Lead frame and light-emitting device

TWM685805UActive Publication Date: 2026-08-01WEILIANG TECHNOLOGY HONG KONG CO LTD +1
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
WEILIANG TECHNOLOGY HONG KONG CO LTD
Filing Date
2026-01-09
Publication Date
2026-08-01

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  • Figure TWG2TB001904369_001
    Figure TWG2TB001904369_001
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    Figure TWG2TB001904369_002
  • Figure TWG2TB001904369_003
    Figure TWG2TB001904369_003
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Abstract

This invention relates to a lead frame and a light-emitting device. The lead frame includes multiple wafer units disposed on a metal substrate, the multiple wafer units being arranged side by side along a first direction to form a longitudinal wafer strip of the wafer unit; a second connecting portion is provided between adjacent longitudinal wafer strips; each wafer unit includes a metal substrate, the metal substrate extending from both sides along a second direction to form clamping portions. This invention facilitates testing, improves the material utilization rate of the metal substrate, increases the acquisition efficiency of a single unit, and improves the yield of the finished product.
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Claims

1. A lead frame comprising a plurality of wafer units disposed on a metal substrate, characterized in that the plurality of wafer units are arranged side by side along a first direction to form a longitudinal wafer strip of the wafer unit; a second connecting portion is provided between adjacent longitudinal wafer strips; the wafer unit comprises a metal substrate, the metal substrate extending from both sides along a second direction to form a clamping portion.

2. The lead frame as described in claim 1, wherein, At least one of grooves or hollowed-out portions is formed on the metal substrate by etching or punching.

3. The lead frame as described in claim 1 or 2, wherein, The metal substrate also has semi-etched sites formed on it.

4. The lead frame as described in claim 3, wherein, The half-etched bit includes at least one of a top half-etched bit and a bottom half-etched bit.

5. The lead frame as described in claim 4, wherein, The wafer unit also includes a package, on which a reflective cup is formed on the metal substrate.

6. A light-emitting device, comprising a lead frame and a light-emitting unit, wherein the light-emitting unit is disposed on the lead frame, characterized in that the lead frame is the lead frame as described in any one of claims 1-5.