Automotive electronic devices adopting water-cooling architecture

Abstract

A water-cooled automotive electronic device includes a circuit board, at least one first heat source, at least one second heat source, an inlet port, a first chamber, a connecting pipe, a first heat dissipation structure, a second chamber, and an outlet port. The first heat source is disposed on the circuit board. The second heat source is disposed on the circuit board, wherein the heat generated by the first heat source is greater than the heat generated by the second heat source. The first chamber is connected to the inlet port and is thermally connected to the first heat source. The connecting pipe connects to the first chamber. The first heat dissipation structure is disposed within the first chamber. The second chamber is connected to the connecting pipe and is thermally connected to the second heat source. The outlet port connects to the second chamber.

Claims

1. A vehicle electronic device employing a water-cooled architecture, comprising: A circuit board; At least one primary heat source is located on the circuit board; At least one second heat source is disposed on the circuit board, wherein the heat generated by the first heat source is greater than the heat generated by the second heat source; an inlet port; a first chamber connected to the inlet port, wherein the first chamber is thermally connected to the first heat source; a connecting pipe connected to the first chamber; a first heat dissipation structure disposed within the first chamber; a second chamber connected to the connecting pipe, wherein the second chamber is thermally connected to the second heat source; and an outlet port connected to the second chamber, wherein a cooling fluid enters the first chamber from the inlet port, flows through the first heat dissipation structure, passes through the connecting pipe, enters the second chamber, and finally exits the water-cooled automotive electronic device from the outlet port.

2. The automotive electronic device employing a water-cooled architecture as described in claim 1, wherein, The first heat dissipation structure includes a plurality of heat dissipation fins, at least some of which are arranged in a parallel manner to each other.

3. The automotive electronic device employing a water-cooled architecture as described in claim 2, wherein, The heat dissipation fins include a plurality of first heat dissipation fins and a plurality of second heat dissipation fins. The first heat dissipation fins are located at the center of the first chamber, and the second heat dissipation fins are closer to the side wall of the first chamber. The first heat dissipation fins have a first spacing between them, and the second heat dissipation fins have a second spacing between them. The first spacing is greater than the second spacing.

4. The automotive electronic device employing a water-cooled architecture as described in any one of claims 1 to 3, wherein, The first chamber is at least partially surrounded by the second chamber.

5. The automotive electronic device employing a water-cooled architecture as described in claim 4, further comprising a device body, a top cover, and a bottom shell, wherein, The bottom shell is connected to the device body. The circuit board, the first heat source and the second heat source are located between the bottom shell and the device body. A U-shaped groove is formed on the device body. The top cover covers the U-shaped groove. The top cover and the U-shaped groove together constitute the second chamber.

6. The automotive electronic device employing a water-cooled architecture as described in claim 5, wherein, The device body has a groove formed therein, the U-shaped groove surrounds the groove, and the first chamber is embedded in the groove.

7. The automotive electronic device employing a water-cooled architecture as described in claim 6, wherein, The first chamber is locked and fixed to the circuit board and covers the first heat source accordingly.

8. The automotive electronic device employing a water-cooled architecture as described in claim 7, wherein, An outer groove is formed on the first chamber, and the first heat source corresponds to the outer groove.

9. The automotive electronic device employing a water-cooled architecture as described in claim 4, further comprising a second heat dissipation structure, wherein, The second heat dissipation structure is located inside the second chamber, and the structural density of the second heat dissipation structure is lower than that of the first heat dissipation structure.

10. The automotive electronic device employing a water-cooled architecture as described in claim 4, wherein, When the number of the first heat sources is multiple, the first heat dissipation structures are arranged along a main flow direction of the cooling fluid and correspond to the first heat sources, and the first heat sources are simultaneously thermally connected to the first chamber.

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