Circuit board assembly

Abstract

A circuit board assembly includes a signal transmission board, a power distribution board, and at least one support substrate. The power distribution board is disposed on the signal transmission board. The at least one support substrate supports the signal transmission board and the power distribution board. The rigidity of the at least one support substrate is greater than that of the signal transmission board and the power distribution board, and the coefficient of thermal expansion of the at least one support substrate is less than that of the signal transmission board and the power distribution board. In this way, the high rigidity and low coefficient of thermal expansion of the support substrate can be used to support the signal transmission board and the power distribution board during the lamination process of the circuit board assembly.

Claims

1. A circuit board assembly, comprising: a signal transmission board; a power distribution board disposed on the signal transmission board; and at least one support substrate supporting the signal transmission board and the power distribution board; wherein, The rigidity of the at least one supporting substrate is greater than that of the signal transmission board and the power distribution board, and the coefficient of thermal expansion of the at least one supporting substrate is less than that of the signal transmission board and the power distribution board.

2. The circuit board assembly as claimed in claim 1, wherein the at least one support substrate is sandwiched between the signal transmission board and the power distribution board.

3. The circuit board assembly as claimed in claim 2 further includes two bonding members, which are respectively disposed between the signal transmission board and the at least one support substrate and between the power distribution board and the at least one support substrate, so as to bond the signal transmission board, the power distribution board and the at least one support substrate.

4. The circuit board assembly as claimed in claim 3, wherein the two bonding members are adhesive films.

5. The circuit board assembly as claimed in claim 1, wherein the number of the at least one support substrate is two, and the two support substrates are respectively embedded in the signal transmission board and the power distribution board.

6. The circuit board assembly as claimed in claim 5 further includes a connector disposed between the signal transmission board and the power distribution board to connect the signal transmission board and the power distribution board.

7. The circuit board assembly as claimed in claim 6, wherein the bonding member is a prepreg.

8. The circuit board assembly as claimed in claim 1 further includes at least one conductive portion, the signal transmission board having at least one first through-hole, the power distribution board having at least one second through-hole, the at least one support substrate having at least one third through-hole, the at least one first through-hole, the at least one second through-hole and the at least one third through-hole corresponding to and communicating with each other, the at least one conductive portion extending within the at least one first through-hole, the at least one second through-hole and the at least one third through-hole, and the at least one conductive portion, the at least one first through-hole, the at least one second through-hole and the at least one third through-hole together forming a via structure.

9. The circuit board assembly as claimed in claim 1, wherein the Young's modulus of the at least one support substrate is greater than or equal to 27 gigapascals (GPa), and the coefficient of thermal expansion of the at least one support substrate is less than or equal to 40 ppm / °C.

10. The circuit board assembly as claimed in claim 1, wherein the at least one supporting substrate is made of ceramic, glass or resin.

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