Memory module heat dissipation device
Patent Information
- Application Number
- TW115206114
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2026-07-01
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2036-06-30
Smart Images
Figure 00000000_0000_ABST
Abstract
Claims
1. A heat dissipation device for memory modules, used for dissipating heat from at least two memory modules, the heat dissipation device comprising: A water-cooled structure includes at least two infusion plates spaced apart and arranged side-by-side, with two memory modules spaced apart and arranged side-by-side between the two infusion plates, and fluid flowing through each infusion plate; and at least one metal cold plate, the metal cold plate including a cold plate body and two protruding arms, the cold plate body being disposed between one side of the two memory modules and sandwiched between one side of a heat pipe, the cold plate body having two opposite ends, each of the protruding arms being connected to one end of the cold plate body, the two protruding arms being respectively attached to one side of the two infusion plates, and the heat pipe being connected between the two protruding arms; wherein, by sandwiching the cold plate body between one side of the two memory modules, the other side of the two memory modules is more tightly attached to one side of the two infusion plates respectively.
2. The heat dissipation device for the memory module as described in claim 1, wherein the two protruding arms are offset and bent relative to each other.
3. The heat dissipation device for the memory module as described in claim 1 or 2, wherein one of the two protruding arms is bent toward one of the two infusion plates, and the other of the two protruding arms is bent toward the other of the two infusion plates.
4. The heat dissipation device for the memory module as described in claim 1 or 2, wherein each of the protruding arms is bent to form a bonding section, and the two protruding arms are respectively bonded to one side of the two infusion plates via the bonding section.
5. The heat dissipation device for the memory module as described in claim 4, wherein each of the protruding arms is further bent from each end of the cold plate body to form a middle section, the middle section being connected between the end and the bonding section, the middle section being bent relative to the cold plate body, and the bonding section being bent relative to the middle section.
6. The heat dissipation device for the memory module as described in claim 1, wherein the cold plate body has two cold plate surfaces facing each other, one of the two cold plate surfaces has a recessed groove, and the heat pipe is embedded in the recessed groove.
7. The heat dissipation device for the memory module as claimed in claim 1, wherein the cold plate body is divided into two halves arranged one above the other, one of the two halves having two ends.
8. The heat dissipation device for the memory module as claimed in claim 1, wherein the water cooling structure further comprises two containers, each of the infusion plates being spaced apart and connected between the two containers, and each container containing the fluid.
9. The heat dissipation device for the memory module as described in claim 1 further includes at least one heat-equalizing component, the heat-equalizing component comprising a first heat-equalizing plate and a second heat-equalizing plate, the first heat-equalizing plate being sandwiched between one side of one of the two infusion plates and one side or the other side of the memory module, and the second heat-equalizing plate being sandwiched between a cold plate surface of the cold plate body and the other side or the first side of the memory module.