Intermediate structure of wiring board, wiring board and multilayer wiring board

Abstract

This invention relates to an intermediate structure for a wiring board, a wiring board itself, and a multilayer wiring board, which enables the manufacture of multilayer wiring boards with high productivity and low cost. The intermediate structure of the wiring board is characterized by having a stack of an organic insulating film and a metal film on the organic insulating film; a recess is provided at a predetermined location for forming a through-hole, where the metal film and a portion of the organic insulating film are removed; and a recess is provided at a predetermined location for forming a trench, where the metal film is removed, exposing the organic insulating film.

Claims

1. An intermediate structure of a wiring board, characterized in that it has a stack of an organic insulating film and a metal film on the organic insulating film, a recess formed by removing the metal film and a portion of the organic insulating film at a predetermined location for forming a through hole, and a recess formed by removing the metal film and exposing the organic insulating film at a predetermined location for forming a trench.

2. An intermediate structure of a wiring board, characterized in that it comprises a stack of an organic insulating film and a metal film on the organic insulating film, a recess formed by removing the metal film and a portion of the organic insulating film at a predetermined location for forming a through hole, and a recess formed by removing the metal film and a portion of the organic insulating film at a predetermined location for forming a trench, wherein the depth dimension of the recess at the predetermined location for forming the trench is smaller than the depth dimension of the recess at the predetermined location for forming the through hole.

3. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The intermediate structure of the wiring board is an additional layer of a multilayer wiring board.

4. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The intermediate structure of the wiring board is the core layer of a multilayer wiring board.

5. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The recesses provided at the predetermined locations forming the through holes and the recesses provided at the predetermined locations forming the grooves are recesses provided by laser processing.

6. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The recesses provided at the predetermined locations forming the through holes and the recesses provided at the predetermined locations forming the trenches are etched to become through holes and trenches, respectively.

7. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The thickness of the organic insulating film is less than 100 μm, less than 50 μm, or less than 40 μm.

8. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The thickness of the organic insulating film is 1 μm or more or 5 μm or more.

9. The intermediate structure of the wiring board as described in claim 1 or 2, wherein, The thickness of the metal film is 3 μm or more and 35 μm or less, or 5 μm or more and 30 μm or less.

10. A wiring board, characterized in that the intermediate structure of the wiring board as described in any one of claims 1 to 9 is used as the intermediate structure.

11. A multilayer wiring board, characterized in that the intermediate structure of the wiring board as described in any one of claims 1 to 9 is used as the intermediate structure.

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