Light-emitting packaging structure, light-emitting module and electronic device

Abstract

This invention relates to an electronic device comprising a housing and a light-emitting module disposed therein. The light-emitting module includes a light-emitting encapsulation structure and optical elements disposed thereon. The light-emitting encapsulation structure includes a substrate, a first-wavelength light-emitting element and a second-wavelength light-emitting element, a reflective layer, and an encapsulation layer. A first patterned conductive layer is provided on a first surface of the substrate, and a second patterned conductive layer is provided on a second surface of the substrate. The first-wavelength light-emitting element and the second-wavelength light-emitting element are respectively disposed on a first die-bonding region and a second die-bonding region of the first patterned conductive layer. The reflective layer is disposed on the first surface and covers the sides of the light-emitting elements. The encapsulation layer covers the light-emitting elements and the reflective layer. Light emitted by the first and second-wavelength light-emitting elements is emitted through a light-emitting surface of the encapsulation layer. The light-emitting surface has a roughened surface, which is configured at least corresponding to the second-wavelength light-emitting element.

Claims

1. A light-emitting encapsulation structure, comprising: A substrate having a first surface and a second surface opposite to each other, wherein a first patterned conductive layer is provided on the first surface and a second patterned conductive layer is provided on the second surface; a first wavelength light-emitting element is disposed in a first die-bonding region of the first patterned conductive layer; a second wavelength light-emitting element is disposed in a second die-bonding region of the first patterned conductive layer; and a reflective layer is disposed on the first surface and covers the sides of the first wavelength light-emitting element and the second wavelength light-emitting element. An encapsulation layer is disposed above the first wavelength light-emitting element, the second wavelength light-emitting element, and the reflective layer. The encapsulation layer has a light-emitting surface, and the light-emitting surface is formed with a roughened surface, which is configured at least corresponding to the second wavelength light-emitting element.

2. The light-emitting encapsulation structure as described in claim 1, wherein, The first patterned conductive layer includes a first metal pad, a second metal pad, a third metal pad, and a fourth metal pad spaced apart. The second patterned conductive layer includes a fifth metal pad, a sixth metal pad, a seventh metal pad, and an eighth metal pad spaced apart. The first metal pad is electrically connected to the fifth metal pad, the second metal pad is electrically connected to the sixth metal pad, the third metal pad is electrically connected to the seventh metal pad, and the fourth metal pad is electrically connected to the eighth metal pad. The second wavelength light-emitting element is disposed on the second die-bonding region defined by the third metal pad and is electrically connected to the fourth metal pad through a metal wire.

3. The light-emitting encapsulation structure as described in claim 2, wherein, The first metal pad includes a first mounting portion and a first alignment portion, and the second metal pad includes a second mounting portion and a second alignment portion. The first mounting portion and the second mounting portion extend toward each other along a first direction, and the first mounting portion and the second mounting portion together define the first die-bonding region.

4. The light-emitting encapsulation structure as described in claim 3, wherein, The first alignment portion extends outward from both sides of the first mounting portion along a second direction; the second alignment portion extends outward from both sides of the second mounting portion along the second direction.

5. The light-emitting encapsulation structure as described in claim 4, wherein, The first direction is perpendicular to the second direction, and in the second direction, the width of the first mounting portion is smaller than the width of the first alignment portion, and the width of the second mounting portion is smaller than the width of the second alignment portion.

6. The light-emitting encapsulation structure as described in claim 4, wherein, The first wavelength light-emitting element includes a light-emitting diode chip and a wavelength conversion element. The light-emitting diode chip includes two electrode portions, which are electrically connected to the first mounting portion and the second mounting portion, respectively. The wavelength conversion element is attached to the upper surface of the light-emitting diode chip, and the side of the wavelength conversion element is aligned with the outer edges of the first alignment portion and the second alignment portion, respectively.

7. The light-emitting encapsulation structure as described in claim 6, wherein, The reflective layer covers the side surface of the light-emitting diode chip, while the encapsulation layer covers the top and side surfaces of the wavelength conversion element.

8. The light-emitting encapsulation structure as described in claim 1, wherein, The top surface of the second wavelength light-emitting element is exposed in the reflective layer and covered by the encapsulation layer, and the distance from the light-emitting surface of the encapsulation layer to the top surface of the second wavelength light-emitting element is between 50 and 300 μm.

9. The light-emitting encapsulation structure as described in claim 1, wherein, The surface roughness of the roughened surface is between 1.0 and 4.0 μm.

10. The light-emitting encapsulation structure as described in claim 1, wherein, The distance between the optical center of the first wavelength light-emitting element and the optical center of the second wavelength light-emitting element is between 0.65 and 1.25 mm.

11. The light-emitting encapsulation structure as described in claim 1, wherein, The first wavelength light-emitting element is a flash lamp, and the second wavelength light-emitting element is an infrared light-emitting diode.

12. The light-emitting encapsulation structure as described in claim 11, wherein, The beam angle (FOV) of the first wavelength light-emitting element is greater than that of the second wavelength light-emitting element.

13. The light-emitting encapsulation structure as described in claim 12, wherein, The beam angle of the second wavelength light-emitting element is no greater than 125 degrees.

14. The light-emitting encapsulation structure as described in claim 1, wherein, The optical center of the first wavelength light-emitting element and the optical center of the second wavelength light-emitting element are located on the same axis.

15. The light-emitting encapsulation structure as described in claim 1, wherein, The substrate, the first wavelength light-emitting element, the second wavelength light-emitting element, the reflective layer, and the encapsulation layer together constitute an integrated encapsulation structure.

16. A light-emitting module, comprising: The light-emitting encapsulation structure as described in any one of claims 1 to 15; An optical element is disposed above the encapsulation layer and spaced apart from the light-emitting surface of the encapsulation layer.

17. The light-emitting module as described in claim 16, wherein, The optical element is a Fresnel lens, and one of the surfaces of the optical element forms a concentric circle structure, the center of which is aligned with the optical center of the first wavelength light-emitting element.

18. The light-emitting module as described in claim 16, wherein, The optical element is a Fresnel lens. One surface of the optical element forms a first concentric circle structure and a second concentric circle structure. The center of the first concentric circle structure is aligned with the optical center of the first wavelength light-emitting element, and the center of the second concentric circle structure is aligned with the optical center of the second wavelength light-emitting element.

19. The light-emitting module as described in claim 18, wherein, The maximum outer diameter of the first concentric circle structure is greater than the maximum outer diameter of the second concentric circle structure.

20. The light-emitting module as described in claim 18, wherein, The distance between the center of the first concentric circle structure and the center of the second concentric circle structure is between 0.65 and 1.25 mm.

21. The light-emitting module as described in claim 16, wherein, The distance between the optical element and the light-emitting surface of the encapsulation layer is no greater than 0.1 mm.

22. An electronic device comprising: A shell; The light-emitting module as described in any one of claims 16 to 21 is disposed inside the housing.

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