LED package structure
Patent Information
- Application Number
- TW114208426
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2025-08-11
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-08-10
Smart Images
Figure TWG2TB001910883_001 
Figure TWG2TB001910883_002 
Figure TWG2TB001910883_003
Abstract
Claims
1. A light-emitting diode (LED) packaging structure, comprising: Circuit board; At least one light-emitting unit is packaged on the circuit board; A cover plate is stacked on the circuit board to form at least one cavity, in which the light-emitting unit is located; a high-temperature resistant encapsulating adhesive is filled in the cavity to cover the light-emitting unit; and an adhesive layer is disposed between the cover plate and the circuit board, the adhesive layer being adjacent to the cover plate and the circuit board and surrounding the light-emitting unit.
2. The light-emitting diode encapsulation structure as claimed in claim 1, wherein the adhesive layer melts when heated and solidifies upon cooling.
3. The light-emitting diode packaging structure as described in claim 2, wherein the circuit board further has a barrier wall enclosing an area in which the light-emitting unit is located, the adhesive layer is located outside the area, and the barrier wall prevents the melted adhesive layer from entering the area.
4. The light-emitting diode packaging structure as described in claim 3, wherein the circuit board includes an insulating plate and a plurality of copper layers, and the barrier is a partial structure of the copper layers, standing on the insulating plate.
5. The light-emitting diode packaging structure as claimed in claim 4, wherein the cover plate is formed by machining an opening in another insulating plate, and the adhesive layer is attached between the insulating plate and the other insulating plate.
6. The light-emitting diode package structure as described in claim 5, wherein the opening conforms to the outer contour of the circuit board.
7. The light-emitting diode packaging structure as claimed in claim 3, wherein the circuit board further has a guide groove disposed along its outer periphery, surrounding the barrier, and the adhesive layer is confined within the guide groove and between the barrier and the guide groove.
8. The light-emitting diode packaging structure as claimed in claim 2, wherein the circuit board further has a guide groove disposed along the outer periphery to allow the melted adhesive layer to overflow and to prevent the melted adhesive layer from overflowing into the circuit board.
9. The light-emitting diode packaging structure as claimed in claim 8, wherein the circuit board includes an insulating plate and a plurality of copper layers, and the guide groove is a partial structure of the copper layers and is located at the outer periphery of the insulating plate.
10. The light-emitting diode packaging structure as claimed in claim 9, wherein the cover plate is formed by machining an opening in another insulating plate, and the adhesive layer is attached between the insulating plate and the other insulating plate.
11. The light-emitting diode package structure as described in claim 10, wherein the opening conforms to the outer contour of the circuit board.
12. The light-emitting diode packaging structure as claimed in claim 8, wherein the circuit board further has a baffle surrounding the light-emitting unit and being surrounded by the guide groove, and the adhesive layer is confined in the guide groove and between the baffle and the guide groove.
13. The light-emitting diode packaging structure as claimed in claim 1, wherein the circuit board further includes at least one heat-conducting pillar connecting two opposing surfaces of the circuit board, the light-emitting unit and the cover plate being located on one of the two surfaces, and the heat generated by the light-emitting unit being transferred to the other of the two surfaces via the heat-conducting pillar.
14. The light-emitting diode package structure as claimed in claim 13, wherein the circuit board includes an insulating plate and a plurality of copper layers, the insulating plate having at least one through hole, and the copper layers partially filling the through hole to form the heat-conducting pillar.
15. The light-emitting diode packaging structure as claimed in claim 1, wherein the circuit board includes an insulating plate and a plurality of copper layers, the copper layers being distributed inside and outside the insulating plate to form electrodes, heat-conducting pillars, baffles, conductive grooves and wires respectively, and the light-emitting unit is electrically connected to the wires and the electrodes.
16. The light-emitting diode packaging structure as claimed in claim 1, wherein the cover plate includes an insulating plate and a metal layer, the metal layer being draped over the insulating plate and extending from at least a portion of the upper surface of the insulating plate through the inner wall surface of the cavity to at least a portion of the lower surface of the insulating plate.