Heat dissipation system and electronic device

TWM685983UActive Publication Date: 2026-08-01CLEVO
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
CLEVO
Filing Date
2026-04-16
Publication Date
2026-08-01

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Abstract

This invention discloses a heat dissipation system and an electronic device. The heat dissipation system is suitable for dissipating heat from a control circuit or multiple electronic components within an electronic device. The heat dissipation system includes a water-cooled heat dissipation module, an air-cooled heat dissipation module, and a multi-port connector. The water-cooled heat dissipation module is used to dissipate heat from the control circuit or multiple electronic components within the electronic device. The air-cooled heat dissipation module is used to dissipate heat from the control circuit or multiple electronic components within the electronic device. The multi-port connector connects the water-cooled heat dissipation module and the air-cooled heat dissipation module. The multi-port connector connects to an external heat dissipation device to improve the heat dissipation efficiency of both the water-cooled and air-cooled heat dissipation modules.
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Claims

1. A heat dissipation system suitable for dissipating heat from a control circuit or multiple electronic components within an electronic device, the heat dissipation system comprising: A water-cooled heat dissipation module is used to dissipate heat from the control circuit or the multiple electronic components within the electronic device. An air-cooled heat dissipation module is used to dissipate heat from the control circuit or the plurality of electronic components within the electronic device; and a multi-port connector is used to connect the water-cooled heat dissipation module and the air-cooled heat dissipation module; wherein the multi-port connector is connected to an external heat dissipation device to improve the heat dissipation efficiency of the water-cooled heat dissipation module and the air-cooled heat dissipation module respectively.

2. The heat dissipation system as described in claim 1, wherein, The external heat dissipation device includes a water-cooled external heat dissipation device, an air-cooled external heat dissipation device, or a hybrid external heat dissipation device.

3. The heat dissipation system as described in claim 2, wherein, The hybrid external heat dissipation device includes an air-cooled external heat dissipation device and a water-cooled external heat dissipation device, and the air-cooled heat dissipation module and the air-cooled external heat dissipation device each include at least one fan.

4. The heat dissipation system as described in claim 3, wherein, The multi-port connector includes at least a power supply terminal and a control port. When the multi-port connector is connected to the external heat dissipation device, the power supply terminal provides power to the external heat dissipation device, and the control port sends a control signal to a clamp-on controller of the electronic device. The electronic device controls the water-cooled heat dissipation module, the air-cooled heat dissipation module, and the external heat dissipation device through the clamp-on controller to dissipate heat from the multiple electronic components in the electronic device, so as to adjust the temperature and efficiency in the electronic device.

5. The heat dissipation system as described in claim 4, wherein, The electronic device includes a housing, the air-cooled heat dissipation module and the water-cooled heat dissipation module are disposed in the housing, and the external heat dissipation device is disposed on one side of the housing of the electronic device.

6. An electronic device comprising: A clamp-on controller; A control circuit is connected to the clamp-on controller; Multiple electronic components are connected to the control circuit; An air-cooled heat dissipation module is disposed on one side of the control circuit or the plurality of electronic components for dissipating heat from at least one of the plurality of electronic components, and the air-cooled heat dissipation module is connected to the clamp-on controller; a water-cooled heat dissipation module is disposed on one side of the plurality of electronic components for dissipating heat from at least one of the plurality of electronic components, and the water-cooled heat dissipation module is connected to the clamp-on controller; and a multi-port connector is used to connect the air-cooled heat dissipation module and the water-cooled heat dissipation module, and the multi-port connector is also used to connect an external heat dissipation device; wherein, the clamp-on controller determines an operating state of each of the air-cooled heat dissipation module and the water-cooled heat dissipation module according to the temperature values ​​of the plurality of electronic components.

7. The electronic device as claimed in claim 6, wherein, The external heat dissipation device includes a water-cooled external heat dissipation device, an air-cooled external heat dissipation device, or a hybrid external heat dissipation device. The hybrid external heat dissipation device includes both an air-cooled external heat dissipation device and a water-cooled external heat dissipation device.

8. The electronic device as claimed in claim 7, wherein, The multi-port connector includes at least a power supply terminal and a control port. When the multi-port connector is connected to the external heat dissipation device, the power supply terminal provides power to the external heat dissipation device. The clamp-on controller controls one or a combination of the water-cooled heat dissipation module, the air-cooled heat dissipation module, and the external heat dissipation device to dissipate heat from the control circuit or the multiple electronic components of the electronic device, in order to adjust the temperature and efficiency of the electronic device.

9. The electronic device as claimed in claim 8, wherein, The air-cooled heat dissipation module and the water-cooled heat dissipation module are disposed in a housing of the electronic device, and the external heat dissipation device is disposed on one side of the housing of the electronic device.

10. The electronic device as claimed in claim 9, wherein, The air-cooled heat dissipation module and the water-cooled heat dissipation module are disposed on both sides or one side of the control circuit or multiple electronic components.