Insole cushioning

Abstract

This invention discloses an inner cushioning pad for shoes, which includes a main body with a receiving groove at the bottom of the main body near the heel. A cushioning part is embedded in the receiving groove in a shape corresponding to the receiving groove. The thickness of the cushioning part protrudes from the bottom surface of the main body. In this way, when a walking step lands, the cushioning part can make elastic deformation first when it hits the ground, thereby absorbing the impact of stepping on the heel and effectively playing a local cushioning and shock absorption role to improve the comfort of the foot when walking.

Claims

1. A shoe cushioning pad for insertion into a shoe body and fitting together with a shoe sole, comprising: a main body having an arch support integrally formed on its periphery, and a receiving groove formed at the bottom of the main body; and a cushioning part embedded in the receiving groove of the main body, the cushioning part having a thickness such that the cushioning part protrudes from the bottom surface of the main body, forming a local stress point.

2. The shoe cushioning pad as described in claim 1, wherein, The arch support is an upward-convex arc shape, and its height gradually increases from the inside of the main body to the outer edge.

3. The shoe cushioning pad as described in claim 1, wherein, The cushioning part can be made of any one of the following materials: silicone, polyurethane foam, or latex.

4. The shoe cushioning pad as described in claim 1, wherein, The bottom surface of the buffer part is provided with a hook and loop fastener, and the bottom surface of the receiving groove of the main body is provided with a corresponding hook and loop fastener. The buffer part can be repeatedly disassembled and attached to the receiving groove through a velvet surface and a hook surface.

5. The shoe cushioning pad as described in claim 4, wherein, The hook and loop fastener and the opposite hook and loop fastener can be a Velcro.

6. The shoe cushioning pad as described in claim 1, wherein, The buffer can be embedded in the buffer by any of the following methods: injection molding, high-frequency welding, or ultrasonic welding.

7. The shoe cushioning pad as described in claim 1, wherein, The buffer section incorporates a first material, which is composed of a plurality of hollow bodies and is mixed into and distributed in the buffer section in a porous foamed manner.

8. The shoe cushioning pad as described in claim 1, wherein, The buffer section incorporates a second material, which is composed of a plurality of honeycomb-shaped closed cavities and distributed within the buffer section.

9. The shoe cushioning pad as described in claim 1, wherein, The buffer section incorporates a third material, which is composed of a plurality of hollow spherical foam structures and distributed within the buffer section.

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