Electronic tag and electronic toll collection system

TWM687241UActive Publication Date: 2026-09-11MUTUAL PAK TECH
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Patent Information

Application Number
TW114210620
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2025-10-07
Publication Date
2026-09-11
Estimated Expiration
2035-10-06

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  • Figure TWG2TB001910886_001
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    Figure TWG2TB001910886_003
Patent Text Reader

Abstract

An electronic tag includes an insulating substrate, a line antenna disposed on the surface of the insulating substrate, and electronic circuit elements disposed on the insulating substrate. The line antenna includes a first conductive layer, a second conductive layer, and a third conductive layer arranged sequentially. The first conductive layer is adjacent to the insulating substrate, the third conductive layer is away from the insulating substrate, and the second conductive layer is disposed between the first and third conductive layers. The color of the first conductive layer is similar to or the same as the color of the third conductive layer. The electronic circuit elements are in a leadless dual-flat package and have a non-reverse RF signal pin and a reverse RF signal pin, wherein the non-reverse RF signal pin and the reverse RF signal pin are electrically connected to the line antenna.
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Claims

1. An electronic tag, comprising: An insulating substrate (110); a line antenna (120) disposed on one surface (112) of the insulating substrate (110), wherein the line antenna (120) includes a first conductive layer (121), a second conductive layer (123), and a third conductive layer (125) disposed sequentially, the first conductive layer (121) being adjacent to the insulating substrate (110), the third conductive layer (125) being away from the insulating substrate (110), and the second conductive layer (123) being disposed between the first conductive layer (121) and the third conductive layer (125). Between the first conductive layer (121) and the third conductive layer (125), and the color of the first conductive layer (121) is similar to or the same as the color of the third conductive layer (125); and an electronic circuit element (130) disposed on the insulating substrate (110), which is a chip in a leadless dual flat (DFN) package and has a non-reverse radio frequency signal pin (RF+) and a reverse radio frequency signal pin (RF-), wherein the non-reverse radio frequency signal pin (RF+) and the reverse radio frequency signal pin (RF-) are electrically connected to the line antenna (120).

2. The electronic tag as claimed in claim 1, wherein the bare die (136) in the electronic circuit element (130) is electrically connected to a non-reverse radio frequency signal pin (RF+) and a reverse radio frequency signal pin (RF-) through a plurality of leads (138), and there is no metal pad between the middle bottom of the bare die (136) and the line antenna (120), so that the parasitic capacitance effect between the electronic circuit element (130) and the line antenna (120) is effectively reduced.

3. The electronic tag as described in claim 2, wherein the electronic circuit element (130) comprises: A power management unit (131) is electrically connected to the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-), and is used to receive a non-reverse RF received signal and a reverse RF received signal from the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-) respectively, wherein the non-reverse RF received signal and the reverse RF received signal are a set of differential RF received signals, and the power management unit (131) uses the set of differential RF received signals to generate a power supply to the electronic circuit element (130); a modulation / demodulation unit (133) is electrically connected to the power management unit (131), and is used to receive the set of differential RF received signals and demodulate them to generate a demodulated signal; an oscillation unit (135) is electrically connected to the modulation / demodulation unit (133), and is used to provide an oscillation signal for the modulation / demodulation unit (133) to use during the modulation / demodulation process; A control unit (137) electrically connected to the oscillation unit (135) and the modulation / demodulation unit (133); and a memory unit (139) electrically connected to the control unit (137), wherein the control unit (137) accesses and / or updates at least one piece of data stored in the memory unit (139) based on the demodulation signal.

4. The electronic tag as described in claim 3, wherein the control unit (137) reads the data stored in the memory unit (139) and causes the modulation / demodulation unit (133) to generate a modulation signal based on the data, the power management unit (131) receives the modulation signal and generates a non-reverse RF transmission signal and a reverse RF transmission signal to the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-) respectively, wherein the non-reverse RF transmission signal and the reverse RF transmission signal are a set of differential RF transmission signals.

5. The electronic tag as described in claim 3, wherein the electronic circuit element (130) further comprises: An automatic adjustment unit (134) is electrically connected to the control unit (137) and the power management unit (131), wherein the control unit (137) controls the automatic adjustment unit (134) to be enabled or disabled, and when the automatic adjustment unit (134) is enabled, the automatic adjustment unit (134) adjusts a matching capacitor value of the electronic circuit element (130) according to the set of differential radio frequency received signals.

6. The electronic tag as claimed in claim 1, wherein the electronic circuit element (130) further includes a first bonding pad (132a) and a second bonding pad (132b) located at its bottom, and the first bonding pad (132a) and the second bonding pad (132b) are electrically connected to the non-reverse radio frequency signal pin (RF+) and the reverse radio frequency signal pin (RF-), respectively.

7. The electronic tag as described in claim 6 further includes: Four solder pads (140), wherein two of the four solder pads (140) are connected between the first bonding pad (132a) and the line antenna (120) so that the non-reverse RF signal pin (RF+) is electrically connected to the line antenna (120), and the other two of the four solder pads (140) are connected between the second bonding pad (132b) and the line antenna (120) so that the reverse RF signal pin (RF-) is electrically connected to the line antenna (120).

8. The electronic tag as described in claim 7, wherein the insulating substrate (110) is transparent or translucent.

9. The electronic tag as claimed in claim 8, wherein the materials of the first conductive layer (121), the second conductive layer (123), and the third conductive layer (125) are different from each other.

10. The electronic tag as claimed in claim 9, wherein the material of the first conductive layer (121) is one of aluminum and silver, and the material of the third conductive layer (125) is the other of aluminum and silver.

11. The electronic tag as claimed in claim 9, wherein the conductivity of the material of the second conductive layer (123) is better than either the conductivity of the material of the first conductive layer (121) or the conductivity of the material of the third conductive layer (125).

12. The electronic tag as described in claim 10, wherein the material of the second conductive layer (123) is copper.

13. The electronic tag as claimed in claim 8, wherein the line antenna (120) includes a long straight segment (122), two end segments (124), two connecting segments (126) and a U-shaped segment (128), the connecting segments (126) being connected to opposite ends of the long straight segment (122), each connecting segment (126) being connected to one end of a corresponding one of the end segments (124) such that each connecting segment (126) is located between the long straight segment (122) and the corresponding end segment (124), the U-shaped segment (128) being located beside the long straight segment (122) and between the connecting segments (126), and the U-shaped segment (128) and a portion of the long straight segment (122) enclosing an area (A1).

14. The electronic tag as described in claim 13, wherein the angle (θ) formed by an inner edge of each connecting line segment (126) and an inner edge of the long straight line segment (122) is between 90 and 135 degrees.

15. The electronic tag as claimed in claim 14, wherein the angle (δ) formed by an inner edge of each connecting segment (126) and an inner edge of the corresponding end segment (124) is between 60 and 90 degrees.

16. The electronic tag as described in claim 13, wherein the area of ​​the region (A1) is between 50 and 250 square millimeters.

17. The electronic tag as described in claim 1, further comprising: An insulating protective layer (150) is used to cover the electronic circuit element (130) and the line antenna (120); A high-flow adhesive layer (160) is disposed under a surface near the line antenna (120) so that the insulating protective layer (150) covers the electronic circuit element (130) and the line antenna (120) by adhesive means; wherein the high-flow adhesive layer (160) is formed of an adhesive material with a melt index (MI) greater than 5, and partially overflows the periphery of the line antenna (120) to form a light-colored opaque outline along the periphery of the line antenna (120).

18. An electronic tag comprising: an insulating substrate (110); a line antenna (120) disposed on a surface (112) of the insulating substrate (110), including a long straight segment (122), two end segments (124), two connecting segments (126) and a U-shaped segment (128), wherein the connecting segments (126) are respectively connected to opposite ends of the long straight segment (122), each connecting segment (126) is connected to one end of a corresponding one of the end segments (124) such that each connecting segment (126) is located between the long straight segment (122) and the corresponding end segment (124), and the U-shaped segment (128) is... 28) Located beside the long straight segment (122) and between the connecting segments (126), and the U-shaped segment (128) and a portion of the long straight segment (122) enclose an area (A1); and an electronic circuit element (130) disposed on the insulating substrate (110), which is in the form of a leadless dual flat (DFN) package and has a non-reverse RF signal pin (RF+) and a reverse RF signal pin (RF-), wherein the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-) are electrically connected to the line antenna (120).

19. The electronic tag as claimed in claim 18, wherein the bare die (136) in the electronic circuit element (130) is electrically connected to a non-reverse radio frequency signal pin (RF+) and a reverse radio frequency signal pin (RF-) through a plurality of leads (138), and there is no metal pad between the middle bottom of the bare die (136) and the line antenna (120), so that the parasitic capacitance effect between the electronic circuit element (130) and the line antenna (120) is effectively reduced.

20. The electronic tag as claimed in claim 19, wherein the electronic circuit element (130) comprises: A power management unit (131) is electrically connected to the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-), and is used to receive a non-reverse RF received signal and a reverse RF received signal from the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-) respectively, wherein the non-reverse RF received signal and the reverse RF received signal are a set of differential RF received signals, and the power management unit (131) uses the set of differential RF received signals to generate a power supply to the electronic circuit element (130); a modulation / demodulation unit (133) is electrically connected to the power management unit (131), and is used to receive the set of differential RF received signals and demodulate them to generate a demodulated signal; an oscillation unit (135) is electrically connected to the modulation / demodulation unit (133), and is used to provide an oscillation signal for the modulation / demodulation unit (133) to use during the modulation / demodulation process; A control unit (137) electrically connected to the oscillation unit (135) and the modulation / demodulation unit (133); and a memory unit (139) electrically connected to the control unit (137), wherein the control unit (137) accesses and / or updates at least one piece of data stored in the memory unit (139) based on the demodulation signal.

21. The electronic tag as claimed in claim 20, wherein the control unit (137) reads the data stored in the memory unit (139) and causes the modulation / demodulation unit (133) to generate a modulation signal based on the data, the power management unit (131) receives the modulation signal and generates a non-reverse RF transmission signal and a reverse RF transmission signal to the non-reverse RF signal pin (RF+) and the reverse RF signal pin (RF-) respectively, wherein the non-reverse RF transmission signal and the reverse RF transmission signal are a set of differential RF transmission signals.

22. The electronic tag as claimed in claim 20, wherein the electronic circuit element (130) further comprises: An automatic adjustment unit (134) is electrically connected to the control unit (137) and the power management unit (131), wherein the control unit (137) controls the automatic adjustment unit (134) to be enabled or disabled, and when the automatic adjustment unit (134) is enabled, the automatic adjustment unit (134) adjusts a matching capacitor value of the electronic circuit element (130) according to the set of differential radio frequency received signals.

23. The electronic tag as claimed in claim 18, wherein the electronic circuit element (130) further includes a first bonding pad (132a) and a second bonding pad (132b) located at its bottom, and the first bonding pad (132a) and the second bonding pad (132b) are electrically connected to the non-reverse radio frequency signal pin (RF+) and the reverse radio frequency signal pin (RF-), respectively.

24. The electronic tag as described in claim 23 further includes: Four solder pads (140), wherein two of the four solder pads (140) are connected between the first bonding pad (132a) and the line antenna (120) so that the non-reverse RF signal pin (RF+) is electrically connected to the line antenna (120), and the other two of the four solder pads (140) are connected between the second bonding pad (132b) and the line antenna (120) so that the reverse RF signal pin (RF-) is electrically connected to the line antenna (120).

25. The electronic tag as claimed in claim 24, wherein the insulating substrate (110) is transparent or translucent.

26. The electronic tag as described in claim 18, wherein the angle (θ) formed by an inner edge of each connecting line segment (126) and an inner edge of the long straight line segment (122) is between 90 and 135 degrees.

27. The electronic tag as claimed in claim 18, wherein the angle (δ) formed by an inner edge of each connecting segment (126) and an inner edge of the corresponding end segment (124) is between 60 and 90 degrees.

28. The electronic tag as described in claim 18, wherein the area of ​​the region (A1) is between 50 and 250 square millimeters.

29. The electronic tag as described in claim 18, further comprising: An insulating protective layer (150) is used to cover the electronic circuit element (130) and the line antenna (120); A high-flow adhesive layer (160) is disposed under a surface near the line antenna (120) so that the insulating protective layer (150) covers the electronic circuit element (130) and the line antenna (120) by adhesive means; wherein the high-flow adhesive layer (160) is formed of an adhesive material with a melt index (MI) greater than 5, and partially overflows the periphery of the line antenna (120) to form a light-colored outline along the periphery of the line antenna (120).

30. An electronic toll collection system, comprising: The electronic tag (100) as described in any one of claims 1 to 29 is affixed to a vehicle (V); and at least one reading device (200) is installed on a facility on a toll road and is communicatively connected to the electronic tag (100) of the vehicle (V) traveling on the toll road, so as to read the electronic tag (100).

31. The electronic toll collection system as claimed in claim 30, wherein the electronic tag (100) is affixed to a glass window (W) of the vehicle (V).

32. The electronic toll collection system as claimed in claim 31, wherein the glass window (W) is a windshield.