A semiconductor tray handling system

Abstract

This application relates to a semiconductor pallet handling system, including a depalletizer and a stacker located at opposite ends of the pallet handling system; a pallet exchange station located between the depalletizer and the stacker; a transfer table for transporting new pallets from the pallet exchange station to a functional station for processing and returning processed pallets to the pallet exchange station; a pushing mechanism for pushing a new pallet from the depalletizer to the pallet exchange station while simultaneously pushing a processed pallet from the pallet exchange station to the stacker; the pushing mechanism includes a pushing arm for engaging with a new pallet, a slider connected by a belt and pulleys; and a clamping mechanism disposed on the transfer table for clamping and flattening the new pallet or the processed pallet on the transfer table. This application shortens pallet changeover time by employing a synchronous dual pallet changing mechanism, while also preventing pallet warping.

Description

Semiconductor pallet handling system A SEMICONDUCTOR TRAY HANDLING SYSTEM Technical Field

[0001] This application relates to a semiconductor pallet handling system, and more specifically, to a system for transferring and placing semiconductor pallets. Prior Technology

[0002] In semiconductor manufacturing, JEDEC (Joint Electron Device Engineering Committee) pallets are widely used to house and protect electronic components such as integrated circuits during storage, transportation, and automated processing stages including testing, inspection, picking, finishing, and sorting. These pallets are handled by specialized equipment such as pallet feeders or loaders, which are crucial for ensuring efficient and reliable movement of components in high-volume production lines. With the continued growth in global demand for electronic components, the speed and accuracy of pallet handling systems have become critical to meeting industry requirements while maintaining component integrity and minimizing production downtime.

[0003] Traditional JEDEC pallet handling systems face significant challenges hindering their efficiency. A major problem is the excessively long pallet changeover time in conventional pallet feeders. These systems typically employ a sequential process: a transfer table equipped with a Z-axis actuator unloads a new pallet, moves it to a function station for processing, then stacks empty pallets, and finally retrieves a new pallet. This sequential operation generates idle time, significantly slowing down the overall processing cycle and limiting throughput. Another key challenge is the warping of JEDEC pallets, caused by the deformation of plastic pallets due to environmental factors such as heat. Warped pallets interfere with testing or picking processes, as function stations require flat pallet surfaces for accurate handling. Common solutions (such as pneumatic clamping or pre-screening of warped pallets) are either ineffective for severely warped pallets or inefficient, as they increase quality control requirements and waste resources.

[0004] To address these inefficiencies, advanced pallet handling systems are needed to enable faster pallet changes and reliable handling of warped pallets. Several publicly available pallet handling solutions are as follows:

[0005] Chinese Patent Publication No. CN103449025A discloses a tray fixing clamp for semiconductor components. The tray fixing clamp includes a flat base with C-shaped clamping rods on both sides for clamping the tray. Each C-shaped clamping rod has a spring on its inner top side, and a groove is formed at the connection between the flat base and each C-shaped clamping rod. This tray fixing clamp prevents the tray from bending during multi-layer stacking, thus avoiding damage or scattering of components.

[0006] Chinese Patent Publication No. CN111422603A discloses a pallet moving mechanism and a loading / unloading device. The pallet moving mechanism has two pallet clamping elements sequentially arranged along its length on a linear guide slide. Driven by the linear guide slide, the two pallet clamping elements move between different workstations, simultaneously clamping or releasing pallets at different workstations. When an external mechanism processes a pallet at a certain workstation, the pallet moving mechanism can simultaneously operate on other pallets, effectively saving time, ensuring all pallets are properly processed, and avoiding project delays.

[0007] US Patent Application Publication No. US2009035119A1 discloses a tray rack for multi-step storage trays. A tray containing electronic components, after inspection, is received into the rack. An empty tray, emptied of electronic components before inspection, is stacked on a tray stacker above the tray rack. When a tray is filled with electronic components after inspection and is sent out, an empty tray is removed from the tray stacker and placed into the tray delivery rack so that the empty tray can be reused.

[0008] The systems disclosed in the related technologies do not completely solve the problems of excessively long pallet changeover times and warped pallet handling in a way that meets the needs of modern semiconductor manufacturing. There is still a need for an automated pallet handling system that can achieve rapid pallet changeover, reliably handle warped pallets, and integrate cost-effective devices to improve throughput and operational efficiency. Summary of the Invention

[0009] This application relates to a semiconductor pallet handling system for transferring and placing semiconductor pallets, comprising: a depalletizer located at one end of the pallet handling system for receiving and stacking one or more new pallets;

[0010] A stacker crane, located at the other end of the pallet handling system and opposite to the depalletizer, is used to receive and stack one or more processed pallets;

[0011] A pallet exchange station, located between the depalletizer and the stacker, is used to provide exchange space for new pallets and processed pallets.

[0012] A transfer station is used to transport the new pallet from the pallet exchange station to a functional station for processing, and to return the processed pallet to the pallet exchange station.

[0013] A pushing mechanism is provided for pushing a new pallet from the depalletizer to the pallet exchange station, and simultaneously pushing the processed pallet from the pallet exchange station to the stacker; the pushing mechanism includes a pushing arm for engaging the new pallet, and a slider connected by a belt and pulleys, the slider being used to move the new pallet and the processed pallet along a path toward the pallet exchange station and the stacker;

[0014] The transfer stage is movable in multiple directions; and

[0015] A clamping mechanism is provided on the transfer table, the clamping mechanism comprising multiple clamps driven by a single actuator for clamping and flattening the new pallet or the processed pallet on the transfer table.

[0016] In one embodiment, the push arm is provided with shock-absorbing material.

[0017] In one embodiment, the shock-absorbing material protrudes from the side of the push arm that contacts the new tray or the processed tray.

[0018] In one embodiment, the damping material is elongated; and / or, the damping material is configured as a rubber material component.

[0019] In one embodiment, four clamps are provided, and the four clamps are arranged in pairs on both sides of the transfer stage; and / or, the transfer stage is movable along the X-axis and Y-axis directions.

[0020] In one embodiment, the clamping mechanism further includes a cam, a second motor, and a connecting shaft. The clamp is also connected to a follower connection. The cam is connected to the second motor via the connecting shaft and interacts with the follower connection. The cam can rotate under the drive of the second motor and drive the clamp to descend via the follower connection, so that the new tray is flattened on the transfer table.

[0021] In one embodiment, the cam is eccentrically connected to the second motor via the connecting shaft.

[0022] In one embodiment, the follower connection portion is provided with a follower connection hole, and the cam is movably mounted in the follower connection hole.

[0023] In one embodiment, the cam has an annular outer peripheral wall, and the length of the follower connection hole is greater than the diameter of the annular outer peripheral wall of the cam, so that the cam can move within the follower connection hole along the length direction of the follower connection hole under the drive of the second motor.

[0024] In one embodiment, the inner peripheral walls at both ends of the follower connection hole are of a slightly curved or semi-circular shape, so that the follower connection hole can fit against at least a portion of the annular outer peripheral wall of the cam.

[0025] The semiconductor pallet handling system provided in this application can shorten pallet replacement time through a synchronous dual pallet changing mechanism, and can also prevent pallet warping during handling, ensuring the smoothness of the handling system and increasing the conveying capacity. Simple Explanation of the Diagram

[0026] Figure 1 is an isometric view of a pallet handling system according to an embodiment of this application. Figure 2 shows a transfer station in the exchange position according to an embodiment of this application. Figure 3 shows a pallet handling system during pallet exchange in one embodiment of this application. Figure 4 shows the pushing mechanism in one embodiment of this application. Figure 5 shows a push arm integrating shock-absorbing material in one embodiment of this application. Figure 6 shows a transfer stage in a functional position according to an embodiment of this application. Figure 7 is a schematic diagram of the position of the clamping mechanism in one embodiment of this application. Figure 8 shows the mechanical components of the clamping mechanism in one embodiment of this application. Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "level", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower level than the second feature.

[0032] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0033] Referring to Figure 1, this application illustrates a pallet handling system 1, which includes a depalletizer 10 located at one end of the pallet handling system 1 for receiving and stacking one or more new pallets 100a; a stacker 20 located at the other end of the pallet handling system 1 and opposite to the depalletizer 10 for receiving and stacking one or more processed pallets 100b; a pallet exchange station 40 located between the depalletizer 10 and the stacker 20 for providing exchange space for new pallets 100a and processed pallets 100b; and a transfer station 30 for transporting new pallets 100a from the pallet exchange station 40 to a functional station 50 for processing and returning processed pallets 100b to the pallet exchange station 40.

[0034] New tray 100a refers to an unprocessed semiconductor tray, each slot of which can hold semiconductors; while processed tray 100b refers to a semiconductor tray that has been processed at function station 50, which may be empty after the semiconductors at function station 50 have been picked up. Specifically, both new trays and processed trays are standard trays of the Joint Electronic Devices Engineering Committee (JEDEC).

[0035] Referring to Figures 2 and 3, the transfer station 30 is located at the exchange position of the pallet exchange station 40. During the exchange process, the transfer station 30 is aligned with the depalletizer 10 and the stacker 20 so that pallet exchange between the processed pallet 100b and the new pallet 100a can be performed simultaneously. It should be understood that the pallet exchange station 40 defines a space that accommodates the transfer station 30, forming a continuous path from the depalletizer 10 to the stacker 20. The transfer station 30 carries the processed pallet 100b, which has been processed at the function station 50, and positions it near the new pallet 100a on the depalletizer 10. The push arm 61 of the push mechanism 60 shown in Figure 4 pushes a new pallet 100a from the bottom of the stack from the depalletizer 10 to the pallet exchange station 40, while simultaneously pushing the processed pallet 100b from the pallet exchange station 40 to the stacker 20. This is crucial for system efficiency because it enables rapid pallet exchange in a single movement, with the exchange time controlled within 3-5 seconds.

[0036] Figure 4 illustrates a pushing mechanism 60 according to an embodiment of this application. The pushing mechanism 60 includes a pushing arm 61 for engaging a new pallet 100a and a slider 62 for moving the new pallet 100a and the processed pallet 100b along a path toward the pallet exchange station 40 and the stacker crane 20. The slider 62 is disposed on an elongated track on one side of the path. A belt 63 and a pulley 64 are connected to the slider 62 for driving its movement. The pushing mechanism is powered by a first motor 65.

[0037] In some embodiments, FIG. 5 illustrates a push arm 61 integrated with damping material 61a. The push arm 61 is configured with damping material 61a. This damping material 61a is specifically selected to prevent electronic components from falling out of the tray slots in the tray handling system 1. The flexible properties of the damping material 61a reduce vibrations and shocks generated by high-speed operation, thereby maintaining component alignment and product integrity. Furthermore, the push mechanism 60 requires software control to ensure that tray exchanges can be successfully completed in a short time without causing semiconductor components to shift out of the tray slots.

[0038] Referring to Figure 5, in one embodiment, shock-absorbing material 61a protrudes from the side of the push arm 61 that contacts the new pallet 100a or the processed pallet 100b. This allows the shock-absorbing material 61a to contact the new pallet 100a or the processed pallet 100b, reducing the impact on the new pallet 100a or the processed pallet 100b and preventing damage to it.

[0039] Referring to Figure 5, in one embodiment, the damping material 61a is elongated, which can improve the buffering and damping effect while ensuring the contact area of ​​the push.

[0040] For example, the damping material 61a can be configured as a rubber material. In other embodiments, the shape of the damping material 61a is not limited, and it can also be square, triangular, circular, or irregularly shaped. The material of the damping material 61a is also not limited, and it can also be PU foam, pearl cotton, nylon pad, etc.

[0041] In some embodiments, FIG. 6 shows a transfer station 30 in a functional position according to an embodiment of this application. In the functional position, the transfer station 30 carries a new pallet 100a removed from the depalletizer 10 by a pushing mechanism. The transfer station 30 has been moved away from the pallet exchange station 40 and aligned with the functional station 50 configured for component pickup. The transfer station 30 is movable in the longitudinal X-axis and transverse Y-axis directions. The pickup point is fixed in a certain position. The transfer station 30 moves and aligns the slot of the pallet with the pickup position. Once all components in the pallet have been picked up, the transfer station 30 delivers the empty pallet 100b to the pallet exchange station 40 for pallet exchange.

[0042] To prevent the new tray 100a from malfunctioning at the function station 50, the tray needs to be kept flat, as a warped tray will cause the function station 50 to malfunction. To ensure the flatness of the new tray 100a, the transfer table 30 is equipped with a clamping mechanism 70. Figure 7 shows a schematic diagram of the location of the clamping mechanism 70 according to an embodiment of this application. The clamping mechanism 70 includes multiple grippers 71 driven by a single actuator. Exemplarily, four grippers 71 are configured to achieve uniform force distribution, ensure tray flatness, and achieve optimal coverage of the tray. Exemplarily, a second motor 73 is used as a single actuator because it facilitates control of the speed and force of the grippers 71. By keeping the semiconductor tray flat, interference with the operation of the function station 50 can be minimized, reducing errors such as component pick-up failures and invalid tests caused by tray warping.

[0043] For example, referring to Figure 7, in one embodiment, four clamps 71 are placed in pairs on both sides of the transfer table 30.

[0044] Figure 8 illustrates the mechanical components of the clamping mechanism 70 according to an embodiment of this application. The cam 72 converts the rotational motion of the second motor 73 into the translational motion of the clamp 71. The cam 72 is connected to the second motor 73 via a shaft and interacts with a cam link connected to the clamp 71. When the second motor 73 drives the cam 72 to rotate, it causes the cam follower to move vertically, synchronously driving the clamp 71 to descend and flatten the new tray 100a onto the transfer table 30.

[0045] Referring to Figure 8, specifically, in one embodiment, the clamping mechanism 70 further includes a cam 72, a second motor 73, and a connecting shaft. The clamp 71 is also connected to a follower connection 74. The cam 72 is connected to the second motor 73 via the connecting shaft and interacts with the follower connection 74. The cam 72 can rotate under the drive of the second motor 73 and drive the clamp 71 to descend via the follower connection 74, so that the new tray 100a is flattened on the transfer table 30. That is, the cam 72 converts the rotational motion of the second motor 73 into the translational motion of the clamp 71. The cam 72 is connected to the second motor 73 via the connecting shaft and interacts with the follower connection 74 connected to the clamp 71. When the second motor 73 drives the cam 72 to rotate, the cam 72 will drive the follower connection 74 to move vertically, synchronously driving the clamp 71 to descend and flatten the new tray 100a on the transfer table 30.

[0046] In this embodiment, the cam 72 is eccentrically connected to the second motor 73 via a connecting shaft. The eccentric connection enables the cam 72 to move in a ring, thereby acting on the follower connection part 74, so that the clamp 71 can be driven by the follower connection part 74 in the vertical direction.

[0047] The follower connection part 74 is provided with a follower connection hole 741, and the cam 72 is movably mounted in the follower connection hole 741. In one embodiment, the cam 72 has an annular outer peripheral wall, and the hole length of the follower connection hole 741 is greater than the diameter of the annular outer peripheral wall of the cam 72, so that the cam 72 can move within the follower connection hole 741 along the length direction of the hole under the drive of the second motor 73.

[0048] Thus, driven by the second motor 73, since the cam 72 can move within the follower connection hole 741 in the lateral direction, the cam 72 will not exert force on the inner wall of the follower connection hole 741 in the lateral direction, and will not cause the follower connection part 74 to drive the clamp 71 to move along the length of the follower connection hole 741. In other words, the cam 72 will only exert force on the inner wall of the follower connection hole 741 in the vertical direction, causing the follower connection part 74 to drive the clamp 71 to descend or rise.

[0049] It can be understood that the length of the follower connection hole 741 refers to the length of the follower connection hole 741 along the rotation axis perpendicular to the second motor 73 and the lifting direction of the clamp 71. Furthermore, in this embodiment, the follower connection hole 741 passes through the follower connection portion 74 along the rotation axis of the second motor 73, which facilitates the installation of the cam 72.

[0050] Furthermore, the inner peripheral walls at both ends of the follower connection hole 741 are of a slightly curved or semi-circular shape, so that the follower connection hole 741 can fit against at least part of the annular outer peripheral wall of the cam 72. This facilitates the movement of the cam 72 within the follower connection hole 741 and facilitates the contact between the cam 72 and the inner wall of the follower connection hole 741, applying force to the follower connection portion 74 in the vertical direction, thereby driving the clamp 71 to move more stably.

[0051] For example, in this embodiment, the follower connection hole 741 is an elongated hole with semi-circular ends. Specifically, the radius of the annular outer peripheral wall of the cam 72 matches the radius of the semi-circular ends of the elongated hole, allowing the cam 72 to be installed in the follower connection hole 741, and ensuring that the cam 72 can only move within the follower connection hole 741 along the length of the hole.

[0052] During operation, the work cycle of the pallet handling system 1 begins with unloading a new pallet 100a from the depalletizer 10. The pushing mechanism 60 engages with the new pallet 100a via a pushing arm 61 equipped with shock-absorbing material 61a. Assisted by a slider 62, belt 63, and pulley 64, the pushing arm 61 moves the new pallet 100a onto the transfer table 30 in a single motion. Simultaneously, if a processed pallet 100b is present on the transfer table 30, the pushing mechanism 60 pushes it toward the stacker crane 20, completing the exchange.

[0053] The transfer stage 30, carrying the new tray 100a, moves to the function station 50 to position the tray. The function station 50 performs operations on the semiconductor tray, not limited to any particular type of operation. For example, the function station 50 performs component pickup or testing, interacting with components in the new tray 100a. During positioning, the clamping mechanism 70 on the transfer stage 30 is activated to ensure the tray is level. The duration of the clamping mechanism 70 depends on the operation time of the function station 50, because the clamp 71 will only release after the function station 50 has completed its operation. Therefore, the longer the operation time of the function station 50, the longer the clamping time.

[0054] While the new tray 100a is flattened and secured by the clamp 71, the function station 50 processes the components. For example, in a pick-up scenario, the robotic arm removes an integrated circuit from the tray slot for placement or testing. After processing, the transfer table 30 moves the processed tray 100b to the tray exchange station 40 while the clamp 71 is still holding it. Then, the second motor 73 drives the cam 72 to rotate in the reverse direction, causing the clamp 71 to lift and disengage for subsequent tray exchanges.

[0055] At the exchange location, the pusher 60 repeats its action, pushing the processed pallet 100b to the stacker crane 20 while simultaneously moving a new pallet 100a to the transfer table 30. The stacker crane 20 then re-stacks the processed pallets 100a for reuse or storage. This continuous cycle of depalletizing, transferring, processing, and stacking operates seamlessly to increase throughput.

[0056] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

[0058] 1: Pallet handling system 10: Depalletizer 20: Stacker crane 30: Transfer station 40: Pallet Exchange Station 50: Function Station 60: Push Organizations 61: Push arm 61a: Vibration damping material 62: Slider 63: Belt 64: Pulley 65: First motor 70: Clamping mechanism 71: Fixture 72: Cam 73: Second motor 74: Follower connection part 741: Follower connection hole 100a: New tray 100b: Processed pallet

Claims

1. A semiconductor pallet handling system for transferring and placing semiconductor pallets, comprising: A depalletizer, located at one end of the pallet handling system, is used to receive and stack one or more new pallets; A stacker crane, located at the other end of the pallet handling system and opposite to the depalletizer, is used to receive and stack one or more processed pallets; a pallet exchange station, located between the depalletizer and the stacker crane, is used to provide exchange space for the new pallet and the processed pallet; a transfer station is used to transport the new pallet from the pallet exchange station to a functional station for processing and to return the processed pallet to the pallet exchange station; A pushing mechanism for pushing a new pallet from the depalletizer to the pallet exchange station, and simultaneously pushing a processed pallet from the pallet exchange station to the stacker; the pushing mechanism includes a pushing arm for engaging the new pallet, a slider connected by a belt and a pulley, the slider for moving the new pallet and the processed pallet along a path toward the pallet exchange station and the stacker; the transfer table is movable in multiple directions; and a clamping mechanism disposed on the transfer table, the clamping mechanism including a plurality of clamps driven by a single actuator for clamping and flattening the new pallet or the processed pallet on the transfer table.

2. The semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 1, wherein, The push arm is equipped with shock-absorbing material.

3. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 2, wherein, The shock-absorbing material protrudes from the side of the push arm that contacts the new tray or the processed tray.

4. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 3, wherein, The damping material is elongated; and / or, the damping material is configured as a rubber component.

5. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 1, wherein, The fixture is provided in four parts, and the four fixtures are arranged in pairs on both sides of the transfer table; and / or, the transfer table is capable of moving along the X-axis and Y-axis.

6. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 1, wherein, The clamping mechanism further includes a cam, a second motor, and a connecting shaft. The clamp is also connected to a follower connection part. The cam is connected to the second motor through the connecting shaft and interacts with the follower connection part. The cam can rotate under the drive of the second motor and drive the clamp to descend through the follower connection part so that the new tray is flattened on the transfer table.

7. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 6, wherein, The cam is eccentrically connected to the second motor via the connecting shaft.

8. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 6, wherein, The follower connection part is provided with a follower connection hole, and the cam is movably mounted in the follower connection hole.

9. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 8, wherein, The cam has an annular outer peripheral wall, and the length of the follower connection hole is greater than the diameter of the annular outer peripheral wall of the cam, so that the cam can move within the follower connection hole along the length direction of the follower connection hole under the drive of the second motor.

10. A semiconductor pallet handling system for transferring and placing semiconductor pallets as described in claim 9, wherein, The inner peripheral walls at both ends of the follower connection hole are of a slightly curved or semi-circular shape, so that the follower connection hole can fit against at least part of the annular outer peripheral wall of the cam.

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