Microchannel liquid cooling plate and heat dissipation module having the microchannel cooling plate

Abstract

This invention relates to a microchannel liquid cooling plate and a heat dissipation module. The microchannel liquid cooling plate comprises a base and multiple fins, all of which are integrally connected to the base and arranged in parallel. Each fin has a main fin and secondary fins for increasing the contact area with the refrigerant and for separating channels. The main fins are integrally connected to the base, and the secondary fins are integrally connected to the main fins. This invention increases the contact area between the fins and the refrigerant, and the secondary fins separate the original single channels between adjacent fins into multiple channels, effectively acting as refrigerant channel separators. This allows the refrigerant to fully contact the microchannel liquid cooling plate, improving heat exchange efficiency and ultimately enhancing the heat dissipation efficiency of the microchannel liquid cooling plate. This, in turn, meets the increasing heat dissipation demands brought about by the continuous improvement of AI computing power.

Claims

1. A microchannel liquid cooling plate, comprising: The fins are provided with a base and multiple fins, all of which are integrally connected to the base and are distributed in parallel. The gaps between the fins and adjacent fins form channels for the refrigerant. Each fin is provided with a main fin and a secondary fin for increasing the contact area with the refrigerant and separating the channels. The main fin is integrally connected to the base, and the secondary fin is integrally connected to the main fin.

2. The microchannel liquid cooling plate as described in claim 1, wherein, All the accessory fins are oriented in the same direction.

3. The microchannel liquid cooling plate as described in claim 1 or 2, wherein, The distal segment of the accessory fin extends toward the sidewall of the adjacent primary fin.

4. The microchannel liquid cooling plate as described in claim 3, wherein, The secondary fin is a layered structure newly formed after the sides of the fin are scraped off, and the primary fin is the remaining structure of the fin after the secondary fin is scraped off.

5. The microchannel liquid cooling plate as described in claim 3, wherein, The plane containing the base is defined as the bottom surface, and the plane opposite to the bottom surface is defined as the top surface; the opening of the shovel angle between the secondary fin and the primary fin faces the top surface; or the opening of the shovel angle between the secondary fin and the primary fin faces the bottom surface.

6. The microchannel liquid cooling plate as described in claim 1, wherein, In the cross-section of the fin, the area of ​​the secondary fin is smaller than the area of ​​the primary fin.

7. The microchannel liquid cooling plate as described in claim 6, wherein, The tips of all the main fins are bent and sealed against the adjacent main fins, thus forming a closed top surface.

8. The microchannel liquid cooling plate as described in claim 6, wherein, The area formed by the upper surfaces of all fins is defined as the upper region; the upper region is divided into multiple sub-regions, and the dividing line between two adjacent sub-regions is perpendicular to the extension line formed by the fins; there is at least one sub-region in which the tip of the main fin is bent and sealed against the adjacent main fin, thereby forming a partially closed surface, and the sub-region of the partially closed surface is defined as the welding area.

9. The microchannel liquid cooling plate as described in claim 8, wherein, The sub-region other than the welding area is defined as the open area; a gap is provided between the welding area and the adjacent open area; the gap is formed by the notch of the fin; the notch extends from the middle of the fin to the top; below the gap, the channel at the bottom of the fin is continuous.

10. A heat dissipation module that uses a microchannel liquid cooling plate as described in any one of claims 1 to 9.

Images