Packaging carrier

Abstract

A packaging carrier includes a first substrate, a second substrate, and a dielectric layer. The first substrate has a first surface and a second surface opposite to the first surface, and includes a plurality of metal pillars. The plurality of metal pillars are disposed on the first surface and the second surface. The second substrate is electrically connected to the first substrate and has a plurality of first through-holes. The dielectric layer is disposed between the first substrate and the second substrate, wherein the plurality of metal pillars penetrate the dielectric layer and are inserted into the plurality of first through-holes. The aforementioned packaging carrier, by having metal pillars on the first substrate penetrating the dielectric layer and inserted into the first through-holes on the second substrate, helps to reduce the risk of inter-board structural misalignment and interlayer bonding failure.

Claims

1. A packaging carrier board, comprising: A first substrate has a first surface and a second surface opposite to the first surface, and the interior of the first substrate has a plurality of buried vias, wherein the plurality of buried vias extend along the first surface toward the second surface. The first substrate includes: a first conductive adhesive disposed within the plurality of buried vias; and a plurality of metal pillars disposed on the first surface and the second surface, wherein a first projection pattern of the plurality of metal pillars projected onto the first surface overlaps a second projection pattern of the first conductive adhesive projected onto the first surface. A second substrate is electrically connected to the first substrate and has a plurality of first through-holes, wherein the plurality of first through-holes penetrate opposite sides of the second substrate. The second substrate includes: a second conductive adhesive disposed within the plurality of first through-holes; and a dielectric layer disposed between the first substrate and the second substrate, wherein the plurality of metal pillars penetrate the dielectric layer and are inserted into the plurality of first through-holes.

2. The encapsulation substrate as claimed in claim 1, wherein a third projection pattern of the plurality of metal pillars projected onto the second surface overlaps a fourth projection pattern of the first conductive adhesive projected onto the second surface.

3. The packaging substrate as described in claim 2, wherein the first substrate further comprises: A first initial substrate having a first sub-surface, a second sub-surface relative to the first sub-surface, and the plurality of buried vias, wherein the plurality of buried vias extend from the first sub-surface to the second sub-surface; And two redistribution layers, respectively disposed on the first sub-surface and the second sub-surface, and the two redistribution layers each have a plurality of grooves, wherein each of the plurality of metal pillars is disposed on each of the plurality of grooves.

4. The packaging substrate as described in claim 3, wherein the first substrate further comprises: A metal shell is disposed on the first hole wall of each of the plurality of buried holes; And a first metal layer disposed on a portion of the first sub-surface and a portion of the second sub-surface, wherein the first metal layer covers the plurality of buried vias that have been filled with the first conductive adhesive.

5. The packaging substrate as described in claim 4, wherein the redistribution layer disposed on the first sub-surface comprises: A first dielectric layer covers the first metal layer and a portion of the first sub-surface, and has a plurality of sub-grooves; A first rewiring metal layer covering a portion of the first dielectric layer and the plurality of sub-grooves; a second dielectric layer covering the first rewiring metal layer and a portion of the first dielectric layer, and having the plurality of grooves; and a second rewiring metal layer covering the plurality of grooves.

6. The packaging substrate as described in claim 4, wherein the redistribution layer disposed on the second sub-surface comprises: A first dielectric layer covers the first metal layer and a portion of the second sub-surface, and has a plurality of sub-grooves; A first rewiring metal layer covering a portion of the first dielectric layer and the plurality of sub-grooves; a second dielectric layer covering the first rewiring metal layer and a portion of the first dielectric layer, and having the plurality of grooves; and a second rewiring metal layer covering the plurality of grooves.

7. The packaging substrate as claimed in claim 1, wherein the second substrate has a third surface and a fourth surface opposite the third surface, and the second substrate further comprises: A second metal layer is disposed on a second hole wall, a portion of the third surface, and a portion of the fourth surface of each of the plurality of first through holes.

8. The packaging substrate as described in claim 7, wherein the thickness of the dielectric layer is greater than or equal to the thickness of the second metal layer.

9. The packaging substrate as claimed in claim 1, wherein the dielectric layer has a plurality of second through-holes, and each of the plurality of metal pillars passes through each of the plurality of second through-holes.

10. A packaging carrier board, comprising: A first substrate has a first surface and a second surface opposite to the first surface, and the first substrate has a plurality of buried vias, wherein the plurality of buried vias extend along the first surface toward the second surface. The first substrate includes: a first conductive adhesive disposed within the plurality of buried vias; and a plurality of metal pillars disposed on the first surface and the second surface, wherein a first projection pattern of the plurality of metal pillars projected onto the first surface overlaps a second projection pattern of the first conductive adhesive projected onto the first surface; wherein a third projection pattern of the plurality of metal pillars projected onto the second surface overlaps a fourth projection pattern of the first conductive adhesive projected onto the second surface; and two second substrates are electrically connected to the first substrate, with the first substrate located between the two second substrates, and each of the second substrates has a plurality of first through-holes, wherein the plurality of first through-holes penetrates two opposite sides of the second substrate. The second substrate includes: a second conductive adhesive disposed within the plurality of first through-holes; and two dielectric layers, each disposed between the first substrate and the second substrate, wherein the first substrate is located between the two dielectric layers, and the plurality of metal pillars penetrate the two dielectric layers and are inserted into the first through-holes.

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