A semiconductor component clamping device

Abstract

A semiconductor device clamping device includes a base, a carrier plate, and a plurality of clamping units. The carrier plate is disposed on the base and carries one or more workpieces, each workpiece having a surface extending along a plane. Each clamping unit is fixed to the base and includes a pressure rod disposed above the carrier plate and movable relative to the carrier plate in a vertical direction, and an elastic component coupled to a first end of the pressure rod and abutting against the carrier plate in the vertical direction. The elastic component causes the pressure rod to apply pressure to the workpiece in the vertical direction. The elastic stroke of the elastic component creates a maximum height for placing one or more workpieces in the vertical direction between the carrier plate and a second end of the pressure rod, and this elastic stroke is greater than 6 mm.

Claims

1. A semiconductor device clamping device, comprising: A base; A support plate is disposed on the base and carries one or more workpieces, the workpieces having a surface extending along a planar direction; The device includes multiple clamping units fixed to the base. Each clamping unit includes a pressure rod disposed above the support plate and movable relative to the support plate in a vertical direction, and an elastic component coupled to a first end of the pressure rod and abutting against the support plate in the vertical direction. The elastic component causes the pressure rod to apply pressure to the workpiece in the vertical direction. The elastic stroke of the elastic component allows a maximum height for placing one or more workpieces in the vertical direction to be formed between the support plate and a second end of the pressure rod. The elastic stroke is greater than 6 mm.

2. The semiconductor element clamping device as claimed in claim 1, wherein, It also includes multiple adjustment units fixed to the base and coupled to the carrier plate. The adjustment unit is used to control the position of the carrier plate relative to the base and adjust the parallelism of the surface of the workpiece. The adjustment unit includes a first driving element, an extension rod axially coupled to the first driving element, and a crossbar radially coupled to the extension rod and the carrier plate.

3. The semiconductor element clamping device as claimed in claim 1, wherein, The clamping unit also includes a second drive element fixed to the base, a steering drive element coupled to and driving the pressure rod to rotate axially, and a shaft axially coupled between the second drive element and the elastic component.

4. The semiconductor element clamping device as claimed in claim 1, wherein, The flexible travel ranges from 6 mm to 20 mm.

5. The semiconductor element clamping device as claimed in claim 3, wherein, The elastic component includes a shaft portion extending along the vertical direction and coupled to the shaft and the pressure bar, a stop portion fixed to the shaft portion, and an elastic element sleeved on the shaft portion and disposed between the bearing plate and the stop portion.

6. The semiconductor element clamping device as claimed in claim 1, wherein, It also includes a limiting unit coupled between the base and the bearing plate. The limiting unit includes a limiting part fixed to the base and a load part fixed to the bearing plate and having a vertical degree of freedom relative to an axis of the limiting part. A limiting surface of the limiting part is separated from an upper surface of the base by a distance. The vertical degree of freedom of the load part in the direction toward the base is limited by the limiting surface.

7. The semiconductor element clamping device as claimed in claim 2, wherein, Multiple adjustment units are symmetrically arranged relative to a central axis of the bearing plate.

8. The semiconductor element clamping device as claimed in claim 1, wherein, Multiple clamping units are symmetrically arranged relative to a central surface of the carrier plate.

9. The semiconductor element clamping device as claimed in claim 2, wherein, The base includes a first substrate and a second substrate connected to and spaced apart from the first substrate in the vertical direction by a distance. The adjustment unit is disposed on the first substrate and the clamping unit is disposed on the second substrate.

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