Substrate repair equipment for peeling system

Abstract

The substrate repair equipment of this invention includes a caulking device, a peeling device, and a conveying device. The caulking device includes a feeding platform and a caulking module. The feeding platform carries a device to be separated. The caulking module fills the defect interface of the substrate containing the device to be separated with a caulking material. The peeling device performs a curing process on the caulking material on the substrate to make the overall refractive index of the substrate approximately uniform. Subsequently, a modification peeling process is performed on the adhesive layer to cause the adhesive layer on the device to lose its bonding strength. The conveying device is positioned relative to the caulking device and the peeling device to transport and convey the device to be separated.

Claims

1. A substrate repair device for a peeling system, comprising: A caulking device includes a feeding platform and a caulking module. The feeding platform carries a device to be separated, which includes a substrate, an adhesive layer, and a semiconductor product. The substrate has a front side, a back side, a defect interface, a normal refractive index, and a defect refractive index. The semiconductor product is bonded to the front side of the substrate through the adhesive layer. The defect interface is formed on the back side. The normal refractive index is the refractive index of the substrate other than the defect interface, and the defect refractive index is the refractive index of the defect interface and is different from the normal refractive index. The caulking module is positioned relative to the feeding platform to fill the defect interface of the substrate with a caulking material. A peeling device is used to perform a curing process on the caulking material on the substrate to make the normal refractive index the same as the defect refractive index, and then perform a modification peeling process on the adhesive layer to make the adhesive layer lose its bonding force. A conveying device is positioned relative to the caulking device and the peeling device to transport and convey the device to be separated.

2. The substrate repair apparatus of the peeling system as described in claim 1, wherein, The caulking device includes a rotating module connected to the feeding platform to drive the feeding platform to rotate.

3. The substrate repair apparatus of the peeling system as described in claim 1, wherein, The caulking device includes a moving unit connected to the caulking module to move the caulking module relative to the feed platform.

4. The substrate repair apparatus of the peeling system as described in claim 1, wherein, The feeding platform holds the device to be separated in place by an adsorption force.

5. The substrate repair apparatus of the peeling system as described in claim 4, wherein, The sealant consists of a light-curing resin.

6. A substrate repair apparatus for a stripping system as described in claim 1, wherein, The peeling device performs the curing and modification processes through at least one light source.

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