Micropump liquid cooling film

TWM687220UActive Publication Date: 2026-09-01庄荣华
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115205798
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-06-24
Publication Date
2026-09-01
Estimated Expiration
2036-06-23

Smart Images

  • Figure TWG2TB001909599_001
    Figure TWG2TB001909599_001
  • Figure TWG2TB001909599_002
    Figure TWG2TB001909599_002
  • Figure TWG2TB001909599_003
    Figure TWG2TB001909599_003
Patent Text Reader

Abstract

This invention is a micro-pump liquid-cooled diaphragm comprising a cooling plate body and at least one piezoelectric micro-liquid pump. The piezoelectric micro-liquid pump pressurizes the coolant, causing it to circulate within cooling channels inside the cooling plate body, thereby cooling the electronic device. The focus of this invention is heat transfer rather than heat dissipation and pressure loss control. The micro-pump liquid-cooled diaphragm acts as a heat transfer device, transferring heat to the housing or a distant cooling plate. The cooling channels require extremely low pressure loss, therefore the head of the piezoelectric micro-liquid pump can meet the pressure loss requirements.
Need to check novelty before this filing date? Find Prior Art

Claims

1. A micro-pump liquid-cooled diaphragm, comprising: a cooling plate body, including: a plurality of cooling channels disposed inside the cooling plate body, each cooling channel containing coolant; at least one heat-collecting region disposed in the cooling plate body and surrounded by the cooling channels; at least one pressurization region disposed in the cooling plate body and located above the cooling channels; at least one piezoelectric micro-liquid pump disposed in the pressurization region for pressurizing the coolant in the cooling channels; wherein, The cooling plate is attached to at least one electronic device. The heat collection area concentrates the heat generated by the operating electronic device and exchanges heat with the coolant. The piezoelectric micro-liquid pump pressurizes the coolant, causing the coolant to circulate in the cooling channel.

2. The micropump liquid-cooled diaphragm as described in claim 1, wherein, The cooling water system comprises a plurality of main water channels and a plurality of secondary water channels, wherein the width of the main water channels is greater than that of the secondary water channels.

3. The micropump liquid-cooled diaphragm as described in claim 2, wherein, The cooling plate body further includes at least one tapered flow channel, which is located inside the cooling plate body and in at least one of the main water channels.

4. The micropump liquid-cooled diaphragm as described in claim 1, wherein, The cooling plate further includes at least one flow distribution area located inside the cooling plate and communicating with the cooling water channel.

5. The micropump liquid-cooled diaphragm as described in claim 1, wherein, The pressurization zone includes at least one cavity, at least one first check valve and at least one second check valve. The cavity is located above the cooling water channel, and the first check valve and the second check valve are located between the cavity and the cooling water channel.

6. The micropump liquid-cooled diaphragm as described in claim 1, wherein, This piezoelectric micro-liquid pump uses a piezoelectric ceramic plate.