IC Ambient Temperature Testing System

Abstract

This invention relates to an IC ambient temperature testing system, which mainly provides a way to avoid interrupting testing operations due to compressor damage caused by high-temperature refrigerant. It includes: a binary condenser unit; a first cooling circulation device, which consists of a first cooling pipe sequentially connected in series with a first compressor, a first heat exchanger, a first expansion valve, and a third heat exchanger; a second cooling circulation device, which consists of the second cooling pipe sequentially connected in series with a second compressor, a second heat exchanger, a fourth heat exchanger, and a second expansion valve; and an intelligent cooling device, which is a fluid compensation device connected between the high-pressure side and the return gas end of the second cooling circulation device, used to introduce low-temperature liquid refrigerant from the high-pressure side to the return gas end.

Claims

1. An IC ambient temperature testing system, comprising: a binary condensing unit, which provides connection to two independent cooling circulation devices and is composed of a third heat exchanger and a fourth heat exchanger in the two cooling circulation devices, thereby providing two heterogeneous refrigerants for heat exchange; a first cooling circulation device, comprising a first compressor, a first cooling pipeline, a first heat exchanger, and a first expansion valve; wherein the first compressor, the first heat exchanger, the first expansion valve, and the third heat exchanger are sequentially connected in series by the first cooling pipeline to form the first cooling circulation device; a second cooling circulation device, comprising a second compressor, a second cooling pipeline, a second heat exchanger, and a second expansion valve; wherein the second compressor, the second heat exchanger, the fourth heat exchanger, the second expansion valve, and an IC test module are sequentially connected in series by the second cooling pipeline to form the second cooling circulation device; and an intelligent cooling device, which is a fluid compensation device connected between the high-pressure side and the return gas end of the second cooling circulation device.

2. The IC ambient temperature testing system as described in claim 1, wherein the intelligent cooling device is a circuit consisting of a third expansion valve connected to a flow regulating component or a solenoid valve component, for introducing low-temperature liquid refrigerant from the high-pressure side to the return gas end.

3. The IC ambient temperature testing system as described in claim 2, wherein the binary condenser unit further includes a RU6 type plate heat exchanger with 30-40 plates; or the first heat exchanger, the second heat exchanger, the third heat exchanger and the fourth heat exchanger are all configured as RU6 type plate heat exchangers with 30-40 plates.

4. The IC ambient temperature testing system as described in claim 2, wherein the system further includes a plurality of temperature sensors and a plurality of pressure sensors; and the second expansion valve is configured to be electronic.

5. The IC ambient temperature testing system as described in claim 4, wherein the system further includes a control unit, and the control unit has an artificial intelligence bypass dynamic adjustment mechanism, which performs a closed-loop feedback control to dynamically adjust the flow regulating component based on data from the plurality of temperature sensors and the plurality of pressure sensors.

6. The IC ambient temperature testing system as described in claim 5, wherein the closed-loop feedback control is selected from a Pid PWM control module, a Fuzzy logic control module, an AI artificial intelligence control module, or a combination thereof, for temperature control.

7. The IC ambient temperature testing system as described in claim 2, wherein the two heterogeneous refrigerants are R507 refrigerant and R23 refrigerant, wherein the first cooling circulation device uses R507 refrigerant and the second cooling circulation device uses R23 refrigerant.

8. The IC ambient temperature testing system as described in any one of claims 1 to 7, wherein the intelligent cooling device is activated when the return gas end of the second cooling circulation device reaches 150°C, and the intelligent cooling device stops operating when the return gas end of the second cooling circulation device drops to a safe range below 55°C.

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