Cooling device

TWM686909UActive Publication Date: 2026-09-01ABILITY ENTERPRISE CO LTD
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Patent Information

Application Number
TW115200910
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-01-27
Publication Date
2026-09-01
Estimated Expiration
2036-01-26

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Abstract

The cooling device includes a container, a coolant, a cover, and first fins. The coolant is disposed inside the container, the cover is connected to the container, and the first fins are disposed inside the container. In this way, the heat energy inside the container can be convectioned to the outside through the coolant and the first fins.
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Claims

1. A cooling device, comprising: A container; a coolant disposed within the container; a cover attached to the container; And a first fin, disposed within the container.

2. A cooling device, comprising: A container; a coolant disposed within the container; a cover attached to the container; And a second fin is disposed on the cover.

3. The cooling device as described in claim 1 or 2 further includes a uniform cooling wafer disposed on the cover.

4. A cooling device, comprising: A container; a cover, which is combined with the container; A uniformly cooled wafer is disposed on the cover. And a coolant, which is disposed within the container.

5. The cooling device as claimed in claim 4, wherein the cover has a receiving hole in which the cooling wafer is disposed.

6. The cooling device as described in claim 1, 2 or 4, wherein the cover is a metal cover and / or the container is a metal container.

7. The cooling device as described in claim 1, 2 or 4, wherein the coolant is a two-phase coolant.

8. The cooling device as claimed in claim 1, wherein the cover and the first fin are integrally formed, or the first fin is disposed on the cover by means of at least one first fastener.

9. The cooling device as claimed in claim 2 further includes a convection element disposed on the second fin.

10. The cooling device as claimed in claim 3, wherein the cooling wafer includes a first power line and a second power line extending on the cover, or the first power line and / or the second power line being embedded in the cover.