Package structure

Abstract

This invention provides a packaging structure comprising a packaging substrate and a redistribution layer on the packaging substrate. The redistribution layer includes a patterned metal layer and an insulating layer on the patterned metal layer. The patterned metal layer includes a plurality of patterned lines, each of which has at least one groove. A portion of the insulating layer fills the at least one groove.

Description

Packaging structure PACKAGE STRUCTURE Technical Field

[0001] This invention relates to a packaging structure, and more particularly to a packaging structure having better interface strength between a metal layer and an insulating layer. Prior Technology

[0002] A power module is a package that houses multiple electronic components (such as power semiconductors). Power modules are primarily used in automotive applications. For automotive power modules, safety and reliability are particularly important testing factors. Based on past experience, reliability failures often occur at the bonding materials.

[0003] Furthermore, the high power requirements of voltage regulator modules (VRMs) typically necessitate increased line width, but due to overall height limitations, the structural thickness cannot be increased. Therefore, the only solution is to increase the area ratio of the copper layer. During manufacturing processes or reliability testing, the mechanical load on the solder balls can easily cause the metal layer to delaminate from the insulating layer around the solder ball pads.

[0004] In view of this, there is an urgent need to provide a packaging structure to improve the delamination problem between the metal layer and the insulating layer. Summary of the Invention

[0005] One aspect of this invention is to provide a packaging structure in which the interface strength is increased by partially filling the grooves of the patterned metal layer with the insulating layer, thereby improving the delamination problem between the metal layer and the insulating layer.

[0006] According to one aspect of the present invention, a packaging structure is provided, comprising a packaging substrate and a redistribution layer on the packaging substrate. The redistribution layer includes a patterned metal layer and an insulating layer on the patterned metal layer. The patterned metal layer includes a plurality of patterned lines, each of which has at least one groove. A portion of the insulating layer fills the at least one groove.

[0007] According to one embodiment of the present invention, each of the above-mentioned patterned circuits includes a main body, an extension, and a wiring portion.

[0008] According to one embodiment of the present invention, the extension of each of the above-mentioned patterned lines gradually tapers from the main body towards the wiring portion.

[0009] According to one embodiment of the present invention, at least one of the grooves is located in the main body.

[0010] According to one embodiment of the present invention, at least one of the grooves is located in the extension.

[0011] According to one embodiment of the present invention, the above-described packaging structure further includes a plurality of pads located on the insulating layer, wherein the pads are respectively connected to the body portion of each of the patterned lines.

[0012] According to one embodiment of the present invention, at least one of the grooves completely penetrates the patterned metal layer.

[0013] According to one embodiment of the present invention, at least one of the grooves does not completely penetrate the patterned metal layer.

[0014] According to one embodiment of the present invention, the at least one groove includes at least one first groove, wherein the at least one first groove is recessed from the upper surface of the patterned metal layer; and at least one second groove, wherein the at least one second groove is recessed from the lower surface of the patterned metal layer.

[0015] According to one embodiment of the present invention, the at least one first groove and the at least one second groove are aligned or misaligned.

[0016] The application of this novel packaging structure can increase interface strength and improve the delamination problem between the metal layer and the insulating layer by partially filling the grooves of the patterned metal layer with the insulating layer, thereby improving the reliability and safety of the product. Simple Explanation of the Diagram

[0017] A better understanding of the present invention will be achieved by referring to the following detailed description and accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, for clarity of discussion, the dimensions of many features can be arbitrarily scaled. [Figure 1] is a cross-sectional view of a portion of a conventional packaging structure. [Figure 2A] is a cross-sectional view illustrating the packaging structure according to some embodiments of the present invention. [Figure 2B] is a cross-sectional view of a portion of the packaging structure according to Figure 2A. [Figure 3A] and [Figure 3B] are top views illustrating patterned circuits according to some embodiments of the present invention. Implementation

[0018] Numerous different embodiments or illustrations are provided below to implement various features of the novel. The specific examples of components and arrangements described below are for the purpose of simplifying this disclosure. These are, of course, merely illustrative and are not intended to be limiting. For example, the dimensions of the elements are not limited to the range or values ​​disclosed, but depend on the desired characteristics of the device. Furthermore, the description of a first feature being formed on or above a second feature includes embodiments where the first and second features are in direct contact, as well as embodiments where other features are formed between the first and second features such that the first and second features are not in direct contact. In addition, reference values ​​and / or letters are repeated in various specific examples. This repetition is intended to simplify and clarify the description and does not imply a relationship between the various discussed embodiments and / or configurations.

[0019] Furthermore, spatial relativity terms, such as "beneath," "below," "lower," "above," and "upper," are used to easily describe the relationship between an element or feature depicted in a diagram and other elements or features. In addition to the directions depicted in the diagram, spatial relativity terms also include the different orientations of the elements during use or operation. A device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relativity descriptions used in this article can also be interpreted in this way.

[0020] Please refer to Figure 1, which is a cross-sectional view of a portion of a conventional package structure. The conventional package structure includes a metal layer 110, an insulating layer 120, a gasket 130, and solder balls 140. During application, the load generated after temperature cycling in the conventional package structure will cause a shear load on the metal layer 110 and the insulating layer 120, resulting in delamination of the metal layer 110 and the insulating layer 120 at the bonding surface 110A.

[0021] Therefore, as described above, this invention provides a packaging structure that increases interface strength and improves the delamination problem between the metal layer and the insulating layer by partially filling the grooves of the patterned metal layer with the insulating layer, thereby enhancing the reliability and safety of the product.

[0022] Please refer to Figures 2A and 2B. Figure 2A is a cross-sectional view of a package structure 200 according to some embodiments of the present invention, and Figure 2B is a cross-sectional view of the framed portion A1 of the package structure 200 according to Figure 2A. The package structure 200 includes a package substrate 201 and a redistribution layer (RDL) 205. In some embodiments, the package substrate 201 includes electronic components 203. The redistribution layer 205 is located on the package substrate 201 and includes a patterned metal layer 210A, a patterned metal layer 210B, an insulating layer 220A, an insulating layer 220B, and an insulating layer 220C. It should be understood that the redistribution layer 205 comprises an alternating stack of multiple patterned metal layers (e.g., patterned metal layers 210A and 210B) and multiple insulating layers (e.g., insulating layers 220A, 220B, and 220C), the number of which can be adjusted according to application requirements, and this invention is not limited thereto. The package structure 200 also includes a pad 230 and a solder ball 240 located on the insulating layer 220A, wherein the pad 230 electrically connects the patterned metal layer 210A and the solder ball 240.

[0023] As shown in Figure 2A, insulating layer 220A is located on patterned metal layer 210A, patterned metal layer 210A is located on insulating layer 220B, insulating layer 220B is located on patterned metal layer 210B, and patterned metal layer 210B is located on insulating layer 220C. Please refer to Figures 2A and 2B simultaneously. Patterned metal layer 210A has a groove that completely penetrates the patterned metal layer 210A, such that a portion 220R1 of insulating layer 220A fills the groove of patterned metal layer 210A and is connected to insulating layer 220B. Similarly, patterned metal layer 210B has a groove, and a portion 220R2 of insulating layer 220B fills the groove of patterned metal layer 210B and is connected to insulating layer 220C. This can improve the interfacial strength between the layers in the redistribution layer 205, so as to avoid delamination at the interface where the patterned metal layer 210A, patterned metal layer 210B, insulating layer 220A, insulating layer 220B and insulating layer 220C are joined together, thereby improving the reliability of the package structure 200.

[0024] In other embodiments, the grooves in the patterned metal layer do not completely penetrate the patterned metal layer, so the upper insulating layer still fills the grooves but is not connected to the lower insulating layer. In some embodiments, the grooves in the patterned metal layer include a first groove recessed from the upper surface of the patterned metal layer and a second groove recessed from the lower surface of the patterned metal layer. In this embodiment, the first groove and the second groove may be aligned or misaligned.

[0025] In some embodiments, the patterned metal layer 210A and / or patterned metal layer 210B of the package structure 200 includes a plurality of patterned lines. In some embodiments, the patterned lines have a teardrop shape and grooves. Please refer to Figures 3A and 3B, which are top views illustrating patterned lines 301 and 303 according to some embodiments of the present invention, respectively. Patterned lines 301 and 303 each include a main body portion 310, an extension portion 320, and a trace portion 330, wherein the extension portion 320 connects the main body portion 310 and the trace portion 330. In some embodiments, the main body portion 310 is circular, and the extension portion 320 is tapered. In some embodiments, the extension portion 320 tapers from the main body portion 310 toward the trace portion 330.

[0026] In some embodiments, the maximum cross-sectional area of ​​the main body portion 310 of the patterned circuit 301 and patterned circuit 303 is 2 to 3 times the cross-sectional area of ​​the trace portion 330. In some embodiments, the cross-sectional area of ​​the extension portion 320 of the patterned circuit 301 is 1 to less than 3 times the cross-sectional area of ​​the trace portion 330. This configuration avoids excessive changes in cross-sectional area, thereby preventing excessively high impedance.

[0027] The grooves in the patterned circuit have no limitations on shape or number and can be adjusted according to application requirements. For example, the grooves can be arc-shaped. In some embodiments, as shown in FIG3A, the patterned circuit 301 has a groove R1 located in the extension 320. In other embodiments, as shown in FIG3B, the patterned circuit 303 has a plurality of grooves R2 located in the main body 310, wherein the grooves R2 are arranged at fixed intervals.

[0028] Please refer to Figures 2B and 3A (or 3B) at the same time. In some embodiments, the pad 230 located on the insulating layer 220A is the main body 310 of the patterned line 301 (or patterned line 303) of the patterned metal layer 210A.

[0029] Based on the above, the packaging structure provided by this invention increases the interface strength and improves the delamination problem between the metal layer and the insulating layer by partially filling the groove of the patterned metal layer with the insulating layer, thereby improving the reliability and safety of the product.

[0030] Although the present invention has been disclosed above with reference to several embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the art to which the present invention pertains may make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0031] 110: Metal layer 110A: Continuing from the next step 120: Insulation layer 130: Padding 140: Welding ball 200: Package structure 201: Packaging substrate 203: Electronic Components 205: Rewire Layer 210A, 210B: Patterned metal layers 220A, 220B, 220C: Insulation layer 220R1, 220R2: Partial 230: Padding 240: Welding ball 301, 303: Patterned circuits 310: Main body 320: Extension 330: Wiring Section A1: Border Section R1, R2: Grooves

Claims

1. A packaging structure comprising: a packaging substrate; a redistribution layer on the packaging substrate, wherein the redistribution layer comprises: a patterned metal layer comprising a plurality of patterned lines, wherein each of the patterned lines has at least one recess; and an insulating layer on the patterned metal layer, wherein a portion of the insulating layer fills the at least one recess.

2. The packaging structure as described in claim 1, wherein each of the patterned circuits includes a body portion, an extension portion, and a trace portion.

3. The packaging structure as described in claim 2, wherein the extension of each of the patterned lines tapers from the body portion toward the trace portion.

4. The packaging structure as described in claim 2, wherein the at least one recess is located in the body portion.

5. The packaging structure as described in claim 2, wherein the at least one recess is located in the extension.

6. The packaging structure as described in claim 2 further comprises: a plurality of pads located on the insulating layer, wherein the pads are respectively connected to the body portion of each of the patterned lines.

7. The packaging structure as described in claim 1, wherein the at least one groove completely penetrates the patterned metal layer.

8. The packaging structure as described in claim 1, wherein the at least one groove does not completely penetrate the patterned metal layer.

9. The packaging structure as claimed in claim 8, wherein the at least one recess comprises: at least one first recess, wherein the at least one first recess is recessed from an upper surface of one of the patterned metal layers; and at least one second recess, wherein the at least one second recess is recessed from a lower surface of one of the patterned metal layers.

10. The packaging structure as described in claim 9, wherein the at least one first recess and the at least one second recess are aligned or misaligned.

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