Heat dissipation structure of electronic component package
Patent Information
- Application Number
- TW115205437
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-06-12
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2036-06-11
Smart Images
Figure 00000000_0000_ABST
Abstract
Claims
1. A heat dissipation structure for an electronic component package, comprising: One substrate; A processing unit is attached to the substrate; A plurality of electronic components are arranged on the processing unit; A heat-conducting cover is disposed on the substrate and covers the processing unit. At least one adaptive structure is provided on the inner side of the heat-conducting cover corresponding to each electronic component. The at least one adaptive structure is respectively connected to each corresponding electronic component.
2. The heat dissipation structure of the electronic component package as described in claim 1, wherein an insulating thermally conductive sheet is sandwiched between one of the electronic components and the corresponding adaptation structure, the insulating thermally conductive sheet having a heat dissipation surface and a heat absorption surface, the heat dissipation surface being planar and attached to the adaptation structure, and the heat absorption surface being attached to the surface of the processing unit.
3. The heat dissipation structure of the electronic component package as described in claim 2, wherein the adaptive structure protrudes or is recessed into the inner side of the heat-conducting cover.
4. The heat dissipation structure of the electronic component package as described in claim 1, wherein one of the at least one adaptive structure penetrates the heat-conducting cover, and the corresponding electronic component is housed in the adaptive structure.
5. The heat dissipation structure of the electronic component package as described in claim 1, wherein a heat sink is attached to the outer side of the heat-conducting cover, and the electronic component is thermally connected to the heat sink through the adaptation structure.
6. The heat dissipation structure of the electronic component package as described in claim 5, wherein the heat sink has a plurality of fins.
7. The heat dissipation structure of the electronic component package as described in claim 5, wherein an insulating thermally conductive sheet is sandwiched between the electronic component and the heat sink, the insulating thermally conductive sheet having a heat dissipation surface and a heat absorption surface, the heat dissipation surface being planar and attached to the heat sink, and the heat absorption surface being attached to the surface of the processing unit.
8. The heat dissipation structure of the electronic component package as described in claim 5, wherein the electronic component is attached to the heat sink.
9. The heat dissipation structure of the electronic component package as described in claim 2 or 7, wherein the insulating thermally conductive sheet is made of silicon or diamond.
10. The heat dissipation structure of the electronic component package as described in claim 9, wherein the insulating thermally conductive sheet is made of silicon carbide, silicon, diamond sheet or diamond copper composite sheet.
11. The heat dissipation structure of the electronic component package as described in claim 1, wherein the heat-conducting cover is made of copper.
12. The heat dissipation structure of the electronic component package as claimed in claim 1, wherein the processing unit has a top surface and a bottom surface opposite to the top surface, both the top surface and the bottom surface being planar, the bottom surface being attached to the substrate and the electronic components being arranged on the top surface.
13. The heat dissipation structure of the electronic component package as described in claim 1, wherein the periphery of each electronic component is separately configured from the heat-conducting cover.