Light-emitting diode structure

Abstract

A light-emitting diode (LED) structure includes a circuit layer, a package, and an adhesive layer. The circuit layer includes a base layer, a first conductive layer, a second conductive layer, and an ultraviolet (UV) LED. The first conductive layer is in contact with the base layer and has a surface. The second conductive layer is adjacent to the first conductive layer, in contact with the base layer, and also has a surface. The UV LED bridges the surfaces of the first and second conductive layers and is electrically connected to both. The package covers the circuit layer, and the package material is a fluoropolymer. The adhesive layer is sandwiched between the circuit layer and the package to enhance the bonding strength between the circuit layer and the package.

Claims

1. A light-emitting diode structure, comprising: A circuit layer (11) includes: a base layer (110); a first conductive layer (111) in contact with the base layer (110) and having a surface (1S); a second conductive layer (112) adjacent to the first conductive layer (111), in contact with the base layer (110) and having a surface (2S); and an ultraviolet light emitting diode (113) bridging the surface (1S) of the first conductive layer (111) and the surface (2S) of the second conductive layer (112), and electrically connected to the first conductive layer (111) and the second conductive layer (112); A package (12) is covered on the circuit layer (11), the material of the package (12) having a fluoropolymer; and an adhesive layer (13) is sandwiched between the circuit layer (11) and the package (12) to enhance the bonding strength between the circuit layer (11) and the package (12).

2. The light-emitting diode structure as described in claim 1, wherein the adhesive layer (13) is disposed on the base layer (110) and in contact with the encapsulation body (12).

3. The light-emitting diode structure as described in claim 2, wherein the adhesive layer (13) surrounds the first conductive layer (111) and the second conductive layer (112).

4. The light-emitting diode structure as described in claim 2, wherein the adhesive layer (13) is located between the first conductive layer (111) and the second conductive layer (112).

5. The light-emitting diode structure as described in claim 1, wherein the adhesive layer (13) is disposed on the first conductive layer (111) or the second conductive layer (112) and is in contact with the package (12).

6. The light-emitting diode structure as claimed in claim 1, wherein the material of the adhesive layer (13) is an organic compound.

7. The light-emitting diode structure as described in claim 6, wherein the organic compound comprises a fluoropolymer, a silane coupling agent, n-heptane, ethyl acetate, toluene, or methylcyclohexane.

8. A light-emitting diode structure, comprising: A circuit layer (11) includes: a base layer (110); a first conductive layer (111) in contact with the base layer (110) and having a surface (1S); a second conductive layer (112) adjacent to the first conductive layer (111), in contact with the base layer (110) and having a surface (2S); and an ultraviolet light emitting diode (113) disposed on the surface (1S) of the first conductive layer (111) and the surface (2S) of the second conductive layer (112), and electrically connected to the first conductive layer (111) and the second conductive layer (112); A package (12) covers the circuit layer (11), the material of the package (12) having a fluoropolymer; and an adhesive layer (13) disposed between the circuit layer (11) and the package (12) to enhance the bonding strength between the circuit layer (11) and the package (12).

9. The light-emitting diode structure as described in claim 8, wherein the adhesive layer (13) is disposed on the base layer (110), the first conductive layer (111) and the second conductive layer (112), and is in contact with the package (12).

10. The light-emitting diode structure as claimed in claim 8, wherein the material of the tackifying layer (13) has an organic compound, including a fluoropolymer, a silane coupling agent, n-heptane, ethyl acetate, toluene, or methylcyclohexane.

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