Compliant bump with conductive support post

Abstract

An elastic bump with a conductive support post includes at least one conductive support post and an elastic insulating block. The conductive support post is formed on and electrically connected to a conductive unit in a circuit structure. The elastic insulating block covers the conductive support post and has a top surface that exposes one end face of the conductive support post. The conductive support post provides an electrical conductive path between the elastic bump and the conductive unit and serves as a support frame for the elastic bump, preventing excessive pressure on the elastic bump and maintaining the bonding spacing between electronic components. The elastic insulating block provides stress buffering to prevent the conductive support post from shifting and forming an open circuit with the conductive unit, thereby improving the reliability and electrical conduction stability of the elastic bump.

Claims

1. An elastic bump having a conductive support post, comprising: at least one conductive support post formed on and electrically connected to a conductive unit; and an elastic insulating block covering the conductive support post, the elastic insulating block having a top surface that exposes one end face of the conductive support post.

2. The resilient bump with conductive support post as claimed in claim 1, wherein the conductive unit includes a bump under metal layer, the conductive support post is formed on the bump under metal layer, and the resilient insulating block covers the bump under metal layer.

3. The resilient protrusion with conductive support post as claimed in claim 1, further comprising a bonding layer disposed on the top surface and electrically connected to the end face.

4. The resilient protrusion with conductive support post as claimed in claim 1, further comprising an intermediate layer and a bonding layer, the intermediate layer being located between the bonding layer and the top surface of the resilient insulating block, the bonding layer covering the intermediate layer, and the bonding layer being electrically connected to the end face via the intermediate layer.

5. The resilient protrusion with conductive support pillars as in claim 4, wherein the interlayer covers the top surface.

6. The resilient protrusion with conductive support post as claimed in claim 1, wherein along an axial direction, the top surface is not lower than the end face.

7. The resilient protrusion with conductive support post as claimed in claim 6, wherein the resilient insulating block has at least one opening recessed in the top surface, the opening exposing the end face, and the top surface being higher than the end face.

8. The resilient protrusion with conductive support pillars as claimed in claim 4, wherein the interlayer exposes one side of the resilient insulating block.

9. The resilient protrusion with conductive support pillars as claimed in claim 3 or 4, wherein the bonding layer exposes one side of the resilient insulating block.

10. The resilient protrusion with a conductive support post as claimed in claim 3 or 4, wherein the bonding layer has a bonding surface and at least one groove recessed in the bonding surface, the groove being located above the conductive support post along an axial direction.

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