Cooling insoles
Patent Information
- Application Number
- TW115205686
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-06-22
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2036-06-21
Smart Images

Figure 00000000_0000_ABST
Abstract
Claims
1. A cooling insole, comprising: a foamed plastic layer having at least one groove on its top surface; and at least one phase change material sheet disposed in the at least one groove.
2. The cooling insole according to claim 1 further includes a lower heat-conducting layer disposed on the bottom surface of the foamed plastic layer.
3. The cooling insole according to claim 2 further comprises at least one upper thermally conductive layer disposed in the at least one groove; in the groove, the upper thermally conductive layer is located between the phase change material sheet and the lower thermally conductive layer.
4. The cooling insole according to claim 1 further comprises at least one upper heat-conducting layer disposed in the at least one groove.
5. The cooling insole according to claim 3 or 4, wherein in the groove, the phase change material sheet is further away from the bottom surface of the foamed plastic layer than the upper thermally conductive layer.
6. The cooling insole according to claim 1, wherein the depth of the groove is 1 to 5 mm.
7. The cooling insole according to claim 6, wherein the depth of the groove is 3 mm.
8. The cooling insole according to claim 1, 6 or 7, wherein the distance from the opening of the groove to the edge of the foamed plastic layer is 0.46 mm.
9. The cooling insole according to claim 1 further comprises a woven layer disposed on the top surface of the foamed plastic layer and closing the at least one groove.
10. The cooling insole according to claim 1, wherein the foamed plastic layer is an EVA layer or a TPU layer.