Communication Integrated Solid State Relay Device
Patent Information
- Application Number
- TW115205515
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-06-16
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2036-06-15
Smart Images

Figure TWG2TB001911285_001 
Figure TWG2TB001911285_002 
Figure TWG2TB001911285_003
Abstract
Claims
1. A communication-integrated solid-state relay device, communicatively connected to a control device and electrically connected to a power supply and a plurality of loads, the control device being used to transmit a plurality of first control signals to the communication-integrated solid-state relay device, the power supply being used to supply power to the communication-integrated solid-state relay device, the communication-integrated solid-state relay device being used to transmit the power to the loads according to the first control signals, and comprising: a housing having an accommodating space; A circuit board assembly includes a first mounting portion and a second mounting portion. The first mounting portion is disposed within an accommodating space and includes a communication module, a plurality of switch modules, and an error feedback module. The second mounting portion is exposed outside the housing and includes an input terminal, a signal terminal, and a plurality of output terminals. The input terminal is electrically connected to a power source and is used to receive power from the power source. The signal terminal is communicatively connected to a control device and is used to receive first control signals from the control device. The output terminals are electrically connected to loads and are used to output power to the loads. The communication module is communicatively connected to the signal terminal and is used to receive power from the signal terminal. The system receives and transmits the first control signals accordingly. The switching modules are electrically connected to the input terminals, the communication module, and the output terminals. Each switching module receives the first control signal and, according to the first control signal, enables or disables the electrical connection between the input terminal and the output terminal. The abnormal feedback module is electrically connected to the communication module, the switching modules, and the output terminals. When the abnormal feedback module determines that the voltage of the power supply is greater than a voltage reference value, the abnormal feedback module outputs an abnormal feedback signal to the communication module according to the voltage. The communication module transmits the abnormal feedback signal to the control device via the signal terminal.
2. The communication-integrated solid-state relay device as described in claim 1, wherein the circuit board assembly includes a first circuit board and a second circuit board, the first circuit board being electrically connected to the second circuit board, the first circuit board being provided with the input terminals, the output terminals, the switching modules and the fault feedback module, and the second circuit board being provided with the signal terminals and the communication module.
3. The communication-integrated solid-state relay device as described in claim 2, wherein the first circuit board and the second circuit board are disposed overlappingly in the housing, and the first circuit board covers a portion of the second circuit board.
4. The communication-integrated solid-state relay device as described in claim 3, wherein the lower surface of the first circuit board, the upper surface of the second circuit board covered by the first circuit board, and the lower surface of the second circuit board constitute the first mounting portion; the upper surface of the first circuit board and the upper surface of the second circuit board not covered by the first circuit board constitute the second mounting portion.
5. The communication-integrated solid-state relay device as described in claim 3, wherein the housing has an opening and two opposing sidewalls, the opening communicating with the receiving space, each sidewall having a first groove and a second groove, the first groove being closer to the opening than the second groove, the two sides of the first circuit board being respectively inserted into the two first grooves, and the two sides of the second circuit board being respectively inserted into the two second grooves, the input terminals and output terminals on the first circuit board, and the signal terminals on the second circuit board extending out of the opening and exposed outside the housing.
6. The communication-integrated solid-state relay device as described in claim 1, wherein each of the switching modules includes a first optocoupler and a transistor, the first optocouplers being electrically connected to the communication module and the transistors respectively, the transistors being electrically connected to the input terminals, the output terminals and the fault feedback module respectively, the first optocouplers receiving the first control signals and transmitting the first control signals to the transistors to control the transistors to turn on or off the electrical connection between the input terminals and the output terminals.
7. The communication integrated solid-state relay device as described in claim 1, wherein the circuit board assembly includes a voltage input terminal disposed on the second mounting portion, the voltage input terminal being used to input the abnormal feedback signal and electrically connected to the abnormal feedback module, wherein when the abnormal feedback module determines that the voltage of the power supply is greater than the voltage reference value, the abnormal feedback module receives the abnormal feedback signal from the voltage input terminal and outputs the abnormal feedback signal to the communication module according to the voltage of the power supply.
8. The communication-integrated solid-state relay device as described in claim 1, wherein the circuit board assembly includes a reset control module disposed on the first mounting portion, the reset control module being electrically connected to the communication module, the switching modules and the fault feedback module, wherein when the communication module transmits a second control signal transmitted by the control device to the reset control module, and / or the fault feedback module outputs a comparison signal to the reset control module based on the voltage, the reset control module controls the switching modules to turn off based on the second control signal and / or the comparison signal.
9. The communication-integrated solid-state relay device as described in claim 1, wherein the first mounting section is provided with a control unit, the control unit being electrically connected to the fault feedback module and the switching modules, when the fault feedback module determines that the voltage of the power supply is greater than the voltage reference value, the fault feedback module outputs the fault feedback signal to the communication module according to the voltage, and outputs a comparison signal to the control unit according to the voltage, the communication module transmits the fault feedback signal to the control device via the signal terminal, and the control unit controls the corresponding switching module to turn off according to the comparison signal.