Improvement of the midsole structure of the shoe

TWM686957UActive Publication Date: 2026-09-01CHENXI FASHION CO LTD
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Patent Information

Application Number
TW115202550
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-03-23
Publication Date
2026-09-01
Estimated Expiration
2036-03-22

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Abstract

This invention discloses an improvement to the midsole structure of a shoe, suitable for high-heeled shoes. It is integrated into the upper surface of the shoe body to accommodate an additional insole. The front and rear ends of the midsole surface have front and rear receiving grooves, respectively, for the separate insertion of the front and rear cushioning pads. Corresponding receiving grooves are formed on the front and rear ends of the insole bottom surface for the insertion of the corresponding front and rear cushioning pads. The thickness of the aforementioned front and rear cushioning pads is greater than the depth of each receiving groove, so that the cushioning pads of the midsole and the insole protrude towards each other and press against each other. Through geometric interference and space filling effect, the shear force generated during walking is effectively offset, preventing the insole from sliding horizontally relative to the midsole, thereby improving the stability and comfort of the foot when wearing the shoe.
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Claims

1. An improvement to the midsole structure of a shoe, for installation in a shoe body, comprising: a midsole connected to the shoe body, wherein a first front receiving groove and a first rear receiving groove are respectively provided at the front and rear ends of the surface of the midsole; and a first front cushioning pad is inserted into the first front receiving groove, and a first rear cushioning pad corresponding to the first front receiving groove is inserted into the first rear receiving groove.

2. An improvement to the insole structure of the shoe as described in claim 1, wherein, The thickness of the first front buffer pad and the first rear buffer pad is greater than the depth of the first front receiving groove and the first rear receiving groove.

3. An improvement to the insole structure of the shoe as described in claim 1, wherein, A first hook and loop fastener is provided at the position between the first front receiving groove and the first rear receiving groove.

4. An improvement to the insole structure of the shoe as described in claim 3, wherein, The first hook and loop fastener can be a hook side or a loop side of Velcro.

5. An improvement to the insole structure of the shoe as described in claim 1, wherein, A shoe insole is further provided above the bottom of the shoe, and a second front receiving groove and a second rear receiving groove are respectively opened at the front and rear ends of the bottom surface of the shoe insole.

6. An improvement to the insole structure of the shoe as described in claim 5, wherein, A second front buffer pad is placed in the second front receiving groove, and a second rear buffer pad corresponding to the second front buffer pad is placed in the second rear receiving groove.

7. An improvement to the insole structure of the shoe as described in claim 6, wherein, The thickness of the second front buffer pad is greater than the depth of the second front receiving groove and the second rear receiving groove.

8. An improvement to the insole structure of the shoe as described in claim 5, wherein, A second hook and loop fastener is provided at the position between the second front receiving groove and the second rear receiving groove.

9. An improvement to the insole structure of the shoe as described in claim 8, wherein, The second hook and loop fastener can be a hook side or a loop side of Velcro.

10. An improvement to the insole structure of the shoe as described in claim 1, wherein, The shoe body has an inner front end with a toe protector that fits snugly against the inner wall of the toe.