microchannel structure

Abstract

A microchannel structure includes an upper cover, a heat dissipation assembly, and a lower base plate. The main function is that the coolant first enters the accommodating space of the upper cover through the inlet pipe, and flows through the microchannels between the plurality of heat dissipation particles of the heat dissipation assembly, so as to remove the heat energy adsorbed by the coolant through the heat dissipation particles. Finally, the coolant is discharged from the outlet pipe of the upper cover, thereby achieving the purpose of heat dissipation.

Description

Microchannel structure Technical Field

[0001] This work relates to a microchannel structure, particularly a microchannel structure that significantly improves heat dissipation. Prior Technology

[0002] Many devices or instruments generate extremely high temperatures during operation. To eliminate these high temperatures and ensure smooth operation while preventing damage, they are typically equipped with liquid-cooled heat dissipation modules. Common heat dissipation module types include grooved flow channels, CNC machined flow channels, and skewered fins. While these types of heat dissipation modules can achieve varying degrees of heat dissipation, their limited contact area with the coolant and the restriction of unidirectional or multi-directional flow of the coolant prevent optimal heat dissipation. Therefore, addressing these shortcomings is the technical challenge that the creators of this invention aim to overcome. Summary of the Invention

[0003] The main purpose of this invention is as follows: It is mainly composed of an upper cover, a heat dissipation assembly, and a lower base plate. The coolant first enters the housing space of the upper cover through the inlet pipe and flows through the tiny channels between the multiple heat dissipation particles of the heat dissipation assembly. The heat energy adsorbed by the coolant is carried away by these heat dissipation particles. Finally, the coolant is discharged from the outlet pipe of the upper cover, thereby achieving the purpose of heat dissipation.

[0004] To achieve the above objectives, the accommodating space of the upper cover is connected to the inlet and outlet pipes.

[0005] To achieve the above objectives, the upper cover is made of copper.

[0006] To achieve the above objectives, the heat dissipation assembly has multiple micro-channels between its multiple heat dissipation particles.

[0007] To achieve the above objectives, the heat dissipation assembly is made of copper.

[0008] To achieve the above objectives, the lower base plate is integrated with the heat dissipation assembly.

[0009] To achieve the above objectives, the bottom plate is made of copper. Simple Explanation of the Diagram

[0010]

[0011] The first image is a 3D view of this creation.

[0012] The second image is a three-dimensional exploded view of this work.

[0013] Figure 3 is a partial illustration of this work.

[0014] Figure 4 is a cross-sectional view of this work.

[0015] Figure 5 is a schematic diagram of a preferred embodiment of this invention.

[0016] Figure 6 is a schematic diagram of a preferred embodiment of this invention. Implementation

[0017] Please refer to Figures 1, 2, 3, 4, 5, and 6, which are perspective views, exploded perspective views, partial schematic diagrams, sectional views, and schematic diagrams of preferred embodiments of this invention. As can be clearly seen from the figures, the microchannel module 1 of this invention mainly includes:

[0018] A top cover 2 has a receiving space 20 at its bottom and at least one inlet pipe 21 and at least one outlet pipe 22 respectively provided on two corresponding sides;

[0019] A heat dissipation assembly 3 is disposed within the accommodating space 20 of the upper cover 2, and the heat dissipation assembly 3 is composed of a plurality of heat dissipation particles 31;

[0020] A bottom plate 4 is positioned below the upper cover 2 and covers the accommodating space 20 of the upper cover 2;

[0021] The accommodating space 20 of the upper cover 2 is connected to the inlet pipe 21 and the outlet pipe 22.

[0022] The upper cover 2 is made of copper.

[0023] Among them, the plurality of heat dissipation particles 31 in heat dissipation group 3 have a plurality of micro-channels 32;

[0024] Among them, heat dissipation unit 3 is made of copper;

[0025] The bottom plate 4 is integrated with the heat dissipation assembly 3;

[0026] The bottom plate 4 is made of copper.

[0027] When in use, the microfluidic module 1 of this invention primarily guides the coolant 5, which has absorbed heat from the equipment or instrument, to the inlet pipe 21 of the upper cover 2. The coolant 5 then enters the accommodating space 20 of the upper cover 2 through the inlet pipe 21. At this point, the coolant 5 flows through the microchannels 32 between the plurality of heat dissipation particles 31 of the heat dissipation assembly 3, contacting the surface of each heat dissipation particle 31. In this way, the heat dissipation particles 31 can carry away the heat absorbed by the coolant 5 and conduct the heat to the lower base plate 4. Finally, the coolant 5 is discharged from the outlet pipe 22 of the upper cover 2. This cycle achieves the purpose of heat dissipation.

[0028] As mentioned above, the reason why the heat dissipation assembly 3 is composed of a plurality of heat dissipation particles 31 is mainly because the heat dissipation particles 31 have a non-planar three-dimensional contact area. In addition to significantly increasing the contact area compared with conventional grooved flow channels, CNC machined flow channels, or blade-cut heat sinks, the plurality of heat dissipation particles 31 also have irregular gaps between them, creating many micro channels 32. Therefore, the coolant 5 can flow through and fill these micro channels 32, thus greatly improving the overall heat dissipation effect.

[0029] Furthermore, conventional methods such as grooved flow channels, CNC machined flow channels, or blade-cut heat sinks only allow for unidirectional or planar multidirectional flow, resulting in some coolant 5 failing to exchange heat due to lack of contact. In contrast, the microchannel module 1 of this invention, with its heat dissipation assembly 3 composed of multiple heat dissipation particles 31, can create three-dimensional flow through multiple microchannels 32 without any specific directional restrictions, thus significantly improving the overall heat dissipation efficiency.

[0030] In summary, compared to traditional heat dissipation methods such as grooved flow channels, CNC machined flow channels, or blade-cut heat sinks, which have various shortcomings and cannot achieve optimal heat dissipation effects, the microchannel module 1 of this invention, through the special design of an upper cover 2, a heat dissipation assembly 3, and a lower base plate 4, allows the coolant 5 to pass through the microchannels 32 formed by the multiple heat dissipation particles 31 of the heat dissipation assembly 3, thereby increasing the contact area and three-dimensional flow and significantly improving the overall heat dissipation effect.

[0031] The embodiments listed above are intended to illustrate one preferred embodiment of the present invention and are not intended to limit the scope of the present invention. Anyone skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0032]

[0033] 1: Microchannel module

[0034] 2: Upper cover

[0035] 20: Storage space

[0036] 21: Inlet pipe

[0037] 22: Export Pipeline

[0038] 3: Heat dissipation assembly

[0039] 31: Heat dissipation particles

[0040] 32: Microchannel

[0041] 4: Bottom plate

[0042] 5: Coolant

Claims

1. A microchannel structure comprising: A top cover has a receiving space at its bottom and at least one inlet pipe and at least one outlet pipe respectively provided on two corresponding sides; A heat dissipation unit is disposed within the accommodating space of the upper cover, and the heat dissipation unit is composed of a plurality of heat dissipation particles; a bottom plate is disposed below the upper cover and covers the accommodating space of the upper cover.

2. The microchannel structure as described in claim 1, wherein the accommodating space of the upper cover is in communication with the inlet pipe and the outlet pipe.

3. The microchannel structure as described in claim 1, wherein the upper cover is made of copper.

4. The microchannel structure as described in claim 1, wherein the plurality of heat dissipation particles of the heat dissipation assembly have a plurality of microchannels.

5. The microchannel structure as described in claim 1, wherein the heat dissipation assembly is made of copper.

6. The microchannel structure as described in claim 1, wherein the lower base plate is integrated with a heat dissipation assembly.

7. The microchannel structure as described in claim 1, wherein the bottom plate is made of copper.

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