Semiconductor apparatus

TWM686285UActive Publication Date: 2026-08-11ADVANCED SEMICON ENG INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115201844
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-03-03
Publication Date
2026-08-11
Estimated Expiration
2036-03-02

Smart Images

  • Figure TWG2TB001906212_001
    Figure TWG2TB001906212_001
  • Figure TWG2TB001906212_002
    Figure TWG2TB001906212_002
  • Figure TWG2TB001906212_003
    Figure TWG2TB001906212_003
Patent Text Reader

Abstract

A semiconductor device includes a body assembly, an extension plate, and a sensing device. The body assembly includes a mold assembly located inside the body assembly, and the mold assembly includes an upper mold, a lower mold, and a moving platform. The lower mold is located below and spaced apart from the upper mold. The moving platform is located below and connected to the lower mold. The extension plate is located on one side of the mold assembly and extends from the interior of the body assembly to the exterior of the body assembly. The sensing device is located on the surface of the extension plate and spaced apart from the upper mold, lower mold, and moving platform, wherein the sensing device is located directly above the moving platform and is used to measure the distance between the sensing device and the upper surface of the moving platform.
Need to check novelty before this filing date? Find Prior Art

Claims

1. A semiconductor device comprising: a body assembly including a mold assembly located inside the body assembly, the mold assembly including: an upper mold; a lower mold located below the upper mold and spaced apart from the upper mold; and a movable platform located below the lower mold and connected to the lower mold; an extension plate located on one side of the mold assembly and extending from the interior of the body assembly to an exterior of the body assembly; and a sensing device located on a surface of the extension plate and spaced apart from the upper mold, the lower mold and the movable platform, wherein the sensing device is located directly above the movable platform and is used to measure the distance between the sensing device and an upper surface of the movable platform.

2. The semiconductor device as claimed in claim 1 further includes a fastener located on the surface of the extension plate.

3. The semiconductor device as claimed in claim 2, wherein the fixture is connected to the sensing device.

4. The semiconductor device as described in claim 2, wherein the fixture is T-shaped.

5. The semiconductor device as claimed in claim 1, wherein the sensing device further comprises: a sensor; and a housing covering the sensor.

6. The semiconductor device as claimed in claim 5 further includes a gas cooling device located on the housing.

7. The semiconductor device as claimed in claim 6, wherein the gas cooling device further includes a gas line and a gas regulating valve, the gas line being in fluid communication with the gas regulating valve.

8. The semiconductor device as claimed in claim 1 further includes a signal line connected to the sensing device.

9. The semiconductor device as claimed in claim 1, wherein the upper mold is located directly above the lower mold.

10. The semiconductor device as claimed in claim 9, wherein one side of the upper mold is aligned with one side of the lower mold.