Heat dissipation structure for optical modules
Patent Information
- Application Number
- TW115206234
- Authority / Receiving Office
- TW · TW
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2026-04-22
- Filing Date
- 2026-07-03
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2036-07-02
Smart Images

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Abstract
Claims
1. A heat dissipation structure for an optical module, wherein, The heat dissipation structure includes: a heat sink; a heat conductor, the heat conductor including: an elastic part, a heat conductor pad, and a heat conductor sheet; the heat conductor sheet is placed on one side of the heat sink, and there is a gap between the heat conductor sheet and the heat sink to accommodate the heat conductor pad; the heat conductor pad is elastic, the heat conductor pad is placed in the gap, and the heat conductor pad is connected to the heat conductor sheet and / or the heat sink; the heat conductor sheet is connected to the heat sink through the elastic part; and a metal shell, the metal shell having an internal cavity for accommodating an optical module, a first opening at the bottom of the metal shell, the metal shell being disposed on the heat conductor through the first opening, a second opening on the side wall of the metal shell adjacent to the first opening, the second opening communicating with the cavity, the second opening for inserting and removing the optical module, so that the optical module is electrically connected or disconnected from the components inside the metal shell; When the optical module is inserted into the metal casing, the sidewall of the optical module abuts against the heat-conducting sheet, and the heat-conducting pad contacts the heat-conducting sheet and the heat sink.
2. The heat dissipation structure for the optical module as described in claim 1, wherein, Two elastic portions are provided, and the two elastic portions are located on opposite sides of the heat-conducting sheet; each elastic portion includes a bent piece, one side of which is connected to one side of the heat-conducting sheet, and the other side of which is connected to the heat sink.
3. The heat dissipation structure for the optical module as described in claim 2, wherein, The bent sheet includes a plurality of first bent segments and a plurality of second bent segments. The plurality of first bent segments are parallel to each other, and the plurality of second bent segments are parallel to each other. The plurality of first bent segments and the plurality of second bent segments are alternately connected. One of the first bent segments is inclinedly disposed on one side of the heat-conducting sheet in a direction away from the heat-conducting pad, and the second bent segment is inclinedly disposed on the first bent segment in a direction close to the heat-conducting pad. The angle between the first bent segment and the second bent segment is an acute angle.
4. The heat dissipation structure for the optical module as described in claim 3, wherein, The heat-conducting sheet is made of stainless steel, and the heat-conducting sheet and the elastic part are integrally formed.
5. The heat dissipation structure for the optical module as described in claim 1, wherein, The thermal pad is a ceramic silicon thermal pad.
6. The heat dissipation structure for an optical module as described in claim 1, wherein, The thermal pad is adhered to the thermal sheet.
7. The heat dissipation structure for an optical module as described in claim 1, wherein, The heat dissipation component is a water-cooled plate.
8. The heat dissipation structure for the optical module as described in claim 7, wherein, There are multiple heat-conducting components, and multiple heat-conducting components are arranged in an array on the water-cooling plate. The number of metal shells is the same as the number of heat-conducting components, and one metal shell is correspondingly covered on one heat-conducting component.
9. The heat dissipation structure for an optical module as described in claim 8, wherein, Multiple water-cooled plates are provided, and the multiple water-cooled plates are interconnected so that the cooling fluid can flow between the multiple water-cooled plates.