Automated optical inspection device

Abstract

This disclosure presents an automatic optical inspection device, belonging to the field of semiconductor wafer appearance defect inspection technology. It includes: a camera assembly, a reflective assembly, an external coaxial light source, and a position adjustment mechanism. The reflective assembly is located to one side of the camera assembly and is used to reflect the imaging light from the wafer to the camera assembly. The external coaxial light source is positioned between the camera assembly and the reflective assembly and is used to emit imaging light towards the reflective assembly. The reflective assembly also reflects the light from the external coaxial light source back to the wafer. The position adjustment mechanism has a movable end that can be adjusted in distance from the reflective assembly, and the camera assembly is mounted on the movable end. By replacing the internal coaxial light source with an external coaxial light source, the hardware defect of LED halo is avoided. The position adjustment mechanism allows for adjustment of the distance between the camera assembly and the reflective assembly, thereby improving the product's efficiency and ease of use.

Claims

1. An automatic optical inspection device, comprising: Camera components; A reflective component, located on one side of the camera component, is used to reflect the imaging light from the wafer to the camera component; An external coaxial light source is disposed between the camera assembly and the reflective assembly, and the external coaxial light source is used to emit light for imaging the wafer toward the reflective assembly; and a position adjustment mechanism has a movable end that is adjustable in distance from the reflective assembly, and the camera assembly is mounted on the movable end.

2. The automatic optical inspection device as claimed in claim 1, wherein the position adjustment mechanism is an automatic X-axis slide.

3. The automated optical inspection apparatus as claimed in claim 1, wherein the reflective component comprises: The housing is positioned adjacent to the external coaxial light source; And a first reflecting mirror, which is installed in the housing, for reflecting imaging light and imaging light.

4. The automated optical inspection apparatus as claimed in claim 1, further comprising: A ring light reflector is mounted on top of the reflector. The ring light reflector has a detection area in the middle for placing the wafer. The ring light reflector is used to generate imaging light from the side of the wafer and reflect the imaging light from the side of the wafer back to the reflector.

5. The automated optical inspection apparatus as claimed in claim 4, wherein the ring light reflection component comprises: A ring light source is mounted on the reflective assembly; and a second reflector is mounted above the ring light source, the second reflector surrounding the detection area.

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