Grain transfer device

Abstract

The die transfer apparatus provided in this invention includes a base, a carrier plate, a plurality of stages, and a die transfer unit. The carrier plate is disposed on the base for placing a substrate; each stage is disposed on the base and each has a lifting member for moving the substrate; the die transfer unit includes a support frame disposed on the base, a mounting rail disposed on the support frame, a substrate transport member disposed on the mounting rail, and a die pick-up member disposed on the mounting rail. The substrate transport member has a support seat for carrying the substrate and a moving part for controlling the movement of the support seat; the die pick-up member has a pick-up head for gripping and placing a die, and a lifting part for controlling the movement of the pick-up head. Thus, the die pick-up member can transfer the die to the carrier in a more efficient manner.

Claims

1. A die transfer apparatus for transferring a die located on a substrate to a carrier, the die transfer apparatus comprising: a base having a bearing surface, wherein a direction perpendicular to the bearing surface is defined as a first direction, and two mutually perpendicular directions parallel to the bearing surface are defined as a second direction and a third direction, respectively; and a carrier plate disposed on the base for placing the carrier. A plurality of platforms are disposed on the base for placing the substrate, and each platform has a lifting member for moving the substrate along a first direction; and a die transfer unit has a support frame disposed on the base, a frame guide rail disposed on the support frame and extending along the second direction, a substrate transport member disposed on the frame guide rail, and a die pick-up member disposed on the frame guide rail. The substrate transport member has a support base for carrying the substrate and a moving part for controlling the support base to move along the second direction and the third direction. The die pick-up member has a pick-up head for gripping and placing the die and a lifting part for controlling the pick-up head to move along the first direction.

2. The grain transfer apparatus as claimed in claim 1, wherein, The base has a plurality of base rails located on the bearing surface and extending along the third direction, and the carrier plate and each of the platforms are respectively disposed on each of the base rails.

3. The grain transfer apparatus as claimed in claim 1, wherein, Each lifting member has a plurality of forks for supporting the substrate, and the support has a base for placing the substrate, and a plurality of elongated holes on the base, each of which allows the forks to extend into, so as to move the base to below the substrate.

4. The grain transfer apparatus as claimed in claim 3, wherein, Each fork has a suction hole for picking up the substrate.

5. The grain transfer apparatus as claimed in claim 3, wherein, The support has a suction part disposed on the support body for picking up the substrate.

6. The grain transfer apparatus as claimed in claim 1, wherein, The die transfer unit has a slide, and the substrate transporter and the die picker are both mounted on the guide rail of the frame via the slide.

7. The grain transfer apparatus as claimed in claim 1, wherein, The pickup head has a perforation for laser light to pass through.

8. The grain transfer apparatus as claimed in claim 1, wherein, The pickup head has a vacuum nozzle for picking up the grain.

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