Lead frame and light-emitting device

The lead frame design with protruding electrodes and strategic unit arrangement addresses testing and cutting inefficiencies, maximizing metal substrate use and reducing warpage, thereby enhancing the yield and efficiency of light-emitting devices.

TWM685805UActive Publication Date: 2026-08-01WEILIANG TECHNOLOGY HONG KONG CO LTD +1
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Patent Information

Application Number
TW115200281
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2025-09-22
Filing Date
2026-01-09
Publication Date
2026-08-01
Estimated Expiration
2036-01-08

AI Technical Summary

Technical Problem

Existing lead frames face challenges such as small pin size and positioning difficulties, oxidation of metal substrates, low cutting efficiency, and warpage due to deformation of injection molding materials, leading to cumbersome testing and reduced yield in light-emitting devices.

Method used

A lead frame design with protruding electrodes on one side for easy clamping and testing, closely arranged units for efficient utilization of metal substrate, and a design allowing for one-time cutting to form multiple units, with grooves and semi-etched areas for improved bonding and bend capability.

Benefits of technology

Enhances testing convenience, maximizes metal substrate utilization, improves cutting efficiency, and reduces warpage, resulting in higher yield and production efficiency of light-emitting devices.

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Abstract

This invention relates to a lead frame and a light-emitting device. The lead frame includes multiple wafer units disposed on a metal substrate, the multiple wafer units being arranged side by side along a first direction to form a longitudinal wafer strip of the wafer unit; a second connecting portion is provided between adjacent longitudinal wafer strips; each wafer unit includes a metal substrate, the metal substrate extending from both sides along a second direction to form clamping portions. This invention facilitates testing, improves the material utilization rate of the metal substrate, increases the acquisition efficiency of a single unit, and improves the yield of the finished product.
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