Chip carrier disk

Abstract

This invention relates to a wafer carrier tray, which has a mating space at the bottom of its base and a protruding carrier portion at the top. The top of the carrier portion has a plurality of loading units arranged at intervals. Each loading unit includes a plurality of connected and staggered receiving slots and a plurality of limiting slots. The base has a plurality of protruding positioning strips at the bottom of the mating space, which correspond to the positions of the plurality of loading units. The plurality of receiving slots can be used to load wafers. The carrier portion can be stacked and mated with the mating space of the base of another wafer carrier tray, and each positioning strip of the other wafer carrier tray can be mated with the plurality of limiting slots of the loading unit corresponding to the position of the wafer carrier tray and extend into the plurality of receiving slots to effectively position the wafer. This prevents the wafer from being worn or generating debris or dust due to vibration during transportation.

Claims

1. A wafer carrier disk, comprising: a base having a mating space with a downward opening at its bottom end; a carrier portion disposed at the top end of the base and protruding upward toward the base, corresponding to the position of the mating space of the base, the top end of the carrier portion having a plurality of loading units arranged at intervals, each loading unit comprising a plurality of connected receiving slots and a plurality of limiting slots, each receiving slot being disposed between every two adjacent limiting slots; and a plurality of positioning strips disposed at the bottom end of the base at the mating space and protruding downward toward the base, respectively corresponding to the positions of the plurality of loading units of the carrier portion.

2. The wafer carrier disk as described in claim 1, wherein, The depth of the plurality of receiving grooves is greater than the depth of the plurality of limiting grooves.

3. The wafer carrier disk as described in claim 1, wherein, The length of the plurality of receiving slots is greater than the length of the plurality of limiting slots.

4. The wafer carrier disk as described in claim 2, wherein, The length of the plurality of receiving slots is greater than the length of the plurality of limiting slots.

5. The wafer carrier disk as described in any one of claims 1 to 4, wherein, The inner wall of the multiple receiving slots extends outward from the bottom upward.

6. The wafer carrier disk as described in any one of claims 1 to 4, wherein, The inner wall of the plurality of limiting grooves extends outward from the bottom upward, and the outer wall of the plurality of positioning strips extends inward from the base downward.

7. The wafer carrier disk as described in claim 5, wherein, The inner wall of the plurality of limiting grooves extends outward from the bottom upward, and the outer wall of the plurality of positioning strips extends inward from the base downward.

8. The wafer carrier disk as described in any one of claims 1 to 4, wherein, One of the corners of the base forms a directional oblique angle.

9. The wafer carrier disk as described in claim 5, wherein, One of the corners of the base forms a directional oblique angle.

10. The wafer carrier disk as described in claim 6, wherein, One of the corners of the base forms a directional oblique angle.

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