Heat dissipation structure

Abstract

A heat dissipation structure includes a fixing component and a water-cooling head module. The fixing component includes a connector and two fixing pins. The connector is adapted to be mounted on a circuit board. One end of each fixing pin is adapted to pass through the connector. The water-cooling head module includes a water-cooling head body, a bracket, two sliding members, and a clamping device. The water-cooling head body contacts a heat-generating element and is movably located within the bracket. The two sliding members are movably mounted on the bracket, each sliding member having a through hole and a fixing hole communicating with the through hole. The clamping device is movably connected to the bracket and abuts against the water-cooling head body. When the two sliding members are moved toward the bracket by an external force, the two fixing pins are adapted to pass through the corresponding through holes. When the external force is removed, the two sliding members move away from the bracket, causing the two fixing pins to move to the corresponding fixing holes, and the clamping device is adapted to rotate so that the water-cooling head body abuts against the heat-generating element.

Claims

1. A heat dissipation structure adapted to be mounted on a circuit board having a first side and a second side opposite to each other, the first side being adapted to mount a heat-generating element, the heat dissipation structure comprising: A fixing assembly includes: a connector adapted to be disposed on the first surface or the second surface; and at least two fixing pins, one end of which is adapted to pass through the connector and extend in a first direction; and a water-cooling head module including: a water-cooling head body including a first side and a second side opposite to each other, the first side being adapted to contact the heating element; a bracket adjacent to the second side, the water-cooling head body being movably located within the bracket; two sliding members movably disposed on opposite sides of the bracket along a second direction, each sliding member having a through hole and a fixing hole communicating with the through hole, wherein the second direction is perpendicular to the first direction; and a clamping device movably connected to the bracket and abutting against the second side. When the two sliding members are subjected to an external force and move toward the bracket in the second direction, the at least two fixing pins are adapted to pass through the corresponding through holes. When the external force is removed, the two sliding members move away from the bracket in the second direction, causing the at least two fixing pins to move to the corresponding fixing holes. The clamping device is adapted to rotate so that the water cooling head body moves toward the first surface and abuts against the heating element.

2. The heat dissipation structure as claimed in claim 1, wherein the fixing component further includes a plurality of elastic members, which are respectively disposed between the connector and the other end of the corresponding at least two fixing pins.

3. The heat dissipation structure as claimed in claim 1, wherein the clamping device is a rotating assembly adapted to rotate along a rotation axis parallel to the first direction, the rotating assembly including a cap and a stop member, the stop member being fixed to the cap, screwed to the bracket and abutting against the water cooling head body.

4. The heat dissipation structure as claimed in claim 3, wherein the rotating component further includes a first stop and the bracket further includes a second stop, the first stop being adapted to abut against the second stop in the first direction.

5. The heat dissipation structure as claimed in claim 4, wherein the rotating assembly further includes a protrusion, the bracket has a plurality of openings arranged in a circle, and the protrusion is adapted to move from one of the openings to another when the first stop abuts against the second stop in the first direction and the rotating assembly rotates.

6. The heat dissipation structure as claimed in claim 1, wherein one of the bracket and each of the sliding members has a slider, and the other of the bracket and each of the sliding members has a groove extending along the second direction, and the slider is movably connected to the groove.

7. The heat dissipation structure as claimed in claim 1, wherein the clamping device is a cam adapted to rotate along a rotation axis perpendicular to the first direction and the second direction, and the bracket is adapted to move away from the circuit board along the first direction as the cam is positioned.

8. The heat dissipation structure as claimed in claim 1, wherein when the connector is attached to the second side, the at least two retaining pins pass through the circuit board.

9. The heat dissipation structure as claimed in claim 1, wherein the bracket further includes at least one connecting rod connected between the bracket and the water cooling head body.

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