Gallium-based paste-like metal-filled copper foam thermal interface pad

Abstract

This invention discloses a thermally conductive interface pad based on gallium-based paste metal-filled copper foam, comprising: a copper foam support frame, a gallium-based paste metal filling portion, a first exposed portion, and a second exposed portion. The copper foam support frame has opposing first and second contact surfaces and multiple interconnecting holes, with the multiple interconnecting holes opening onto the first and second contact surfaces respectively. The gallium-based paste metal filling portion fills the multiple interconnecting holes. The first exposed portion is formed on the first contact surface. The second exposed portion is formed on the second contact surface. The first and second exposed portions are formed by the gallium-based paste metal filling portion extending outward from the copper foam support frame. This forms a thermally conductive interface pad with a thermally conductive path, interface adhesion capability, structural load-bearing capacity, and prevents material overflow.

Claims

1. A thermally conductive interface pad based on gallium-based paste-like metal-filled copper foam, comprising: A copper foam support frame has a first contact surface, a second contact surface, and a plurality of communicating holes, wherein the plurality of communicating holes open onto the first contact surface and the second contact surface respectively; a gallium-based paste metal filling portion fills the plurality of communicating holes; a first exposed portion is formed on the first contact surface; and a second exposed portion is formed on the second contact surface; wherein the first exposed portion and the second exposed portion are formed by the gallium-based paste metal filling portion extending outward from the copper foam support frame.

2. The thermally conductive interface pad as described in claim 1, further comprising: An interface layer is formed at the contact interface between the foamed copper support skeleton and the gallium-based paste metal filling portion; wherein, the interface layer is a copper-gallium interface layer.

3. The thermally conductive interface pad as described in claim 1, wherein, The foamed copper support skeleton is a sheet-like foam mesh structure.

4. The thermally conductive interface pad as described in claim 1, wherein, The plurality of the connecting pores are formed by the first contact surface extending to the second contact surface.

5. The thermally conductive interface pad as described in claim 4, wherein, The gallium-based paste-like metal filling portion extends continuously from the first contact surface to the second contact surface along the plurality of interconnected pores.

6. The thermally conductive interface pad as described in claim 5, wherein, The first exposed portion and the second exposed portion are respectively integrated with the gallium-based paste-like metal filling portion that fills the plurality of communicating pores.

7. The thermally conductive interface pad as described in claim 6, wherein, The thickness of the first exposed portion and the second exposed portion is 3% to 40% of the thickness of the foamed copper support skeleton.

8. The thermally conductive interface pad as described in claim 2, wherein, The interface layer is disposed along the inner wall of the plurality of connected pores.

9. The thermally conductive interface pad as described in claim 8, wherein, The interface layer extends from the opening area adjacent to the first contact surface to the opening area adjacent to the second contact surface.

10. The thermally conductive interface pad as claimed in claim 1, wherein, The foamed copper support frame includes multiple interlocking struts and nodes to define multiple interconnected openings.

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