Gas-liquid integrated heat dissipation device

Abstract

This invention relates to an integrated air-liquid cooling device, comprising an air-cooling section with a mounting portion and a plurality of heat dissipation fins formed on its outer surface and at least one heat pipe formed on its inner surface. The position of the heat pipe corresponds to the position of the mounting portion, and an electronic component is attached to one end of the heat pipe, while the other end of the heat pipe extends along the inner surface. A water-cooling section includes a water-cooling plate and a plurality of connectors. The water-cooling plate is detachably mounted on the mounting portion, and each connector connects to and communicates with the water-cooling plate. In operation, this invention integrates both air-cooling and water-cooling mechanisms. The water-cooling section does not directly contact the electronic component. Even if the water-cooling section leaks or fails, air-cooling can still provide cooling, thus providing a thermal buffer period to prevent a sudden rise in system temperature that could lead to system shutdown or damage, thereby improving operational stability.

Claims

1. A gas-liquid integrated heat dissipation device for dissipating heat from an electronic component, the gas-liquid integrated heat dissipation device comprising: a gas-cooling section including an outer side and an inner side, the outer side forming a mounting portion and a plurality of heat dissipation fins, the inner side forming at least one heat pipe, the position of the at least one heat pipe corresponding to the position of the mounting portion, and the electronic component abutting against one end of the at least one heat pipe, the other end of the at least one heat pipe extending along the inner side; a water-cooling section including a water-cooling plate and a plurality of connectors, the water-cooling plate being detachably disposed on the mounting portion, and each of the connectors being connected to and communicating with the water-cooling plate.

2. The gas-liquid integrated heat dissipation device as claimed in claim 1, wherein a fixing portion is further formed on the inner side, the position of the fixing portion corresponds to the position of the mounting portion, and one end of the at least one heat pipe is connected to the fixing portion, and the electronic component is attached to the fixing portion.

3. The gas-liquid integrated heat dissipation device as described in claim 2, wherein the gas cooling part further includes a heat-conducting plate disposed on the fixing part and abutting against the at least one heat pipe.

4. The gas-liquid integrated heat dissipation device as described in claim 1, wherein each of the heat dissipation fins surrounds the mounting portion.

5. The gas-liquid integrated heat dissipation device as claimed in claim 1, wherein the air-cooling section has two opposing ends and two side edges, the number of the at least one heat pipe is multiple, and the other end of each heat pipe extends toward one of the ends and / or one of the side edges of the air-cooling section.

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