Dual-mode ultrafast laser precision cutting equipment

Abstract

This disclosure provides a dual-mode ultrafast laser precision cutting device, comprising: a base; a linear motion platform mounted on the base; a rotary platform detachably mounted on the linear motion platform, the rotary platform being switchable between an active state and a detached state relative to the linear motion platform; an ultrafast laser light source module mounted above the base; and a smart control host, the smart control host having a circular substrate mode and a square substrate mode for the operator to select from. When operating the circular substrate mode, the rotary platform is in the active state; when operating the square substrate mode, the rotary platform is in the detached state, and the smart control host executes the cutting trajectory through the coordinated movement of the linear motion platform and the galvanometer scanner.

Claims

1. A dual-mode ultrafast laser precision cutting device, comprising: a base; a linear motion platform mounted on the base; a rotating platform detachably mounted on the linear motion platform, and the rotating platform being switchable between an active state and a detached state relative to the linear motion platform; and an ultrafast laser light source module mounted above the base, the ultrafast laser light source module comprising at least one ultrafast pulse laser source, a Bessel beam shaper, and a galvanometer scanner, the Bessel beam shaper being mounted in the laser optical path of the ultrafast pulse laser source, and the galvanometer scanner being mounted behind the laser optical path of the Bessel beam shaper; A lifting mechanism is provided for adjusting the laser focus position; and a smart control host is coupled to the linear motion platform, the rotary platform, the ultrafast laser light source module and the lifting mechanism. The smart control host has a circular substrate mode and a square substrate mode for the operator to select. When the circular substrate mode is running, the rotary platform is in the active state. When the square substrate mode is running, the rotary platform is in the disengaged state. The smart control host executes the cutting trajectory through the coordinated movement of the linear motion platform and the galvanometer scanner.

2. The dual-mode ultrafast laser precision cutting equipment as described in claim 1, wherein, The intelligent control host further includes an intelligent optical path correction algorithm module, which uses machine learning models to compensate for temperature drift, mechanical offset and aging factors of optical components in the laser optical path in real time.

3. The dual-mode ultrafast laser precision cutting equipment as described in claim 1, wherein, The intelligent control host includes a material database and a process parameter management module. It has built-in optimized laser parameter formulas for different substrate materials and has an artificial intelligence automatic learning function to continuously optimize process parameters.

4. The dual-mode ultrafast laser precision cutting equipment as described in claim 1, wherein, The intelligent control host includes a corner reinforcement control module, which automatically identifies the intersection corner positions of all cutting tracks and executes reinforcement processing programs in square substrate mode.

5. The dual-mode ultrafast laser precision cutting equipment as described in claim 1, wherein, The rotating platform adopts a modular and detachable interface design, which can switch between active and detached states without stopping the equipment.

6. The dual-mode ultrafast laser precision cutting equipment as described in claim 1, wherein, The intelligent control unit further includes a real-time process monitor that integrates a high-speed camera and optical sensors to monitor the cutting process in real time.

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