Memory module

Abstract

A memory module includes a circuit board, at least one chip, a thermally conductive material, and a coating. The at least one chip is disposed on the circuit board. The thermally conductive material is coated on at least one side of the at least one chip. The coating covers the at least one chip and the thermally conductive material. The coating contains a fullerene material. The combination of the thermally conductive material and the coating effectively improves the heat dissipation efficiency of the memory module.

Claims

1. A memory module comprising: a circuit board; at least one chip disposed on the circuit board; a thermally conductive material coated on at least one side of the at least one chip; and a coating covering the at least one chip and the thermally conductive material, the coating comprising a fullerene material.

2. The memory module as described in claim 1, wherein the thermally conductive material is coated on the four sides of the at least one chip.

3. The memory module as described in claim 1, wherein the coating further covers an area on the circuit board other than the at least one chip.

4. The memory module as described in claim 1, wherein the thermally conductive material is silicone.

5. The memory module as described in claim 1, wherein the thermal conductivity of the thermally conductive material is greater than or equal to 2.8 W / mK.

6. The memory module as described in claim 1, wherein the thermal conductivity of the coating is greater than or equal to 300 W / mK.

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