Composite liquid metal thermal interface structure and its electronic component assembly

Abstract

A composite liquid metal thermal interface structure with a micro-roughened mesh framework comprises a corrosion-resistant metal carrier and a plurality of heat-conducting media. The upper and lower surfaces of the corrosion-resistant metal carrier form a porous structure with a plurality of pores, and the metal carrier is selected from nickel sheet, metal woven mesh, or metal wool. The plurality of heat-conducting media are composed of low-melting-point liquid metal and adhere to the pores of the porous structure through capillary action. The corrosion-resistant metal carrier has a specific arithmetic mean surface roughness, ranging from 0.3 micrometers to 0.8 micrometers. This design allows the low-melting-point liquid metal to fill the pores and form a plurality of micro-valves on the surface of the corrosion-resistant metal carrier, thereby expelling interfacial air, significantly improving the wettability of the low-melting-point liquid metal, and optimizing the effective heat conduction area.

Claims

1. A composite liquid metal thermal interface structure with a micro-roughened mesh framework, comprising: A corrosion-resistant metal carrier (100) having a plurality of pores (101) formed on an upper and lower surface, thus having a porous structure, and the corrosion-resistant metal carrier (100) being a nickel sheet, a metal mesh, or a metal wool; and a plurality of heat-conducting media (120) composed of a low-melting-point liquid metal, and adhering to the plurality of pores (101) in the porous structure of the corrosion-resistant metal carrier (100) due to capillary action; wherein the corrosion-resistant metal carrier (100) has an arithmetic average surface roughness (Ra) greater than or equal to 0.3 μm and less than or equal to 0.8 μm.

2. The composite liquid metal thermal interface structure as described in claim 1, wherein the low-melting-point liquid metal is gallium or a gallium alloy.

3. The composite liquid metal thermal interface structure as described in claim 1, wherein the adhesion of an inner wall of the hole (101) of the corrosion-resistant metal carrier (100) to the low-melting-point liquid metal is greater than the cohesive force of the low-melting-point liquid metal, and one side of an exposed surface of the heat-conducting medium (120) is shaped as a concave crescent.

4. The composite liquid metal thermal interface structure as described in claim 1, wherein the arithmetic mean surface roughness is 0.5 μm.

5. The composite liquid metal thermal interface structure as described in claim 1, wherein the corrosion-resistant metal carrier (100) is the nickel metal sheet, the overall thickness of the nickel metal sheet is greater than or equal to 0.03 mm and less than or equal to 0.2 mm, the plurality of holes (101) of the porous structure is a geometrically shaped through-hole array formed by micro-etching, a characteristic dimension of the hole (101) is greater than or equal to 0.1 mm and less than or equal to 0.5 mm, and the side distance between the two adjacent holes (101) is greater than or equal to 0.05 mm and less than or equal to 0.2 mm, wherein the characteristic dimension of the hole (101) is a pair of side distances of the hole (101), a circumscribed circle diameter or a diameter, and the hole (101) is a polygon or a circle.

6. The composite liquid metal thermal interface structure as described in claim 5, wherein the hole (101) is hexagonal, the characteristic dimension of the hole (101) is the distance between the opposite sides of the hole (101) and is 0.18 mm, the overall thickness of the nickel metal sheet is 0.15 mm, and the distance between the two adjacent holes (101) is 0.1 mm.

7. The composite liquid metal thermal interface structure as described in claim 1, wherein the corrosion-resistant metal carrier (100) is the metal braided mesh, the metal braided mesh is formed by interlacing a plurality of metal wires (102), the plurality of holes (101) are a plurality of capillary meshes of the metal braided mesh, the wire diameter of the metal wires (102) is greater than or equal to 0.01 mm and less than or equal to 0.2 mm, and the mesh density of the metal braided mesh is greater than or equal to 50 meshes and less than or equal to 200 meshes, wherein one of the overlapping portions (103) of the plurality of metal wires (102) has a pressure spot welding structure, such that the thickness of one of the overlapping portions (103) is less than twice the wire diameter of the metal wires (102).

8. The composite liquid metal thermal interface structure as described in claim 1, wherein the corrosion-resistant metal carrier (100) is the metal wool, which is a three-dimensional open porous structure, the overall thickness of the metal wool is greater than or equal to 0.1 mm and less than or equal to 0.3 mm, and the internal pore size of the hole (101) is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.

9. An electronic component assembly with heat dissipation function, comprising: A heating element (B) is an electronic component; A heat dissipation device (C) is disposed opposite to the heat-generating element (B); And a composite liquid metal thermal interface structure (A) as described in any one of claims 1 to 8, disposed between one of the contact surfaces of the heating element (B) and the heat dissipation device (C) to reduce a contact thermal resistance.

10. The electronic component assembly as claimed in claim 9, wherein the heat-generating element (B) is a central processing unit, a graphics processor, a high power density chip, or a silicon wafer, and the heat dissipation device (C) is a heat sink, a heat pipe, or a water cooling head, wherein the high power density chip is an artificial intelligence computing chip or a high-performance computing chip.

Images