Ultrasonic dust removal devices based on hybrid robots for the semiconductor industry

Abstract

This invention discloses an ultrasonic dust removal device based on a composite robot for the semiconductor industry, including an AGV (Automated Guided Vehicle) cart with a mounting frame. A bottom frame is attached to the bottom of the mounting frame and connected to the AGV cart. A robotic arm is mounted on top of the mounting frame, and an ultrasonic dust removal device is mounted at its free end, away from the mounting frame. The ultrasonic dust removal device includes a dust removal head, with a dust removal head base plate integrally formed at the bottom of the dust removal head cavity. An air inlet is located at the top of the dust removal head cavity, and a positive pressure chamber is located within the dust removal head cavity. The side walls of the positive pressure chamber are vertically aligned upwards from the dust removal head base plate within the dust removal head cavity. A separation gap exists between the top plate of the positive pressure chamber and the top of the dust removal head cavity. The air inlet is continuously connected to the positive pressure chamber. This invention cleans both the horizontal and vertical surfaces of the vehicle, meeting a wider range of dust removal needs and significantly increasing its application scope.

Claims

1. An ultrasonic dust removal device based on a composite robot for the semiconductor industry, comprising: An AGV trolley (11) is provided with an installation frame (12), and a bottom frame (18) is provided at the bottom of the installation frame (12), which is connected to the AGV trolley (11); characterized in that a robotic arm (14) is provided at the top of the installation frame (12), and an ultrasonic dust removal device (21) is provided at the free end of the robotic arm (14) away from the installation frame (12). The ultrasonic dust removal device (21) includes a dust removal head (38), a dust removal head base plate (22) is provided at the bottom of the dust removal head (38) cavity, and the dust removal head (38) and the dust removal head base plate (22) are integrally formed; an air inlet duct (24) is provided at the top of the dust removal head (38) cavity, a positive pressure chamber (27) is provided in the dust removal head (38) cavity, the four sides of the positive pressure chamber (27) are vertically arranged from the dust removal head base plate (22) in the dust removal head (38) cavity, the top plate (26) of the positive pressure chamber is provided with a separation gap from the top of the dust removal head (38) cavity, and the air inlet duct (24) is connected to the positive pressure chamber (27). A gap is provided between the outer wall of the positive pressure chamber (27) and the inner wall of the dust removal head (38). The gap between the inner wall of the dust removal head (38) and the outer wall of the positive pressure chamber (27) forms a negative pressure chamber (25). The negative pressure chamber (25) is located on the outer periphery of the positive pressure chamber (27) and covers the positive pressure chamber (27). The negative pressure chamber (25) is located in the dust removal head (38) cavity. The bottom plate (22) of the ultrasonic dust removal device (21) has a multi-stage pulse dust blowing slit (31) that communicates with the positive pressure chamber (27). The multi-stage pulse dust blowing slit (31) has a first suction slit (32) that communicates with the negative pressure chamber (25) on both sides. The multi-stage pulse dust blowing slit (31) has a second suction slit (33) that communicates with the negative pressure chamber (25) at both ends. The negative pressure chamber (25) in the dust removal head (38) is connected to the exhaust duct (23), and the first suction slit (32) and the second suction slit (33) are opened at the bottom of the negative pressure chamber (25) of the dust removal head base plate (22).

2. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The bottom plate (22) of the dust collector head of the positive pressure chamber (27) is provided with a through multi-stage pulse dust blowing slit (31). The multi-stage pulse dust blowing slit (31) includes a double-stage expansion airway cavity (47) and a two-stage narrowing surface channel. The multi-stage pulse dust blowing slit (31) is provided with an air gap spacing of varying D1, a first narrowing airway spacing D2, a first-stage expansion cavity spacing D3, a second narrowing airway spacing D4, a second-stage expansion cavity spacing D5, and a dust blowing spacing D6 from top to bottom. The air gap spacing on the multi-stage pulse dust blowing slit (31) is the same as: the air inlet spacing D1, the first stage expansion cavity spacing D3 of the dual-stage expansion airway cavity (47), and the second stage expansion cavity spacing D5 of the dual-stage expansion airway cavity (47); the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing spacing D6 are the same, and the ratio of air inlet spacing D1 to first narrowing airway spacing D2 is 1:1.5~2.

3. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The robotic arm (14) is a six-axis collaborative robotic arm. The ultrasonic dust removal device (21) is equipped with a hanging frame, and the ultrasonic dust removal device (21) is installed on the end of the robotic arm (14) through the hanging frame. The top of the dust removal head (38) is equipped with an exhaust duct (23), which is connected to the negative pressure chamber (25). The positive pressure chamber (27) and the negative pressure chamber (25) are respectively independently installed in the cavity of the dust removal head (38), and the positive pressure chamber (27) and the negative pressure chamber (25) are isolated from each other and do not communicate with each other. The AGV car (11) is equipped with a laser radar (13). The end effector of the robotic arm (14) is equipped with a camera module (15), which is located next to the dust removal head (38).

4. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 2, wherein, The dual-stage expansion airway cavity (47) adopts a square cavity structure, and the width spacing D3 and D5 between the inner sidewalls of the square cavity of the dual-stage expansion airway cavity (47) is the expansion cavity width; or the dual-stage expansion airway cavity (47) adopts a circular cavity structure, and the width spacing D3 and D5 between the outer top of the circular inner sidewalls of the circular cavity of the dual-stage expansion airway cavity (47) is the expansion cavity width; or the dual-stage expansion airway cavity (47) adopts a trapezoidal cavity structure, and the width spacing D3 and D5 between the bottom of the trapezoidal cavity of the dual-stage expansion airway cavity (47) is the expansion cavity width.

5. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The bottom frame (18) is equipped with a negative pressure fan (29), and a negative pressure high-efficiency filter (28) is provided on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is set in the mounting frame (12). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the dust removal head (38) through the conduit (16). The air outlet of the negative pressure fan (29) is equipped with a silencer (42).

6. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The bottom of the positive pressure chamber (27) of the dust collector head (22) has a concave truncated cone cavity (36) in the middle of the bottom surface, which is provided with a multi-stage pulse dust blowing slit (31) and a number of annular dust blowing slits (35) of the ring group. Four slender dust blowing slits (34) are provided around the planar area outside the concave truncated cone cavity (36) of the bottom surface of the positive pressure chamber (27). The four slender dust blowing slits (34) surround the planar area outside the concave truncated cone cavity (36). The negative pressure chamber (25) in the dust collector head (38) is connected to the exhaust duct (23). The bottom of the negative pressure chamber (25) of the dust collector head (22) is provided with a first suction slit (32) and a second suction slit (33) of the matching pair.

7. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The ratio of the height of the positive pressure chamber (27) to the height of the dust removal head (38) is 2 / 3~3 / 4:1; the ratio of the air volume of the dust blowing slit to the air volume of the suction slit is 1:1.5~2; the ratio of the pressure of the dust blowing slit to the pressure of the suction slit is 8~12:

1.

8. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The dust removal head (38) of the ultrasonic dust removal device (21) includes a positive pressure chamber (27) and a negative pressure chamber (25). The ultrasonic dust removal device (21) is located at the end of the robotic arm (14). The positive pressure fan (39), the negative pressure fan (29), and the negative pressure high-efficiency filter (28) are located on the bottom frame (18) of the mounting frame (12). The negative pressure high-efficiency filter (28) is located on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the ultrasonic dust removal device (21) through the conduit (16). The conduit (16) is set on the robotic arm (14) in sections through the sleeve (17). The positive pressure fan (39) is located next to the negative pressure fan (29). The positive pressure fan (39) is connected to the bottom frame (18) through the support frame. The positive pressure fan (39) is connected to the air inlet duct (24) on the ultrasonic dust removal device (21) through the conduit (16).

9. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The ultrasonic dust removal device (21) is located at the end of the robotic arm (14). The positive pressure fan (39) is embedded in the ultrasonic dust removal device (21). The positive pressure fan (39) is located on the top plate (26) of the positive pressure chamber of the dust removal head (38). The outlet of the positive pressure fan (39) is connected to the positive pressure chamber (27) of the dust removal head. The inlet of the positive pressure fan (39) is connected to the top air inlet (24) of the dust removal head (38). The negative pressure high-efficiency filter (28) and the negative pressure fan (29) are located on the bottom frame (18). The negative pressure high-efficiency filter (28) is located on the negative pressure fan (29). The negative pressure high-efficiency filter (28) is connected to the exhaust duct (23) on the ultrasonic dust removal device (21) through the conduit (16). The conduit (16) is fixed in sections on the robotic arm (14) through the sleeve (17).

10. The ultrasonic dust removal device based on a composite robot for the semiconductor industry as described in claim 1, wherein, The ultrasonic dust removal device (21) is located at the end of the robotic arm (14). The positive pressure fan (39) is embedded in the dust removal head (38) of the ultrasonic dust removal device (21). The positive pressure fan (39) is connected to the positive pressure chamber (27) of the dust removal head. The negative pressure fan (29) is installed on the outer wall of the dust removal head (38) through the bracket (41). The air inlet of the negative pressure fan (29) is connected to the exhaust duct (23) of the dust removal head (38). The air outlet of the negative pressure fan (29) is equipped with a silencer (42).

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