Substrate inspection system

Abstract

A substrate inspection system is provided for inspecting the contour dimensions of a specific region of a substrate. The system utilizes an image capturing device to acquire multiple substrate images of the specific region. A substrate identification module identifies the substrate number. A judgment and control module obtains corresponding parameters from the manufacturing execution system based on the substrate number. An image preprocessing module increases the resolution of the substrate images. An image filtering module selects a circular contour image from the multiple substrate images. A circle diameter processing module calculates the center coordinates and diameter of the circular contour image.

Claims

1. A substrate inspection system for detecting the outline dimension of a specific region of a substrate (300), the substrate inspection system (100) comprising: an image capturing device (1) for acquiring a plurality of substrate images of the specific region of the substrate (300); and a computing device (4) comprising: a substrate identification module (42) signal-connected to the image capturing device (1) for identifying a substrate number among any of the plurality of substrate images; a judgment control module (41) signal-connected to the substrate identification module (42) for obtaining a corresponding material parameter, a geometric screening parameter and a fitting constraint parameter from a manufacturing execution system (400) according to the substrate number; and an image preprocessing module (43) signal-connected to the judgment control module (41) for performing an image preprocessing operation on the plurality of substrate images according to the material parameter obtained by the judgment control module (41) to increase the resolution of the plurality of substrate images. An image filtering module (45) is connected to the image preprocessing module (43) and is used to perform a classification operation on the plurality of substrate images according to the geometric filtering parameters obtained by the judgment control module (41) to filter out at least one circular outline image; and a circle diameter processing module (46) is connected to the image filtering module (45) and is used to generate a center coordinate and a circle diameter value of the circular outline image according to the circular outline image and the fitting constraint parameters. After the circle diameter processing module (46) generates the circle center coordinates and the circle diameter value for the first time, it uses the fitting constraint parameter to perform a judgment action on the circle center coordinates and the circle diameter value to determine whether the circle center coordinates and the circle diameter value are within the error range. If the circle center coordinates and the circle diameter value exceed the error range, the circle diameter processing module (46) will judge again whether the circle center coordinates and the circle diameter value meet a preset stop condition. If the circle center coordinates and the circle diameter value do not meet the preset stop condition, the computing device (4) will adjust the fitting constraint parameter and then use the adjusted fitting constraint parameter to regenerate the circle center coordinates and the circle diameter value. If the circle center coordinates and the circle diameter value meet the preset stop condition, the computing device (4) will stop the judgment action.

2. The substrate inspection system as described in claim 1 further includes a storage device (2) that is signal-connected to the computing device (4) and is used to store the center coordinates and diameter values ​​output from the computing device (4).

3. The substrate inspection system as described in claim 1 further includes a display device (3) that is signal-connected to the computing device (4) and is used to display the center coordinates and diameter values ​​transmitted by the computing device (4) to an operator for viewing.

4. The substrate inspection system as described in claim 1 further includes an image contour enhancement module (44), which is signal-connected to the judgment control module (41), the image preprocessing module (43), and the image screening module (45). The judgment control module (41) obtains a corresponding binarization threshold from the manufacturing execution system (400) according to the substrate number. The image contour enhancement module (44) then performs an image binarization operation on the plurality of substrate images according to the binarization threshold to enhance the component contours in the plurality of substrate images.

5. The substrate inspection system as described in claim 1 further includes a wire diameter processing module (47), which is signal-connected to the judgment control module (41) and the image screening module (45), and is used to receive at least one wire diameter contour image transmitted by the image screening module (45), and generate a wire diameter width of the wire diameter contour image based on the wire diameter contour image and the limiting parameter transmitted by the judgment control module (41).

6. The substrate inspection system as described in claim 1 further includes an arc angle processing module (48), which is signal-connected to the judgment control module (41) and the image screening module (45), and is used to receive at least one arc angle contour image transmitted by the image screening module (45), and generate an arc angle of the arc angle contour image based on the arc angle contour image and the fitting constraint parameters transmitted by the judgment control module (41).

7. The substrate inspection system as described in claim 6, wherein the material parameters include light parameters and color parameters, the geometric screening parameters include standard circle diameter specifications, and the fitting constraint parameters include standard circle diameter specifications, wire diameter specifications, arc angle specifications, circle diameter tolerance specifications, wire diameter tolerance specifications, arc angle tolerance specifications, and ROI model parameters (Region of Interest, ROI) for calculating circle diameter, wire diameter, or arc angle.

8. The substrate inspection system as claimed in claim 1 further includes a stage (200) for setting the substrate (300), and the image capturing device (1) is disposed on the stage (200) to capture images of the substrate (300) on the stage (200).

9. The substrate inspection system as described in claim 1 further includes the manufacturing execution system (400), which is signal-connected to the computing device (4) to provide the computing device (4) with parameter data required by the computing device (4).

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