Water-cooled plate device

TWM687215UActive Publication Date: 2026-09-01ASIA VITAL COMPONENTS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115205701
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-06-22
Publication Date
2026-09-01
Estimated Expiration
2036-06-21

Smart Images

  • Figure TWG2TB001909594_001
    Figure TWG2TB001909594_001
  • Figure TWG2TB001909594_002
    Figure TWG2TB001909594_002
  • Figure TWG2TB001909594_003
    Figure TWG2TB001909594_003
Patent Text Reader

Abstract

This invention provides a water-cooled plate device, including a heat-conducting base, a frame, and a cover. The frame is assembled on the heat-conducting base and defines a heat exchange chamber between the frame and the heat-conducting base. The cover is integrally mounted on the frame by 3D printing or injection molding. This invention achieves the purpose of lightweight structure, increased assembly efficiency, and reduced leakage by integrating the cover and the frame into a single structure.
Need to check novelty before this filing date? Find Prior Art

Claims

1. A water-cooled plate device, comprising: A thermally conductive base having a thermal contact side; A frame is disposed on the heat-conducting base and a heat exchange chamber is defined on the heat-conducting base; a cover is integrally disposed on the frame by 3D printing or injection molding, wherein a heat source is attached to the heat-conducting base.

2. The water-cooled plate device as described in claim 1, wherein the cover is provided with a water inlet and a water outlet.

3. The water-cooled plate device as claimed in claim 2, wherein the heat-conducting base has a heat dissipation side, the heat dissipation side is provided with a plurality of spaced heat dissipation fins and defines a plurality of heat dissipation channels, the heat dissipation fins and heat dissipation channels being located in the heat exchange chamber.

4. The water-cooled plate device as described in claim 1, wherein the cover has a covering fitting portion that covers at least one periphery of the frame and the heat-conducting base, so that the cover, the frame and the heat-conducting base are integrally fixed.

5. The water-cooled plate device as claimed in claim 1, wherein the cover system is made of a plastic material, and the plastic material is made of a polymer material or a thermally conductive composite material.

6. The water-cooled plate device as described in claim 3, wherein the cover has an inner top surface abutting the top of the heat sinks.

7. The water-cooled plate device as claimed in claim 1, wherein the frame system is integrally disposed on the heat-conducting base by 3D printing or injection molding.