Multilayer low temperature co-fired ceramic

Abstract

This invention provides a multilayer low-temperature co-fired ceramic (LTC) wafer. The LTC wafer employs an overlapping laser-drilled area design, causing adjacent laser-drilled areas to partially overlap or merge, forming a composite through-hole structure. By overlapping the laser-drilled areas, this invention effectively increases the design freedom of the through-holes, improves the stability of the hole shape, and reduces the alignment accuracy requirements during the stacking of multilayer LTC wafers. This allows the overall structure to maintain conductivity even with high-layer LTC wafer designs, and enables multilayer circuit designs using LTC wafers to achieve higher density, smaller size, and better process tolerances.

Claims

1. A multilayer low-temperature co-fired ceramic sheet, comprising: a plurality of low-temperature co-fired ceramic sheets, wherein, Each layer of low-temperature co-fired ceramic sheet is provided with at least one through hole and an external electrode layer, including at least one external electrode through hole. The at least one through hole and the external electrode through hole are filled with a conductive metal material, so that the plurality of low-temperature co-fired ceramic sheets are electrically connected to the external electrode layer. The at least one through hole and the at least one external electrode through hole are formed by two circular holes.

2. The multilayer low-temperature co-fired ceramic sheet as described in claim 1, wherein, The two holes overlap and the percentage of the overlap area to the area of ​​each hole is less than 50%.

3. The multilayer low-temperature co-fired ceramic sheet as described in claim 1, wherein, The conductive metal material is selected from at least one of gold, silver, copper, molybdenum, and tungsten.

4. The multilayer low-temperature co-fired ceramic sheet as described in claim 1, wherein, An inductor circuit is printed on at least one of the multiple layers of low-temperature co-fired ceramic sheets.

5. The multilayer low-temperature co-fired ceramic sheet as described in claim 1, wherein, At least one ceramic sheet in the plurality of low-temperature co-fired ceramic sheets is used to print a capacitor circuit.

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