Integrated metering system
Patent Information
- Application Number
- TW115201801
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2024-01-21
- Filing Date
- 2024-09-11
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2034-09-10
Smart Images
Figure TWG2TB001909310_001 
Figure TWG2TB001909310_002 
Figure TWG2TB001909310_003
Abstract
Claims
1. An integrated metering system, comprising: The metering channel is configured to perform optical measurements at the metering points of the wafer; A pattern recognition imaging channel (PRIC) is configured to generate navigation image information for navigation relative to the metrology site during a metrology session, and is further configured to acquire imaging information from the wafer edge region of the wafer; a sample movement unit is configured to rapidly rotate the wafer to enable scanning of the wafer edge region. And processing circuitry, configured to process the imaging information acquired from the wafer edge region to provide metrological results regarding the wafer edge region, wherein the metrological results indicate at least one of the following: transitions between edges of different wafer layers; macroscopic defects and layer peeling; and cracks at the wafer edge.
2. The integrated metering system as described in claim 1, wherein, The wafer edge region has a radial width ranging from 0.1 cm to 4 cm from the wafer edge.
3. The integrated metering system as described in claim 1, wherein, The measurement results are used to identify the transitions between layers through which process control is implemented.
4. The integrated metering system as described in claim 1, wherein, The PRIC is configured to use different colored illumination to acquire the imaging information in order to identify the transition between the edges of different wafer layers.
5. The integrated metering system as described in claim 1, wherein, The PRIC is configured to acquire the imaging information during at least a portion of the wafer alignment session.
6. The integrated metering system as described in claim 1, wherein, The optical measurement performed by the metering channel is an optical critical dimension (OCD) measurement.
7. The integrated metering system as described in claim 6, wherein, The processing circuitry is further configured to provide the metrological results based on the fusion of data from the OCD measurements and the imaging information.
8. The integrated metering system as described in claim 1, wherein, The PRIC or the metering channel is configured for normal incident illumination of the wafer.
9. The integrated metering system as described in claim 1, wherein, The PRIC is configured to acquire the imaging information within a flexible or multiple wavelength range.
10. The integrated metering system as described in claim 9, wherein, The PRIC includes an LED irradiation source that integrates multiple LED modules with different spectral bandwidths that can be selectively used.
11. The integrated metering system as described in claim 1, wherein, The PRIC and the metering channel share at least one optical component.
12. The integrated metrology system as described in claim 1, further comprising a PRIC optical head and a metrology channel optical head, the PRIC optical head comprising one or more PRIC optical components, and the metrology channel optical head comprising one or more metrology channel optical components.
13. The integrated metering system as described in claim 12, wherein, The PRIC optical head and the metering channel optical head do not share any optical components.
14. The integrated metering system as described in claim 1, wherein, The processing circuit is configured to apply a mapping between the imaging information and the measurement results, wherein the mapping is generated through a machine learning process.