Storage device with heat-dissipating ink

Abstract

This invention provides a storage device with heat-dissipating ink, including a printed circuit board, a controller, flash memory, and a heat-dissipating ink layer. The printed circuit board has at least one surface. The controller is disposed on the surface of the printed circuit board. The flash memory is disposed on the surface of the printed circuit board and electrically connected to the controller. The heat-dissipating ink layer is coated on the surface of the printed circuit board, wherein the heat-dissipating ink layer comprises a resin substrate and a plurality of ceramic powders dispersed in the resin substrate, for dissipating the heat generated by the controller and the flash memory, so that the storage device can effectively reduce the operating temperature of the controller and the flash memory through infrared thermal radiation even in fanless environments or under space-constrained conditions, thereby maintaining the operational stability of the system and preventing thermal shutdown.

Claims

1. A storage device for heat-dissipating ink, comprising: A printed circuit board having at least one surface; A controller is disposed on the surface of the printed circuit board; A flash memory is disposed on the surface of the printed circuit board and electrically connected to the controller; and a heat dissipation ink layer is coated on the surface of the printed circuit board, wherein the heat dissipation ink layer comprises a resin substrate and a plurality of ceramic powders dispersed in the resin substrate, for dissipating heat generated by the controller and the flash memory.

2. The storage device with heat-dissipating ink as described in claim 1, wherein the storage device is a PCIe storage device and the PCIe storage device conforms to the PCIe 4.0 or PCIe 5.0 transmission protocol.

3. The storage device with heat-dissipating ink as described in claim 1, wherein the thermal emissivity of the ceramic powder is higher than that of the resin substrate.

4. The storage device with heat-dissipating ink as claimed in claim 1, wherein the ceramic powder comprises one of the group consisting of metal oxide powder, nitride powder, carbide powder, ceramic silicate powder, and combinations thereof.

5. The storage device with heat-dissipating ink as claimed in claim 1, wherein the resin substrate is a photosensitive resin substrate, and the photosensitive resin substrate is bonded to a circuit insulation layer of the printed circuit board.

6. The storage device with heat-dissipating ink as claimed in claim 1, wherein the heat-dissipating ink layer is formed by a solder resist process of the printed circuit board and is disposed at the outermost solder resist position of the printed circuit board.

7. The storage device with heat-dissipating ink as described in claim 1, wherein the surface of the printed circuit board is not provided with a metal heat sink, and the heat-dissipating ink layer is directly exposed to the external space.

8. The storage device with heat-dissipating ink as described in claim 1, wherein the printed circuit board, the controller, the flash memory, and the heat-dissipating ink layer together constitute a fanless heat dissipation module.

9. The storage device with heat-dissipating ink as described in claim 1 further includes a temperature sensor disposed on the surface of the printed circuit board, and the temperature sensor is thermally connected to the heat-dissipating ink layer.

10. The storage device with heat-dissipating ink as claimed in claim 1, wherein the heat generated by the controller and the flash memory is dissipated outward through the ceramic powder of the heat-dissipating ink layer in the form of infrared thermal radiation.

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