Passive component embedded carrier board structure

Abstract

A passive component embedded carrier board structure includes a substrate, a plurality of passive components, a plurality of metal pillars, a first insulating layer, and a first circuit layer. The substrate includes an upper surface and a lower surface, and has a plurality of through-holes penetrating both the upper and lower surfaces. Each passive component includes a first surface and a second surface, with at least a plurality of first contacts on the first surface. The first surface of each passive component is embedded in the substrate, and each first contact is exposed on the upper surface of the substrate. The metal pillars are filled in the through-holes. The first insulating layer is located on the upper surface of the substrate and includes a plurality of first openings, each corresponding to a metal pillar and a first contact. The first circuit layer is located on the upper surface of the substrate and is filled in the first openings, connecting to the first contacts and the metal pillars.

Description

Passive component embedded carrier board structure Technical Field

[0001] This work relates to the field of circuit boards, specifically a passive component embedded carrier board structure. Prior Technology

[0002] Electronic products are becoming increasingly thinner and lighter, reducing internal space. However, with the increase in functionality and the number of chips, the circuit stacking density on circuit boards is increasing. This increased density also leads to an increase in the thickness of the circuit boards, creating difficulties in overall design margins, which is a problem that urgently needs to be overcome. Summary of the Invention

[0003] To address the aforementioned issues and reduce the overall substrate thickness, in some embodiments, a passive component embedded substrate structure is provided. The passive component embedded substrate structure includes a substrate, a plurality of passive components, a plurality of metal pillars, a plurality of connecting metal pillars, and a first circuit layer.

[0004] The substrate includes an upper surface and a lower surface, and has a plurality of through holes penetrating the upper and lower surfaces. Each passive component includes a first surface and a second surface, and at least the first surface has a plurality of first contacts. The first surface of each passive component is embedded in the substrate, and each first contact is exposed on the upper surface of the substrate. Metal pillars are filled in the through holes. A first insulating layer is located on the upper surface of the substrate and includes a plurality of first openings, each corresponding to a metal pillar and a first contact. A first circuit layer is located on the upper surface of the substrate and is connected to the first contacts and the metal pillars.

[0005] In some embodiments, the second surface of the passive element is coplanar with the lower surface of the substrate.

[0006] In some embodiments, the second surface of the passive element includes a plurality of second contacts, which are exposed on the lower surface of the substrate.

[0007] More specifically, in some embodiments, the passive component embedded carrier structure further includes a second insulating layer and a second circuit layer, wherein the second insulating layer is located on the upper surface of the substrate, covers the first circuit layer and the first insulating layer, and includes a plurality of second openings, the second openings corresponding to a portion of the first circuit layer, the second circuit layer being located on the first insulating layer, filling the second openings, and being connected to the first circuit layer.

[0008] Furthermore, in some embodiments, the passive component embedded carrier board structure further includes a third insulating layer and a third circuit layer, wherein the third insulating layer is located on the lower surface of the substrate, covers the lower surface of the substrate, and includes a plurality of third openings, the third openings corresponding to the second contacts and metal pillars, the third circuit layer is located on the second insulating layer and fills the third openings, and is connected to the metal pillars and the second contacts.

[0009] Furthermore, the passive component embedded carrier board structure further includes a fourth insulating layer and a fourth circuit layer, wherein the fourth insulating layer covers the third circuit layer and the third insulating layer, and includes a plurality of fourth openings, the fourth openings corresponding to a portion of the third circuit layer, the fourth circuit layer being located on the third insulating layer and filling the fourth openings, and being connected to the third circuit layer.

[0010] More specifically, in some embodiments, the passive component embedded carrier board structure further includes a third insulating layer and a third circuit layer, wherein the third insulating layer is located on the lower surface of the substrate, covers the lower surface of the substrate, and includes a plurality of third openings, the third openings corresponding to the second contacts and metal pillars, the third circuit layer is located on the third insulating layer and fills the third openings, and is connected to the metal pillars and the second contacts.

[0011] In some embodiments, the passive component embedded carrier board structure further includes a second insulating layer and a second circuit layer, wherein the second insulating layer covers the first circuit layer and the first insulating layer, and includes a plurality of second openings, the second openings corresponding to a portion of the first circuit layer, the second circuit layer being located on the first insulating layer, filling the second openings, and being connected to the first circuit layer.

[0012] In some embodiments, the passive element is selected from the group consisting of capacitors, inductors, resistors, and memristors.

[0013] In some embodiments, the substrate is selected from the group consisting of polypropylene, epoxy resin, polyamide, acrylonitrile-butadiene-styrene, and polystyrene.

[0014] As described in the previous embodiments, by embedding passive components through pressing or molding, the passive components are embedded in the substrate, which greatly reduces the overall thickness of the board and significantly improves the design margin of the product. Simple Explanation of the Diagram

[0015] Figure 1 shows a cross-sectional schematic diagram of a first embodiment of a passive component embedded carrier board structure. Figure 2 shows a cross-sectional schematic diagram of a second embodiment of the passive component embedded carrier board structure. Figure 3 shows a cross-sectional schematic diagram of a third embodiment of the passive component embedded carrier board structure. Figure 4 shows a cross-sectional schematic diagram of the fourth embodiment of the passive component embedded carrier board structure. Figure 5 shows a cross-sectional schematic diagram of the fifth embodiment of the passive component embedded carrier board structure. Implementation

[0016] Exemplary embodiments will now be described in detail with reference to the accompanying drawings to facilitate implementation by those skilled in the art. The overall concept of the invention can be embodied in various forms, and is not limited to the exemplary embodiments described herein.

[0017] In the following description, the terms "first," "second," and "third" are used only to distinguish one element, component, region, layer, or part from another, and not to indicate a necessary sequence. Furthermore, relative terms such as "lower" and "upper," "inner" and "outer" may be used herein to describe the relationship between one element and another. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in a figure is flipped, an element described as being "lower" than other elements would be oriented "upper" than other elements. This indicates only a relative orientation, not an absolute one.

[0018] In the accompanying drawings, the widths of some elements, areas, etc., have been enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present.

[0019] Figure 1 illustrates a cross-sectional schematic diagram of a first embodiment of a passive component embedded carrier board structure. As shown in Figure 1, the passive component embedded carrier board structure 1 includes a substrate 10, a plurality of passive components 20, a plurality of metal pillars 25, a first insulating layer 30, and a first circuit layer 40. The substrate 10 includes an upper surface 10A and a lower surface 10B, and the substrate 10 has a plurality of through holes 15 penetrating the upper surface 10A and the lower surface 10B. Each passive component 20 includes a first surface 20A and a second surface 20B, and at least the first surface 20A has a plurality of first contacts 21. The first surface 20A of each passive component 20 is embedded in the substrate 10, and each first contact 21 is exposed on the upper surface 10A of the substrate 10. Here, the substrate 10 can be made of polypropylene, epoxy resin, polyamide, acrylonitrile-butadiene-styrene, or polystyrene sheets or granules. The passive element 20 can be first placed on a removable carrier plate (not shown in the figure), and then laminated or molded to embed the passive element 20 in the substrate 10. The passive element 20 can be a capacitor, inductor, resistor, or memristor, etc. Then, through thinning, the first contact 21 is exposed on the upper surface 10A of the substrate 10.

[0020] Metal pillars 25 are filled into through holes 15. Metal pillars 25 can be pre-placed on a detachable carrier plate before pressing or molding, and then pressed or molded together with the passive component 20 before being embedded in the substrate 10. They are then exposed on the upper surface 10A of the substrate 10 along with the first contact 21 through a thinning process. The substrate 10 and the passive component 20 can be separated from the detachable carrier plate.

[0021] Referring again to Figure 1, in addition to the structure described above, the first insulating layer 30 can also be formed by pressing together after separation from the detachable carrier board, or before separation from the detachable carrier board, and a first opening 35 can be formed on the first insulating layer 30. The first circuit layer 40 is located on the first insulating layer 30 and is filled into the first opening 35, and is connected to the first contact 21 and the metal post 25.

[0022] In this embodiment, the second surface 20B of the passive component 20 is coplanar with the lower surface 10B of the substrate 10. Further, the passive component embedded carrier structure 1 includes a second insulating layer 50 and a second circuit layer 60, wherein the second insulating layer 50 covers the first circuit layer 40 and the first insulating layer 30, and includes a plurality of second openings 55. Each second opening 55 corresponds to a portion of the first circuit layer 40. The second circuit layer 60 is located on the second insulating layer 50 and fills the second openings 55, connecting to the first circuit layer 40. In other words, because this method is fabricated using a detachable carrier board, it can accommodate various specifications and passive components 20, allowing for the design of single-layer or multi-layer circuit structures. The number of circuit layers on the upper surface 10A and lower surface 10B of the substrate 10 can be symmetrical or asymmetrical.

[0023] Figure 2 shows a cross-sectional schematic diagram of a second embodiment of the passive component embedded carrier board structure. Referring also to Figure 1, unlike the first embodiment, the second surface 20B of the passive component 20 in the second embodiment includes a plurality of second contacts 23, which are exposed on the lower surface 10B of the substrate 10.

[0024] Figure 3 illustrates a cross-sectional view of a third embodiment of the passive component embedded carrier board structure. Referring also to Figure 2, unlike the first and second embodiments, the third embodiment further includes a third insulating layer 70 and a third circuit layer 65. The third insulating layer 70 is located on the lower surface 10B of the substrate 10, covering the lower surface 10B of the substrate 10, and includes a plurality of third openings 75. The third openings 75 correspond to the second contacts 23 and the metal pillars 25. The third circuit layer 65 is located on the third insulating layer 70 and fills the third openings 75, connecting with the metal pillars 25 and the second contacts 23. In other words, after completing the structure of Figure 2, it can be separated from the detachable carrier board, and then a layer can be added to the lower surface 10B of the substrate 10 to achieve a double-sided multilayer circuit structure. Compared with the conventional method, since the passive component 20 is embedded in the substrate 10, and the second contacts 23 are exposed on the lower surface 10B of the substrate 10 through thinning, even with the addition of layers, the overall thickness is still thinner than that of the conventional core carrier board.

[0025] Figure 4 illustrates a cross-sectional view of a fourth embodiment of the passive component embedded carrier board structure. As shown in Figure 4, and referring to Figure 3, this embodiment further includes a fourth insulating layer 80 and a fourth circuit layer 67. The fourth insulating layer 80 is located on the lower surface 10B of the substrate 10, covering the third circuit layer 65 and the third insulating layer 70, and includes a plurality of fourth openings 85, each corresponding to a portion of the third circuit layer 65. The fourth circuit layer 67 is located on the fourth insulating layer 80 and fills the fourth openings 85, connecting to the third circuit layer 65. In other words, the fourth embodiment adds layers based on the third embodiment, and the number of circuit layers on the upper surface 10A and lower surface 10B of the substrate 10 is symmetrically designed.

[0026] Figure 5 shows a cross-sectional schematic diagram of a fifth embodiment of the passive component embedded carrier board structure. As shown in Figure 5, and referring to Figures 2 to 4, in the fifth embodiment, the upper surface 10A of the substrate 10 has only a first circuit layer 40, while the structure of the lower surface 10B is the same as in Figure 4. In other words, the number of circuit layers on the lower surface 10B can be higher than that on the upper surface 10A.

[0027] In summary, by embedding the passive component 20 in the substrate 10 through pressing or molding, the overall thickness of the board is greatly reduced, and the design margin of the product is greatly improved.

[0028] Although the technical content of this invention has been disclosed above with reference to preferred embodiments, it is not intended to limit this invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of this invention should be included within the scope of this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

[0029] 1: Passive component embedded carrier board structure 10:Substrate 10A: Top surface 10B: Lower surface 15: Through-hole 20: Passive components 20A: First surface 20B: Second Surface 21: First contact point 23: Second Node 25: Metal Column 30: First insulating layer 35: First Opening 40: First circuit layer 50: Second insulating layer 55: Second opening 60: Second circuit layer 65: Third Circuit Layer 67: Fourth Circuit Layer 70: Third insulation layer 75: Third opening 80: Fourth Insulation Layer 85: Fourth opening

Claims

1. A passive component embedded carrier board structure, comprising: a substrate having an upper surface and a lower surface, the substrate having a plurality of through holes penetrating the upper surface and the lower surface; a plurality of passive components, each passive component having a first surface and a second surface, having at least a plurality of first contacts on the first surface, the first surface of each passive component being embedded in the substrate, and each first contact being exposed on the upper surface of the substrate; a plurality of metal pillars filling the through holes; a first insulating layer located on the upper surface of the substrate, having a plurality of first openings corresponding to the metal pillars and the first contacts respectively; and a first circuit layer located on the upper surface of the first insulating layer and filling the first openings, connected to the first contacts and the metal pillars.

2. The passive component embedded carrier structure as described in claim 1, wherein the second surface of the passive component is coplanar with the lower surface of the substrate.

3. The passive component embedded carrier structure as described in claim 1, wherein the second surface of the passive component includes a plurality of second contacts, the second contacts being exposed on the lower surface of the substrate.

4. The passive component embedded carrier structure as described in claim 3 further includes a second insulating layer and a second circuit layer, wherein the second insulating layer covers the first circuit layer and the first insulating layer, and includes a plurality of second openings corresponding to a portion of the first circuit layer, the second circuit layer being located on the second insulating layer and filling the second openings, and connected to the first circuit layer.

5. The passive component embedded carrier board structure as described in claim 4 further includes a third insulating layer and a third circuit layer, wherein the second insulating layer is located on the lower surface of the substrate, covers the lower surface of the substrate, and includes a plurality of third openings corresponding to the second contacts and the metal pillars, the third circuit layer is located on the third insulating layer and fills the third openings, and is connected to the metal pillars and the second contacts.

6. The passive component embedded carrier structure as described in claim 5 further includes a fourth insulating layer and a fourth circuit layer, wherein the fourth insulating layer covers the third circuit layer and the third insulating layer, and includes a plurality of fourth openings corresponding to a portion of the third circuit layer, the fourth circuit layer being located on the third insulating layer and filling the fourth openings and connected to the third circuit layer.

7. The passive component embedded carrier board structure as described in claim 3 further includes a third insulating layer and a third circuit layer, wherein the third insulating layer is located on the lower surface of the substrate, covers the lower surface of the substrate, and includes a plurality of third openings corresponding to the second contacts and the metal pillars, the third circuit layer is located on the third insulating layer and fills the third openings, and is connected to the metal pillars and the second contacts.

8. The passive component embedded carrier board structure as described in claim 1 further includes a second insulating layer and a second circuit layer, wherein the second insulating layer covers the first circuit layer and the first insulating layer, and includes a plurality of second openings corresponding to a portion of the first circuit layer, the second circuit layer being located on the second insulating layer and filling the second openings and connected to the first circuit layer.

9. The passive component embedded carrier structure as described in claim 1, wherein the passive components are selected from the group consisting of a capacitor, an inductor, a resistor, and a memristor.

10. The passive component embedded carrier structure as described in claim 1, wherein the substrate is selected from the group consisting of polypropylene, epoxy resin, polyamide, acrylonitrile-butadiene-styrene, and polystyrene.

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