Electronic devices and electronic components

Abstract

An electronic device is used to secure itself in a housing and includes a housing, at least one mounting structure, and a motherboard assembly. The at least one mounting structure includes an assembly protrusion, two push-off portions, and a fastening portion. The assembly protrusion is fixed to the housing and protrudes beyond the housing. The assembly protrusion has a thermal contact surface and two push-off ramps. The two push-off ramps are opposite each other and face away from the thermal contact surface. The thermal contact surface is used to thermally contact the housing. Each of the two push-off portions has a push-off ramp. The assembly protrusion is located between the two push-off portions. The fastening portion passes through the two push-off ramps of the assembly protrusion and the two push-off ramps of the two push-off portions, and is used to secure the housing in the housing by having the two push-off ramps push against the two push-off ramps respectively. The motherboard assembly includes a motherboard and at least one heat source. The at least one heat source is disposed on the motherboard. The motherboard is disposed in the housing. The at least one heat source is thermally coupled to the housing, and the thermal contact surface is closer to the at least one heat source than the two push-off ramps.

Claims

1. An electronic device for being fixed in a housing and comprising: a housing; at least one mounting structure including an assembly protrusion, two push-off portions and a fastening portion, the assembly protrusion being fixed to the housing and protruding beyond the housing, the assembly protrusion having a thermal contact surface and two push-off ramps, the two push-off ramps being opposite to each other and facing away from the thermal contact surface, the thermal contact surface being for thermal contact with the housing, each of the two push-off portions having a push-off ramp, the assembly protrusion being located between the two push-off portions. The fastening part passes through the two pushing inclined surfaces of the assembly protrusion and the two pushing inclined surfaces of the two pushing parts, and is used to fix the housing in the housing by having the two pushing inclined surfaces push against the two pushing inclined surfaces respectively; and a main board assembly, including a main board and at least one heat source, the at least one heat source is disposed on the main board, the main board is disposed in the housing, the at least one heat source is thermally coupled to the housing, and the thermal contact surface is closer to the at least one heat source than the two pushing inclined surfaces.

2. The electronic device as claimed in claim 1 further includes at least one heat pipe having a hot end and a cold end opposite to each other, the hot end being thermally coupled to the housing, and the cold end being thermally contacted with the housing.

3. The electronic device as claimed in claim 1, wherein the housing includes a top cover and a bottom cover, the top cover and the bottom cover together forming an accommodating space, the motherboard is disposed in the accommodating space, the top cover is further away from the motherboard than the bottom cover, the top cover is thermally coupled to the at least one heat source, and the assembly protrusion is fixed to the top cover.

4. The electronic device as claimed in claim 3, wherein the top cover includes a top plate and two first side plates, the two first side plates being respectively connected to opposite sides of the top plate, and the assembly protrusion protrudes from one of the two first side plates on the side away from the top plate.

5. The electronic device as claimed in claim 4, wherein the bottom cover includes a bottom plate and two second side plates, the two second side plates being respectively connected to opposite sides of the bottom plate, and the two first side plates being respectively fixed and in thermal contact with the two second side plates.

6. The electronic device as claimed in claim 4, wherein the number of the at least one mounting structure is two, and the two assembly protrusions of the two mounting structures respectively protrude from the side of the two first side plates away from the top plate.

7. The electronic device as claimed in claim 3, wherein the top cover is in thermal contact with the at least one heat source.

8. The electronic device as claimed in claim 1, wherein the width of the housing in a projecting direction of the assembly protrusion is 89 mm.

9. The electronic device as claimed in claim 1, wherein the depth of the housing in one penetration direction of the fastener is 78 mm.

10. An electronic component comprising: a housing having at least one mounting recess; and an electronic device comprising: a housing; at least one mounting structure including an assembly protrusion, two push-off portions, and a fastening portion, the assembly protrusion being fixed to the housing and protruding beyond the housing, the assembly protrusion having a thermal contact surface and two push-off ramps, the two push-off ramps being opposite to each other and facing away from the thermal contact surface, the thermal contact surface being in thermal contact with an inner surface of the housing forming the at least one mounting recess, each of the two push-off portions having a push-off ramp, the assembly protrusion being located between the two push-off portions. Between them, the fastening part passes through the two pushing inclined surfaces of the assembly protrusion and the two pushing inclined surfaces of the two pushing parts, so that the two pushing inclined surfaces push against the two pushing inclined surfaces respectively, so that the assembly protrusion and the two pushing parts fix the housing in the at least one mounting groove of the housing by pressing against the inner surface; and a main board assembly, including a main board and at least one heat source, the at least one heat source is disposed on the main board, the main board is disposed in the housing, the at least one heat source is thermally coupled to the housing, and the thermal contact surface is closer to the at least one heat source than the two pushing inclined surfaces.

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