Water-cooled plate structure

Abstract

This invention provides a water-cooled plate structure, including a heat-conducting base and a cover. The cover is integrally coated on the heat-conducting base by 3D printing or injection molding, and a heat exchange chamber is defined between the cover and the heat-conducting base. Through the integrated structure of the cover and the heat-conducting base, this invention can achieve the purpose of lightweight structure, increased assembly efficiency and reduced leakage.

Claims

1. A water-cooled plate structure, comprising: A thermally conductive base having a thermal contact side; a cover integrally formed on the thermally conductive base by 3D printing or injection molding, defining a heat exchange chamber between the cover and the thermally conductive base, wherein the thermal contact side of the thermally conductive base is exposed for attaching a heat source, and the cover has a plurality of retaining portions for fasteners to fix the water-cooled plate structure to an electronic device.

2. The water-cooled plate structure as described in claim 1, wherein the cover is provided with a water inlet and a water outlet communicating with the heat exchange chamber.

3. The water-cooled plate structure as described in claim 1, wherein the heat-conducting base has a heat dissipation side, the heat dissipation side is provided with a plurality of spaced heat dissipation fins and defines a plurality of heat dissipation channels, the heat dissipation fins and heat dissipation channels being located in the heat exchange chamber.

4. The water-cooled plate structure as described in claim 1, wherein the cover has a covering fitting part that covers the periphery of the heat-conducting base, so that the cover and the heat-conducting base are integrally fixed.

5. The water-cooled plate structure as described in claim 1, wherein the cover system is made of a plastic material, and the plastic material is made of a polymer material or a thermally conductive composite material.

6. The water-cooled plate structure as described in claim 3, wherein the cover has an inner surface, and the top of the heat sinks abuts against the inner surface to force a cooling fluid entering through the water inlet channel through the heat dissipation channel.

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