the magnetic core defining an opening extending from the first side through the magnetic core to the second side; and a signal line extending through the opening of the magnetic core; wherein the signal line includes pins partially embedded within a plurality of dielectric members spaced apart from each other along the pins such that a first end and a second end of the pins are exposed and not embedded within the plurality of dielectric members; wherein the plurality of dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation and / or maintain sufficient distance between the pins such that insulation between the pins is provided by air between the pins and by the plurality of dielectric members.

[0006] The plurality of dielectric components include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the pins; the first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head; the pins are partially embedded in the dielectric head, the first dielectric body, and the second dielectric body such that: a first end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the first end extending outward beyond the first dielectric body in a direction away from the dielectric head; and a second end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the second end extending outward beyond the second dielectric body in a direction away from the dielectric head.

[0007] The dielectric head and the pins cooperate to define a U-shape; each pin includes a straight middle portion between opposing first L-shaped portions and second L-shaped portions, the opposing first L-shaped portions and second L-shaped portions being along opposing first and second sides of the dielectric head; and the first dielectric and the second dielectric are engaged along a second side of the magnetic core.

[0008] The dielectric head and the pin are bent by a clamp to cooperatively define the U-shape inserted into the opening of the magnetic core; the first and second ends of the pin are bent by a roll forming process; the first and second dielectric bodies are joined along a second side of the magnetic core by epoxy resin or adhesive; and the first and second portions of the pin are formed by a single stamping process, thereby providing the pin with a gull or wing shape and helping to ensure solder coplanarity.

[0009] The pin is configured to increase the length of the electrical path through the magnetic core defined by the pin, thereby improving the impedance performance of the inductor.

[0010] The inductor is configured to have an impedance of at least 133 ohms at 30 MHz, at least 190 ohms at 100 MHz and / or at least 241 ohms at 200 MHz.

[0011] All signal lines extend through the same single opening in the magnetic core, thereby enabling the inductor to operate to suppress all common-mode noise through a single magnetic loop, such that differential-mode signals cancel each other out in the single magnetic loop, thus avoiding the risk of magnetic saturation of the magnetic core.

[0012] The inductor includes ten signal lines extending through the same single opening in the magnetic core, thereby enabling the inductor to operate to suppress all common-mode noise by means of a single magnetic loop, such that differential-mode signals cancel each other out in the single magnetic loop, thereby avoiding the risk of magnetic saturation of the magnetic core.

[0013] The first and second ends of the pins are bent into an "L" shape, thereby defining a surface mount technology (SMT) land pattern; each pin includes an intermediate portion extending between the first and second L-shaped ends; and the pins are partially embedded within the plurality of dielectric members to perform the following operations: maintain pin spacing without deformation; maintain sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric members; provide a precise SMT land pattern; and maintain good coplanarity.

[0014] The plurality of dielectric components comprise injection-molded plastic, and the leads are partially embedded in the injection-molded plastic to perform the following operations: maintain lead spacing without deformation; maintain sufficient distance between the leads to provide insulation between the leads by means of air between the leads and the plurality of dielectric components; provide precise surface mount technology patterning; and maintain good coplanarity.

[0015] The pin has an overall gull-shaped or wing-shaped profile; and the pin includes stamped phosphor bronze wire with a rectangular cross-sectional profile.

[0016] The magnetic core comprises a single-piece, monolithic, or single-component structure with perfect magnetic circuitry and characteristics.

[0017] The magnetic core includes a first magnetic core component and a second magnetic core component, which are joined together to form the magnetic core.

[0018] The first and second ends of the pins include opposing first and second L-shaped ends between straight intermediate portions, the first and second L-shaped ends cooperatively defining an overall gull or wing shape and defining a surface mount technology (SMT) pattern; and the plurality of dielectric members comprise injection-molded plastic, the pins being partially embedded in the injection-molded plastic such that the opposing first and second L-shaped ends of the pins are exposed and not embedded in the injection-molded plastic, thereby partially embedding the pins in the injection-molded plastic to maintain pin spacing without deformation, maintaining sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric members, providing a precise SMT pattern and maintaining good coplanarity.

[0019] The inductor is configured to be used in a Power over Ethernet (PoE) system.

[0020] Another aspect of this application relates to a method for constructing the inductor described above, wherein the method includes: using a jig to automatically bend the dielectric head and the pin to cooperatively define the U-shape, and inserting the U-shaped dielectric head and the pin into the opening of the magnetic core; bending the first end and the second end of the pin by a roll forming process; bonding the first dielectric and the second dielectric along the second side of the magnetic core using epoxy resin or adhesive; and forming the first portion and the second portion of the pin by a one-time stamping process, thereby providing the pin with a gull-shaped or wing-shaped profile and helping to ensure solder coplanarity.

[0021] Another aspect of this application relates to a Power over Ethernet (PoE) system, which includes the inductor described above.

[0022] Another aspect of this application relates to an inductor comprising: a magnetic core including opposing first and second sides, the magnetic core defining an opening extending from the first side through the magnetic core to the second side; and a signal line extending through the opening of the magnetic core; wherein the signal line includes pins partially embedded within a plurality of dielectric members spaced apart from each other along the pins such that first and second ends of the pins are exposed and not embedded within the plurality of dielectric members, and defining a surface mount technology pattern, thereby the plurality of dielectric members being configured to hold the pins in place, thereby helping to maintain pin spacing without deformation, maintaining sufficient distance between the pins such that insulation between the pins is achieved by the air between the pins and by the plurality of dielectric members. To provide a precise surface mount technology for patterning while maintaining good coplanarity; wherein: the plurality of dielectric components include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the pins; the first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head; the pins are partially embedded in the dielectric head, the first dielectric body, and the second dielectric body such that: a first end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the first end extending outward beyond the first dielectric body in a direction away from the dielectric head; and a second end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the second end extending outward beyond the second dielectric body in a direction away from the dielectric head.

[0023] The pin is configured to increase the length of the electrical path through the magnetic core defined by the pin, thereby improving the impedance performance of the inductor.

[0024] The inductor is configured to have an impedance of at least 133 ohms at 30 MHz, at least 190 ohms at 100 MHz and / or at least 241 ohms at 200 MHz.

[0025] The magnetic core comprises a single-piece, monolithic, or single-component structure with perfect magnetic circuitry and characteristics.

[0026] The magnetic core includes a first magnetic core component and a second magnetic core component, which are joined together to form the magnetic core.

[0027] The dielectric head and the pin are bent by a jig to cooperatively define a U-shape inserted into the opening of the magnetic core; the first and second ends of the pin are bent by a roll forming process; the first and second dielectric bodies are joined along a second side of the magnetic core by epoxy resin or adhesive; and the first and second portions of the pin are formed by a single stamping process, thereby providing the pin with a gull or wing shape and helping to ensure solder coplanarity.

[0028] The first and second ends of the pins include opposing first and second L-shaped ends between straight intermediate portions, the first and second L-shaped ends cooperatively defining an overall gull or wing shape and defining a surface mount technology (SMT) pattern; and the plurality of dielectric members comprise injection-molded plastic, wherein the pins are partially embedded in the injection-molded plastic such that the opposing first and second L-shaped ends of the pins are exposed and not embedded in the injection-molded plastic, thereby partially embedding the pins in the injection-molded plastic to maintain pin spacing without deformation, maintaining sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric members, providing a precise SMT pattern, and maintaining good coplanarity.

[0029] Another aspect of this application relates to a method for constructing an inductor as described above, wherein the method includes: using a jig to automatically bend the dielectric head and the pin to cooperatively define a U-shape, and inserting the U-shaped dielectric head and the pin into the opening of the magnetic core; bending the first end and the second end of the pin by a roll forming process; bonding the first dielectric and the second dielectric along a second side of the magnetic core using epoxy resin or adhesive; and forming a first portion and a second portion of the pin by a one-time stamping process, thereby providing the pin with a gull-shaped or wing-shaped profile and helping to ensure solder coplanarity.

[0030] Another aspect of this application relates to an inductor comprising: a magnetic core including opposing first and second sides, the magnetic core defining an opening extending from the first side through the magnetic core to the second side; and a signal line extending through the opening of the magnetic core; wherein the signal line includes pins configured to increase the length of an electrical path defined by the pins through the magnetic core, thereby improving the impedance performance of the inductor.

[0031] The inductor is configured to have an impedance of at least 133 ohms at 30 MHz, at least 190 ohms at 100 MHz and / or at least 241 ohms at 200 MHz.

[0032] The pins are partially embedded within one or more dielectric components, such that the first and second ends of the pins are exposed and not embedded within the one or more dielectric components, and define a surface mount technology pattern.

[0033] The one or more dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation, maintaining sufficient distance between the pins such that insulation between the pins is provided by the air between the pins and by the one or more dielectric members, providing accurate surface mount technology patterning and maintaining good coplanarity.

[0034] The one or more dielectric components include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the pin; the first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head; the pin is partially embedded in the dielectric head, the first dielectric body, and the second dielectric body such that: a first end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the first end extending outward beyond the first dielectric body in a direction away from the dielectric head; and a second end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the second end extending outward beyond the second dielectric body in a direction away from the dielectric head. Simple Explanation of the Diagram

[0035] The accompanying drawings described herein are for illustrative purposes only, representing the selected embodiments and not all possible implementations, and are not intended to limit the scope of this invention.

[0036] [Figure 1] illustrates a novel array configuration for an EMI suppression inductor comprising a first exemplary embodiment according to the present invention.

[0037] [Figure 2] shows the EMI suppression inductor shown in Figure 1.

[0038] [Figure 3] illustrates an EMI suppression inductor according to a second exemplary embodiment of the present invention.

[0039] [Figure 4] illustrates an exemplary method for constructing an inductor 300 with a two-piece magnetic core.

[0040] [Figure 5] illustrates a recommended or preferred mounting pattern for the inductors shown in Figures 2 and 3 according to an exemplary embodiment of the present invention, having exemplary dimensions in millimeters. The dimensions provided in Figure 5 are merely examples for illustrative purposes, as inductors in other exemplary embodiments may be configured differently, for example, for use with mounting patterns having smaller or larger dimensions, etc.

[0041] [Figure 6] shows a circuit equivalent to the inductor shown in Figures 2 and 3 according to an exemplary embodiment of the present invention.

[0042] [Figure 7] is a line diagram illustrating recommended or preferred soldering conditions for the inductors shown in Figures 2 and 3 according to an exemplary embodiment of the present invention.

[0043] In the various views of the accompanying drawings, corresponding reference numerals may indicate corresponding (but not necessarily identical) parts. Implementation

[0044] The exemplary implementation will now be described more fully with reference to the accompanying drawings.

[0045] Traditional local area network (LAN) magnetic common-mode choke (CMC) components face challenges in Power over Ethernet (PoE) applications. For example, the small enameled wire and its winding process may struggle to maintain the high currents associated with PoE applications, and increased power capacity can cause problems.

[0046] For LAN transformers located near input / output (I / O) connectors, multi-wire or multi-channel common-mode chokes should be used for common noise suppression and DC power transfer. Traditionally, four separate toroidal (or drum-shaped) cores are configured such that each toroidal (or drum-shaped) core has a pair of differential symbol lines. This conventional configuration has no problem suppressing common noise patterns mixed into each pair of differential symbols. However, this conventional configuration can have problems that tend to become more severe as DC supply current and frequency increase. For example, the conventional coil winding treatment used for toroidal and drum-shaped cores limits the wire gauge (typically AWG 35-40), thus limiting the POE current. Furthermore, because the four pairs of differential lines have independent cores in a conventional common-mode choke, deviations in core consistency can occur, leading to noise imbalances; for example, the core's suppression of near and far crosstalk will be drastically reduced.

[0047] Exemplary implementations of the EMI suppression inductors disclosed herein are configured to address, eliminate, and / or improve problems associated with conventional Ethernet LAN common-mode noise chokes / inductors, such as: Traditional Ethernet LAN common-mode noise chokes / inductors cannot maintain high Power over Ethernet (PoE) currents due to limitations imposed by their small enameled wire and wire winding process. • Low security and insulation class of traditional Ethernet LAN common-mode noise chokes / inductors; • Thermal issues associated with tight spacing and high wire resistance in traditional Ethernet LAN common-mode noise chokes / inductors; • Automated manufacturing challenges associated with common-mode noise chokes / inductors in traditional Ethernet LANs; • Electrostatic discharge (ESD) issues and ESD protection deficiencies associated with common-mode noise chokes / inductors in traditional Ethernet LANs; and • Poor crosstalk and noise suppression.

[0048] Exemplary embodiments of the EMI suppression inductors disclosed herein are configured to provide or include one or more (but not necessarily all or all) of the following advantageous effects or features, which include: • Use stamped or die-cut metal leads (such as tin-plated phosphor bronze) instead of enameled wire to accommodate high current requirements and balance conductivity and mechanical strength; • Use plastic (broadly speaking, dielectric material) injection molding to ensure pin spacing, no deformation, ESD, and pulse shock (e.g., "gull" or "wing" shapes are applied and embedded within the injection molded body (e.g., with 40% glass fiber, plastic, etc. reinforced liquid crystal polymer (LCP) grades) to achieve precise surface mount technology (SMT) patterning and good coplanarity, even with many pins, etc.). • Due to its planar metal pin construction, it offers better heat dissipation and lower capacitance effect; • Achieve 100% automated manufacturing processes; • Multiple channels / lines in a magnetic loop (e.g., all ten channels / lines, etc.) to suppress crosstalk noise as much as possible and / or maintain optimal ESD noise suppression, etc.; and / or • Multiple channels / lines in a single construction to meet the needs of high-power, small-size filter inductors in PoE+ applications.

[0049] The exemplary embodiments disclosed herein include a novel head structure in which more than one plastic body (generally, a dielectric body) holds or retains the leads in place to ensure safe distances, lead spacing, and no deformation. The head and leads are formed or shaped (e.g., automatically bent via a fixture) into a generally "U" shape. The bent U-shaped head and leads are slidably inserted into a magnetic core, which may be a single structure with 100% perfect magnetic circuitry. The ends of the leads are bent along both sides of the head, for example, by roll forming. The plastic body can then be bonded along the underside of the magnetic core using epoxy, adhesive, or other suitable bonding methods. For example, the ends of the leads are formed or shaped via a one-time stamping process to ensure solder coplanarity, providing leads with a "gull" or "wing" shape.

[0050] Advantageously, the exemplary embodiments of the EMI suppression inductors disclosed herein can achieve dual impedance values ​​to suppress EMI noise compared to conventional die inductors with a smaller core weight and volume ratio, thus enabling the disclosed EMI suppression inductors to be compact and have higher construction reliability. Exemplary embodiments of the EMI suppression inductors disclosed herein include punched or stamped metal wire (e.g., phosphor bronze with tin plating, etc.) instead of electromagnetic wire, which can significantly increase current carrying capacity. In exemplary embodiments, the metal wire can be arranged to replace coil construction, which can drastically reduce parasitic parameters such as capacitor effects. The impedance resonant point (SRF) shifts to higher frequencies to improve the application frequency range. In exemplary embodiments, standard accessories and simple assembly can be used to shorten, simplify, and provide more cost-effective manufacturing processes (e.g., for high-frequency multi-array solutions, etc.) while ensuring greater product consistency.

[0051] Referring now to the accompanying drawings, FIG1 illustrates a novel array configuration for an EMI suppression inductor 100 (also shown in FIG2) according to a first exemplary embodiment of the present invention. In this exemplary embodiment, the inductor 100 includes a magnetic core 104 (e.g., a nickel-zinc (NiZn) ferrite core, other ferrite cores, etc.) configured as a single-piece, monolithic, single-component structure with perfect magnetic circuitry and characteristics. The inductor 100 can be configured to function as a common-mode choke, a multi-channel EMI suppression inductor, and / or a high-power, small-size filter inductor in Power over Ethernet (PoE) applications.

[0052] Inductor 100 includes ten conductive (e.g., metal, etc.) leads 108. The leads 108 are preferably formed of tin-plated phosphor bronze to balance conductivity and mechanical strength. The leads 108 may have a rectangular cross-sectional profile. The leads 108 can be punched or stamped and electroplated from frame 112. In alternative embodiments, inductor 100 may include leads 108 in different configurations, such as more or fewer than ten leads, leads formed of different materials and / or via different processes, leads with non-rectangular cross-sectional profiles, etc.

[0053] Frame 112 includes pins 108 and dielectric heads 116 (e.g., liquid crystal polymer (LCP) grade reinforced with 40% glass fiber, plastic, etc.). Frame 112 also includes multiple dielectrics or components (e.g., liquid crystal polymer (LCP) grade reinforced with 40% glass fiber, plastic, etc.). In this exemplary embodiment, frame 112 includes a first dielectric 120 or component and a second dielectric 124 or component spaced apart from a first side and a second side opposite to the dielectric head 116. Thus, pins 108 are embedded within three spaced-apart dielectric components (dielectric head 116 and the first dielectric 120 and the second dielectric 124) such that the ends of pins 108 are exposed and not embedded within the dielectric components, and pins 108 are secured or held in place by the three spaced-apart dielectric components, thereby ensuring safe distances, pin spacing, and no deformation.

[0054] Referring again to FIG1, the dielectric head 116 and the leads 108 (e.g., automatically bent via a jig, etc.) are formed or shaped into a generally "U" shape. Each lead 108 includes a straight intermediate portion between opposing first and second L-shaped portions, which are located along opposing first and second sides of the dielectric head 116. The ends of the frame 112 are trimmed, cut, or otherwise removed such that only the leads 108 are retained.

[0055] The dielectric head 116 and the lead 108 (cooperatively defining a bent U-shape) are slidably inserted into the magnetic core 104. For example, the ends of the lead 108 are bent along both sides of the dielectric head 116 (e.g., substantially perpendicular, etc.) by means of a rolling process. The first dielectric 120 and the second dielectric 124 can then be bonded along the bottom side of the magnetic core 104 using epoxy resin, adhesive, or other suitable bonding means. (e.g., via a one-time stamping process to ensure solder coplanarity, etc.) The ends of the lead 108 are formed or shaped to give the lead 108 a "gull" or "wing" shape, which ultimately yields an SMD (Surface Mount Device) mounting pattern.

[0056] Compared to conventional EMI suppression inductors with conventional tubular ferrite cores, inductor 100 can be configured to have improved impedance performance (e.g., improved impedance performance from 30 MHz to 500 MHz, twice the impedance value at 100 MHz, etc.) for suppressing EMI noise, while maintaining a compact form / overall size and the same board pattern, with only a slight increase in weight (e.g., a 30% increase in weight from about 17.8 grams to 23.5 grams, etc.).

[0057] The impedance performance of the inductor 100 is improved by increasing (e.g., doubling, etc.) the length of the electrical path through the magnetic core 104 defined by the electrical conductor (e.g., pin 308). By maintaining a compact form and fitting into the same board pattern (e.g., the recommended board pattern shown in FIG. 5, etc.), the inductor 100 can be retrofitted for use with existing boards without having to redesign the board.

[0058] As an example, inductor 100 can be configured to have a nominal impedance Z (typical value on the rightmost or leftmost pin) of approximately 133 ohms at 30 MHz, approximately 190 ohms at 100 MHz, and approximately 241 ohms at 200 MHz. Inductor 100 can be configured for use with a differential current of approximately 4 ADC (Ampere DC current). The impedance values, weight, frequency, and differential current disclosed herein are merely examples and provided for illustrative purposes only, as inductors in other exemplary embodiments can be configured differently, for example, for different frequencies, heavier, lighter, with different impedance characteristics, etc.

[0059] Furthermore, the center wall thickness of an inductor 100 with a single magnetic core can be thinner than that of an inductor with a two-core magnetic core (e.g., inductor 300 shown in FIG. 3). In the latter case, the center wall thickness of the inductor is defined by the thickness of the two side walls of the corresponding first and second magnetic core elements.

[0060] In an exemplary embodiment, inductor 100 is configured to have a length of about 26 mm, a width of about 20 mm, and a height of about 14 mm, including the leads. These dimensions are merely examples and provided for illustrative purposes only, as inductors in other exemplary embodiments may be configured differently, for example, having smaller or larger dimensions.

[0061] As shown in Figures 1 and 2, inductor 100 includes ten signal lines (e.g., pins 108) within a single core hole. Furthermore, dielectric material is injection molded onto the dielectric head 116, the first dielectric body 120, and the second dielectric body 124 to ensure pin spacing and prevent deformation. Pins 108 are "gull-shaped" or "wing-shaped" and are embedded within the dielectric head 116, the first dielectric body 120, and the second dielectric body 124 to achieve accurate SMT board mounting and good coplanarity (even with numerous pins). In this exemplary embodiment, inductor 100 includes metal leads made of phosphor bronze to balance conductivity and mechanical strength. Inductor 100 includes ten lines / channels in a single component structure, which can be used as a high-power, small-size filter inductor in PoE+ applications.

[0062] Advantageously, compared to conventional die inductors, inductor 100 can achieve dual impedance values ​​to suppress EMI noise, has a smaller core weight and volume ratio, thus enabling inductor 100 to be compact and have higher construction reliability. Inductor 100 includes punched or stamped metal wire instead of electromagnetic wire, which can significantly increase current carrying capacity. The metal wire can be arranged instead of a coil construction, which can drastically reduce parasitic parameters such as capacitor effects. The impedance resonant point (SRF) shifts to higher frequencies to improve the application frequency range. In exemplary embodiments, standard accessories and simple assembly can be used to shorten, simplify, and provide a more cost-effective manufacturing process (e.g., for high-frequency multi-array solutions, etc.) while ensuring greater product consistency.

[0063] Figure 3 illustrates an EMI suppression inductor 300 according to a second exemplary embodiment of the present invention. In this exemplary embodiment, the inductor 300 includes a first magnetic core 302 and a second magnetic core 303, which can be bonded together (e.g., via adhesive, epoxy resin, other suitable methods, etc.) to form a magnetic core 304 (e.g., a nickel-zinc (NiZn) ferrite core, other ferrite cores, etc.). The inductor 300 can be configured to function as a common-mode choke, a multi-channel EMI suppression inductor, and / or a high-power, small-size filter inductor in Power over Ethernet (PoE) applications.

[0064] Figure 4 illustrates an exemplary method of constructing an inductor 300 having a two-piece magnetic core 304. In this exemplary embodiment, the inductor 300 includes a first magnetic core 302 and a second magnetic core 303, which can be bonded together (e.g., via an adhesive, epoxy resin, other suitable methods, etc.) to form the magnetic core 304 of the inductor 300. For example, the first magnetic core 302 and the second magnetic core 303 can be bonded together via an adhesive or epoxy resin 306 (e.g., including polyethylene terephthalate (PET), flame retardant (FR), liquid crystal polymer (LCP), etc.).

[0065] After the first magnetic core 302 and the second magnetic core 303 are joined together, the upper portion of the conductive (e.g., metal, etc.) lead 308 is bent (e.g., into an "L" lead shape, etc.), polished, and laser-bonded (as shown in the second figure from the top of FIG4). Subsequently, the lower portion of the lead 308 is bent (e.g., into an "L" lead shape, etc.). Thus, each lead 308 includes opposing L-shaped ends between straight middle portions, which cooperatively define a "gull" or "wing" shape that ultimately achieves an SMD (Surface Mount Device) mounting pattern.

[0066] Inductor 300 includes ten conductive (e.g., metal, etc.) leads 308. The leads 308 are preferably formed of tin-plated phosphor bronze to balance conductivity and mechanical strength. The leads 308 may have a rectangular cross-sectional profile. The leads 308 can be punched or stamped and electroplated from a frame (e.g., frame 112 (FIG. 1) etc.). The leads 308 of inductor 300 can be formed similarly to the leads 108 of inductor 100 described above. In alternative embodiments, inductor 300 may include leads 308 in different configurations, such as more or fewer than ten leads, leads formed of different materials and / or via different processes, leads with non-rectangular cross-sectional profiles, etc.

[0067] Compared to conventional EMI suppression inductors with traditional tubular ferrite cores, inductor 300 can be configured to have improved impedance performance (e.g., improved impedance performance from 30 MHz to 500 MHz, twice the impedance value at 100 MHz, etc.) for suppressing EMI noise, while maintaining a compact form factor / overall size and the same board pattern, with only a slight increase in weight (e.g., a 30% increase from about 17.8 grams to 23.5 grams, etc.).

[0068] The impedance performance of the inductor 300 is improved by increasing (e.g., doubling) the length of the electrical path through the magnetic core 304 defined by the electrical conductor (e.g., pin 308). By maintaining a compact form and fitting into the same board pattern (e.g., the recommended board pattern shown in Figure 5), the inductor 300 can be retrofitted for use with existing boards without requiring a board redesign.

[0069] As an example, inductor 300 can be configured to have a nominal impedance Z (typical value on the rightmost or leftmost pin) of approximately 133 ohms at 30 MHz, approximately 190 ohms at 100 MHz, and approximately 241 ohms at 200 MHz. Inductor 300 can be configured for use with a differential current of approximately 4 ADC (Ampere DC current). The impedance values, weight, frequency, and differential current disclosed herein are merely examples and provided for illustrative purposes only, as inductors in other exemplary embodiments can be configured differently, for example, for different frequencies, heavier, lighter, or with different impedance characteristics, etc.

[0070] In an exemplary embodiment, the inductor 300 is configured to have a length of about 26 mm, a width of about 20 mm, and a height of about 14 mm, including the leads. These dimensions are merely examples and provided for illustrative purposes only, as inductors in other exemplary embodiments may be configured differently, for example, having smaller or larger dimensions.

[0071] As shown in Figure 3, inductor 300 includes 10 signal lines (e.g., pins 108). Dielectric material injection molding can be used to provide the dielectric head and dielectric body to secure or hold the pins 308 in place, ensuring pin spacing and no deformation. Furthermore, the pins 308 are shaped into a "gull" or "wing" shape and can be embedded in the dielectric head and dielectric body to achieve accurate SMT board mounting and good coplanarity (even with many pins). In this exemplary embodiment, inductor 300 includes metal leads made of phosphor bronze to balance conductivity and mechanical strength. Inductor 300 includes ten lines / channels in a single component structure, which can be used as a high-power, small-size filter inductor in PoE+ applications.

[0072] Figure 6 shows an equivalent circuit of the inductor shown in Figures 2 and 3 according to an exemplary embodiment of the present invention. Figure 7 is a line diagram showing recommended or preferred soldering conditions for the inductor shown in Figures 2 and 3 according to an exemplary embodiment of the present invention.

[0073] Advantageously, compared to conventional die inductors, inductor 300 can achieve dual impedance values ​​to suppress EMI noise, and has a smaller core weight and volume ratio, thus enabling inductor 300 to be compact and have higher construction reliability. Inductor 300 includes punched or stamped metal wire instead of electromagnetic wire, which can significantly increase current carrying capacity. The metal wire can be arranged instead of a coil construction, which can drastically reduce parasitic parameters such as capacitor effects. The impedance resonant point (SRF) shifts to higher frequencies to improve the application frequency range. In exemplary embodiments, standard accessories and simple assembly can be used to shorten, simplify, and provide a more cost-effective manufacturing process (e.g., for high-frequency multi-array solutions), while ensuring greater product consistency.

[0074] Exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 (Figures 1 and 2), inductor 300 (Figure 3), etc.) are configured to provide good ESD protection, accidental pulse isolation, common-mode noise suppression, and crosstalk between the respective transmit and receive signal channels. The exemplary embodiments of the inductors disclosed herein demonstrate excellent flexibility and competitiveness in addressing the aforementioned recognized challenges in increasingly high-power PoE applications.

[0075] Traditional LAN common-mode chokes (comprising enameled wire wound into a toroidal or other shaped core) have limitations on the shape and specifications (thickness or thinness) of the wire cross-section due to the type of winding machine. The exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 (Figures 1 and 2), inductor 300 (Figure 3), etc.) do not have such limitations regarding wire selection, as wires with circular or rectangular cross-sectional shapes are acceptable. The exemplary embodiments of the inductors disclosed herein also allow for a wide range of wire specifications; for example, wire diameters from 0.1 mm to 2.0 mm are acceptable. The corresponding rated current can reach tens of amperes. Designers are free to choose the most suitable wire characteristics based on the actual application conditions.

[0076] For conventional LAN common-mode chokes, insulation and the corresponding rated voltage are based on the coating of the enameled wire. According to standards such as IEC, UL, and 3C, the safety level is a function of insulation. For the exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 (Figures 1 and 2), inductor 300 (Figure 3), etc.), insulation between pins (e.g., phosphor bronze pins, wires, etc.) is ensured by sufficient air distance and the dielectric itself, allowing the insulation level to reach basic insulation or even enhanced insulation. The insulation will be sufficient for current and future communication voltage applications.

[0077] In conventional common-mode choke constructions, the thermal resistance from hot spot to surface ranges from 1 degree Celsius (°C / W) to 20°C / W. In contrast, exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 (Figures 1 and 2), inductor 300 (Figure 3), etc.) can be configured such that they have nearly 100% contact with the plastic, core, and air. The corresponding thermal resistance can be less than 0.5°C / W, and the heat distribution is excellent, with virtually no hot spot issues.

[0078] While traditional local area network common-mode chokes have been continuously improved to support automated manufacturing, their efficiency remains low for assembly processes. The exemplary embodiments of inductors disclosed herein (e.g., inductor 100 (Figures 1 and 2), inductor 300 (Figure 3), etc.) are suitable for 100% automated manufacturing of the entire process. Furthermore, the automated manufacturing equipment is relatively standard and not overly complex.

[0079] The smaller oxide layer of MOSFETs in integrated circuit (IC) packages increases the importance of ESD protection. For specific common-mode noise, ESD is distributed across the entire channel. Therefore, how to better suppress ESD pulses is an important consideration.

[0080] For example, a conventional LAN common-mode choke may include a toroidal core or other shaped cores. A conventional choke may include multiple insulated cores connected in parallel. In such a conventional choke, the suppression of common-mode noise, especially ESD, will be unbalanced, resulting in additional differential-mode signal noise. Furthermore, as the PoE current increases, it cannot be guaranteed that the positive and negative wires will cancel each other out in any isolated core, leading to a risk of magnetic saturation in the core.

[0081] Typically, the PoE current travels through multiple lines, which is even worse for the isolation lines of a parallel common-mode choke. These lines go into different vias.

[0082] In the exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 (Figures 1 and 2) etc.), regardless of the number of signal lines, all signal lines reside in the same or a single "one-hole". Therefore, all common-mode noise can be suppressed by a single magnetic loop, and differential-mode signals (including the POE supply current loop) can completely cancel each other out in a single magnetic loop, thus eliminating the risk of magnetic saturation.

[0083] A novel array configuration for an EMI suppression inductor is disclosed. Exemplary embodiments of the EMI suppression inductor are also disclosed.

[0084] In an exemplary embodiment, the inductor includes a magnetic core having opposing first and second sides. An opening extends from the first side through the magnetic core to the second side. A signal line extends through the opening in the magnetic core. The signal line includes pins partially embedded within a plurality of dielectric members spaced apart from each other along the pins, such that first and second ends of the pins are exposed and not embedded within the dielectric members. The dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation and / or maintain sufficient distance between the pins such that insulation between the pins is provided by the air between the pins and the dielectric members.

[0085] In an exemplary embodiment, a plurality of dielectric components include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the leads. The first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head. The leads are partially embedded in the dielectric head, the first dielectric body, and the second dielectric body such that: a first end of the lead is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the first end extending outward beyond the first dielectric body in a direction away from the dielectric head; and a second end of the lead is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the second end extending outward beyond the second dielectric body in a direction away from the dielectric head.

[0086] In an exemplary embodiment, the dielectric head and pin cooperatively define a generally U-shape. Each pin includes a straight intermediate portion located between opposing first and second L-shaped portions along opposing first and second sides of the dielectric head. The first and second dielectric bodies are joined along a second side of the magnetic core. The dielectric head and pin can be bent via a jig to cooperatively define a generally U-shape within an opening in the magnetic core. The first and second ends of the pin can be bent via a roll forming process. The first and second dielectric bodies can be joined along the second side of the magnetic core via epoxy resin or adhesive. The first and second portions of the pin are formed by a single stamping process, thereby providing a gull-shaped or wing-shaped profile to the pin and helping to ensure solder coplanarity.

[0087] An exemplary method of constructing an inductor includes: using a jig to automatically bend the dielectric head and leads to cooperatively define a generally U-shape, and inserting the U-shaped dielectric head and leads into an opening in a magnetic core; bending the first and second ends of the leads by roll forming; bonding the first and second dielectrics along a second side of the magnetic core using epoxy resin or adhesive; and forming the first and second portions of the leads by a one-time stamping process, thereby giving the leads a gull-shaped or wing-shaped profile and helping to ensure solder coplanarity.

[0088] In an exemplary embodiment, the pins are configured to increase the length of the electrical path through the magnetic core defined by the pins, thereby improving the impedance performance of the inductor.

[0089] In an exemplary embodiment, the inductor is configured to have an impedance of at least about 133 ohms at 30 MHz, at least about 190 ohms at 100 MHz, and / or at least about 241 ohms at 200 MHz.

[0090] In an exemplary embodiment, all signal lines extend through the same single opening in the magnetic core. Furthermore, the inductor is operable to suppress all common-mode noise via a single magnetic loop, such that differential-mode signals cancel each other out within the single magnetic loop, thereby avoiding the risk of magnetic saturation of the magnetic core.

[0091] In an exemplary embodiment, the inductor includes ten signal lines extending through the same single opening in the magnetic core. Furthermore, the inductor is operable to suppress all common-mode noise via a single magnetic loop, such that differential-mode signals cancel each other out in the single magnetic loop, thereby avoiding the risk of magnetic saturation of the magnetic core.

[0092] In an exemplary embodiment, the first and second ends of the pins are bent into an "L" shape to define an SMT (Surface Mount Technology) mounting pattern. Each pin includes an intermediate portion extending between the first and second L-shaped ends. The pins are partially embedded within the plurality of dielectric members to perform the following functions: maintain pin spacing without deformation; maintain sufficient distance between the pins to provide insulation between them via air between the pins and the plurality of dielectric members; provide a precise SMT mounting pattern and maintain good coplanarity.

[0093] In an exemplary embodiment, a plurality of dielectric components comprise injection-molded plastic, wherein pins are partially embedded to perform the following operations: maintaining pin spacing without deformation; maintaining sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric components; providing accurate SMT board patterning; and maintaining good coplanarity.

[0094] In an exemplary embodiment, the pin has an overall gull-shaped or wing-shaped profile. Furthermore, the pin comprises stamped phosphor bronze wire with a rectangular cross-sectional profile.

[0095] In an exemplary embodiment, the magnetic core includes a single-piece, monolithic, or single-component structure with perfect magnetic circuitry and characteristics.

[0096] In an exemplary embodiment, the magnetic core includes a first magnetic core member and a second magnetic core member, which are joined together to form a magnetic core.

[0097] In an exemplary embodiment, the first and second ends of the pins include opposing first and second L-shaped ends between straight intermediate portions, the first and second L-shaped ends cooperatively defining an overall gull-shaped or wing-shaped profile and defining an SMT (Surface Mount Technology) mounting pattern. The plurality of dielectric members comprise injection-molded plastic, and the pins are partially embedded in the injection-molded plastic such that the opposing first and second L-shaped ends of the pins are exposed and not embedded within the injection-molded plastic. The partial embedding of the pins within the injection-molded plastic maintains pin spacing without deformation, maintaining sufficient distance between the pins to provide insulation between the pins via air between the pins and the plurality of dielectric members, providing accurate SMT mounting patterns and maintaining good coplanarity.

[0098] In an exemplary embodiment, the inductor includes a magnetic core having opposing first and second sides. An opening extends from the first side through the magnetic core to the second side. A signal line extends through the opening in the magnetic core. The signal line includes pins configured to increase the length of the electrical path defined by the pins through the magnetic core, thereby improving the impedance performance of the inductor. The inductor may be configured to have an impedance of at least about 133 ohms at 30 MHz, at least about 190 ohms at 100 MHz, and / or at least about 241 ohms at 200 MHz. The pins may be partially embedded within one or more dielectric members such that a first and second end of the pin are exposed and not embedded within one or more dielectric members, defining an SMT (Surface Mount Technology) mounting pattern. One or more dielectric components can be configured to hold the pins in place, thereby helping to maintain pin spacing without deformation, maintaining sufficient distance between pins so that insulation between pins is provided by air between pins and one or more dielectric components, providing accurate SMT board patterning and maintaining good coplanarity.

[0099] In an exemplary embodiment, the inductor is configured to be used within a Power over Ethernet (POE) system.

[0100] In an exemplary embodiment, the Power over Ethernet (PoE) system includes an inductor as disclosed herein.

[0101] The provision of exemplary embodiments makes this invention thorough and fully conveys its scope to those skilled in the art. Numerous specific details, such as examples of specific components, apparatuses, and methods, are set forth to provide a thorough understanding of how the invention is implemented. It will be apparent to those skilled in the art that specific details are not required, that exemplary embodiments may be implemented in many different forms, and neither should be construed as limiting the scope of the invention. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail. Furthermore, advantages and improvements that can be achieved using one or more exemplary embodiments of the invention are provided for illustrative purposes only and do not limit the scope of the invention, as the exemplary embodiments disclosed herein may or may not provide all of the aforementioned advantages and improvements and still fall within the scope of the invention.

[0102] The specific numerical dimensions and values, specific materials and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of this invention. The disclosure herein of specific values ​​and specific ranges of values ​​for a given parameter does not exclude other values ​​and ranges of values ​​that may be useful in one or more examples disclosed herein. Furthermore, it is contemplated that any two specific values ​​of a particular parameter described herein can define endpoints that can be appropriate for a range of values ​​for the given parameter (the disclosure of a first and second value of a given parameter can be interpreted as disclosing that any value between the first and second values ​​can also be used for the given parameter). For example, if parameter X is exemplified herein as having a value A and also exemplified herein as having a value Z, it is contemplated that parameter X can have a range of values ​​from approximately A to approximately Z. Similarly, it is contemplated that the disclosure of two or more ranges of values ​​for a parameter (whether these ranges are nested, overlapping, or distinct) encompasses all possible combinations of ranges of values ​​that can be claimed using the endpoints of the disclosed ranges. For example, if the parameter X is exemplified herein as having a value in the range of 1 to 10, or 2 to 9, or 3 to 8, it is also conceivable that the parameter X could have other ranges of values ​​including 1 to 9, 1 to 8, 1 to 3, 1 to 2, 2 to 10, 2 to 8, 2 to 3, 3 to 10, and 3 to 9.

[0103] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. As used herein, the singular forms "a / an" and "described" may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprising," "including," "containing," and "having" are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless specifically identified as an order of execution, the method steps, processes, and operations described herein should not be construed as requiring them to be performed in the particular order discussed or shown. It should also be understood that additional or alternative steps may be employed.

[0104] When an element or layer is referred to as "on another element or layer," "attached to," "connected to," or "linked to" another element or layer, it may be directly on, attached to, connected to, or linked to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as "directly on another element or layer," "directly attached to," "directly connected to," or "directly linked to" another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0105] When applied to values, the term "about" indicates a slight degree of inaccuracy in the calculated or measured value (some degree of near-accuracy; approximate or reasonably close to the value; almost). If, for some reason, the inaccuracy provided by "about" is not understood in the art to have that general meaning, then "about" as used herein at least indicates a variation that may arise from common methods of measuring or using such parameters. For example, the terms "usually," "about," and "substantially" may be used herein to mean within manufacturing tolerances. Or, for example, when modifying the amount of an ingredient or reactant used in this invention, the term "about" as used herein refers to a variation in numerical quantity that may occur by the typical measurement and processing procedures used, for example, when preparing concentrates or solutions in the real world by unintentional errors in these procedures; by differences in the manufacture, source, or purity of the ingredients used to prepare the composition or carry out the method; and so on. The term "about" also covers amounts that differ due to different equilibrium conditions of the composition resulting from a particular initial mixture. Whether or not modified by the term "about," the claims include equivalents of these amounts.

[0106] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another region, layer, or segment. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply sequence or order. Therefore, a first element, component, region, layer, or segment may be referred to as a second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0107] For ease of description, spatial relative terms such as "inside," "outside," "below," "lower," "above," and "upper" are used herein to describe the relationship between one element or feature and another element or feature as shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as "below" or "below" of other elements or features will be oriented "above" of other elements or features. Thus, the example term "below" can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein will be interpreted accordingly.

[0108] The foregoing description of embodiments has been provided for illustrative and descriptive purposes. It is not intended to be exhaustive or limiting of the scope of this invention. Various elements, intended or stated uses, or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable where applicable and can be used in selected embodiments, even if not specifically shown or described. They can also be varied in many ways. Such variations should not be considered a departure from the scope of this invention, and all such modifications are intended to be included within the scope of this invention.

[0109] 100: EMI suppression inductor / inductor 104: Magnetic Core 108: Pins 112: Framework 116: Dielectric head 120: First dielectric 124: Second dielectric 300: EMI suppression inductor / inductor 302: First magnetic core component 303: Second magnetic core component 304: Magnetic core 306: Epoxy Resin 308: Pin

Claims

1. An inductor, the inductor comprising: A magnetic core, the magnetic core including opposing first and second sides, the magnetic core defining an opening extending from the first side through the magnetic core to the second side; and signal lines extending through the opening in the magnetic core; wherein the signal lines include pins partially embedded within a plurality of dielectric members spaced apart from each other along the pins, such that a first end and a second end of the pins are exposed and not embedded within the plurality of dielectric members; wherein the plurality of dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation and / or maintain sufficient distance between the pins such that insulation between the pins is provided by the air between the pins and by the plurality of dielectric members.

2. The inductor as claimed in claim 1, wherein: The plurality of dielectric components include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the pin; the first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head; the pin is partially embedded in the dielectric head, the first dielectric body, and the second dielectric body such that: a first end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, and the first end extends outward beyond the first dielectric body in a direction away from the dielectric head; Furthermore, the second end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, and the second end extends outward beyond the second dielectric body in a direction away from the dielectric head.

3. The inductor as claimed in claim 2, wherein: The dielectric head and the pins cooperate to define a U-shape; each pin includes a straight intermediate portion between opposing first L-shaped portions and second L-shaped portions, the opposing first L-shaped portions and second L-shaped portions being along opposing first and second sides of the dielectric head; and the first dielectric and the second dielectric are engaged along a second side of the magnetic core.

4. The inductor as described in claim 3, wherein: The dielectric head and the pin are bent by a jig to cooperatively define the U-shape inserted into the opening of the magnetic core; the first and second ends of the pin are bent by a roll forming process; the first and second dielectric bodies are joined along a second side of the magnetic core by epoxy resin or adhesive; and the first and second portions of the pin are formed by a single stamping process, thereby providing the pin with a gull or wing shape and helping to ensure solder coplanarity.

5. The inductor as claimed in any one of claims 1 to 4, wherein, The pin is configured to increase the length of the electrical path through the magnetic core defined by the pin, thereby improving the impedance performance of the inductor.

6. The inductor as claimed in claim 5, wherein, The inductor is configured to have an impedance of at least 133 ohms at 30 MHz, at least 190 ohms at 100 MHz and / or at least 241 ohms at 200 MHz.

7. The inductor as claimed in any one of claims 1 to 4, wherein, All signal lines extend through the same single opening in the magnetic core, thereby enabling the inductor to operate to suppress all common-mode noise via a single magnetic loop, such that differential-mode signals cancel each other out in the single magnetic loop, thus avoiding the risk of magnetic saturation of the magnetic core.

8. The inductor as claimed in any one of claims 1 to 4, wherein, The inductor includes ten signal lines extending through the same single opening in the magnetic core, thereby enabling the inductor to operate to suppress all common-mode noise by means of a single magnetic loop, such that differential-mode signals cancel each other out in the single magnetic loop, thereby avoiding the risk of magnetic saturation of the magnetic core.

9. The inductor as claimed in any one of claims 1 to 4, wherein: The first and second ends of the pins are bent into an "L" shape, thereby defining a surface mount technology (SMT) pattern; each pin includes an intermediate portion extending between the first and second L-shaped ends; and the pins are partially embedded within the plurality of dielectric members to perform the following operations: maintain pin spacing without deformation; maintain sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric members; provide accurate SMT patterning; and maintain good coplanarity.

10. The inductor as claimed in any one of claims 1 to 4, wherein, The plurality of dielectric components comprise injection-molded plastic, and the leads are partially embedded in the injection-molded plastic to perform the following operations: maintain lead spacing without deformation; maintain sufficient distance between the leads to provide insulation between the leads by means of air between the leads and the plurality of dielectric components; provide accurate SMT board patterning; and maintain good coplanarity.

11. The inductor as claimed in any one of claims 1 to 4, wherein, The pin has an overall gull-shaped or wing-shaped profile; and the pin includes stamped phosphor bronze wire with a rectangular cross-sectional profile.

12. The inductor as claimed in any one of claims 1 to 4, wherein, The magnetic core comprises a single-piece, monolithic, or single-component structure with perfect magnetic circuitry and characteristics.

13. The inductor as claimed in any one of claims 1 to 4, wherein, The magnetic core includes a first magnetic core component and a second magnetic core component, which are joined together to form the magnetic core.

14. The inductor as claimed in any one of claims 1 to 4, wherein: The first and second ends of the pins include opposing first and second L-shaped ends between straight intermediate portions, the first and second L-shaped ends cooperatively defining an overall gull or wing shape and defining a surface mount technology (SMT) pattern; and the plurality of dielectric members comprise injection-molded plastic, the pins being partially embedded in the injection-molded plastic such that the opposing first and second L-shaped ends of the pins are exposed and not embedded in the injection-molded plastic, thereby partially embedding the pins in the injection-molded plastic to maintain pin spacing without deformation, maintaining sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric members, providing accurate SMT patterning and maintaining good coplanarity.

15. The inductor as claimed in any one of claims 1 to 4, wherein, The inductor is configured to be used in a Power over Ethernet (PoE) system.

16. A Power over Ethernet (PoE) system comprising an inductor as described in any one of claims 1 to 15.

17. An inductor, the inductor comprising: A magnetic core, the magnetic core including opposing first and second sides, the magnetic core defining an opening extending from the first side through the magnetic core to the second side; and signal lines extending through the opening in the magnetic core; wherein the signal lines include pins partially embedded within a plurality of dielectric members spaced apart from each other along the pins, such that a first end and a second end of the pins are exposed and not embedded within the plurality of dielectric members, and defining a surface mount technology (SMT) pattern, whereby the plurality of dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation, maintaining sufficient distance between the pins such that insulation between the pins is provided by the air between the pins and by the plurality of dielectric members, providing accurate SMT patterning, and maintaining good coplanarity; wherein: the plurality of dielectric members include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the pins; the first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head; the pins are partially embedded within the dielectric head, the first dielectric body, and the second dielectric body, such that: The first end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, and the first end extends outward beyond the first dielectric body in a direction away from the dielectric head; and the second end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, and the second end extends outward beyond the second dielectric body in a direction away from the dielectric head.

18. The inductor as claimed in claim 17, wherein, The pin is configured to increase the length of the electrical path through the magnetic core defined by the pin, thereby improving the impedance performance of the inductor.

19. The inductor as claimed in claim 17, wherein, The inductor is configured to have an impedance of at least 133 ohms at 30 MHz, at least 190 ohms at 100 MHz and / or at least 241 ohms at 200 MHz.

20. The inductor as claimed in claim 17, wherein, The magnetic core comprises a single-piece, monolithic, or single-component structure with perfect magnetic circuitry and characteristics.

21. The inductor as claimed in claim 17, wherein, The magnetic core includes a first magnetic core component and a second magnetic core component, which are joined together to form the magnetic core.

22. The inductor as claimed in claim 17, wherein: The dielectric head and the pin are bent by a jig to cooperatively define a U-shape inserted into the opening of the magnetic core; the first and second ends of the pin are bent by a roll forming process; the first and second dielectric bodies are joined along a second side of the magnetic core by epoxy resin or adhesive; and the first and second portions of the pin are formed by a single stamping process, thereby providing the pin with a gull or wing shape and helping to ensure solder coplanarity.

23. The inductor as claimed in any one of claims 17 to 22, wherein: The first and second ends of the pins include opposing first and second L-shaped ends between straight intermediate portions, the first and second L-shaped ends cooperatively defining an overall gull or wing shape and defining a surface mount technology (SMT) pattern; and the plurality of dielectric members comprise injection-molded plastic, wherein the pins are partially embedded in the injection-molded plastic such that the opposing first and second L-shaped ends of the pins are exposed and not embedded in the injection-molded plastic, thereby partially embedding the pins in the injection-molded plastic to maintain pin spacing without deformation, maintaining sufficient distance between the pins to provide insulation between the pins by means of air between the pins and the plurality of dielectric members, providing accurate SMT patterning, and maintaining good coplanarity.

24. An inductor, the inductor comprising: A magnetic core, the magnetic core including opposing first and second sides, the magnetic core defining an opening extending from the first side through the magnetic core to the second side; and a signal line extending through the opening in the magnetic core; wherein the signal line includes pins configured to increase the length of the electrical path through the magnetic core defined by the pins, thereby improving the impedance performance of the inductor.

25. The inductor as claimed in claim 24, wherein, The inductor is configured to have an impedance of at least 133 ohms at 30 MHz, at least 190 ohms at 100 MHz and / or at least 241 ohms at 200 MHz.

26. The inductor as claimed in claim 24 or 25, wherein, The pins are partially embedded within one or more dielectric components, such that a first end and a second end of the pins are exposed and not embedded within the one or more dielectric components, and define a surface mount technology (SMT) board pattern.

27. The inductor as claimed in claim 26, wherein, The one or more dielectric members are configured to hold the pins in place, thereby helping to maintain pin spacing without deformation, maintaining sufficient distance between the pins such that insulation between the pins is provided by the air between the pins and by the one or more dielectric members, providing accurate SMT board patterning and maintaining good coplanarity.

28. The inductor as claimed in claim 26, wherein: The one or more dielectric components include a dielectric head, a first dielectric body, and a second dielectric body spaced apart from each other along the pin; the first dielectric body and the second dielectric body are spaced apart from a first side and a second side opposite to the dielectric head; the pin is partially embedded in the dielectric head, the first dielectric body, and the second dielectric body such that: a first end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the first end extending outward beyond the first dielectric body in a direction away from the dielectric head; and a second end of the pin is exposed and not embedded in the dielectric head, the first dielectric body, and the second dielectric body, the second end extending outward beyond the second dielectric body in a direction away from the dielectric head.

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