Antenna packaging structure

Abstract

An antenna packaging structure includes a substrate, an antenna structure, and a molding compound. The antenna structure includes a pre-component fixed to the substrate using surface mount technology and an antenna body embedded in the pre-component on one side opposite to the substrate. The molding compound fills the space between the substrate and the pre-component. The antenna structure is designed by first fixing the pre-component to the substrate using surface mount technology, and then embedding the antenna body into the pre-component. This reduces the risk of soldering misalignment and prevents the antenna body from rotating or shifting due to hot air or vibration during reflow soldering.

Claims

1. An antenna packaging structure, comprising: a substrate; an antenna structure including a pre-component fixed to the substrate by surface mounting technology and an antenna body embedded in the pre-component on one side opposite to the substrate; and a molding compound filling the space between the substrate and the pre-component.

2. The antenna packaging structure as described in claim 1, wherein, The pre-component includes an embedded section embedded in the molding compound and welded to the substrate, and a planar section connected to the embedded section and located on one of the upper surfaces of the molding compound.

3. The antenna packaging structure as described in claim 2, wherein, The embedded segment is integrally formed with the planar segment.

4. The antenna packaging structure as described in claim 2, wherein, The antenna body has a welded section extending into the pre-component and an extension section connected to the welded section and exposed outside the pre-component.

5. The antenna packaging structure as described in claim 4, wherein, The pre-component has a through hole that runs vertically through the planar section and the embedded section and is filled with welding material. The welded section of the antenna body extends into the through hole and is embedded in the welding material.

6. The antenna packaging structure as described in claim 5, wherein, The diameter of the through hole gradually decreases from top to bottom.

7. The antenna packaging structure as described in claim 5, wherein, The walls of the through hole are plated with gold.

8. The antenna packaging structure as described in claim 5, wherein, The substrate has a signal feed point, and the through hole corresponds to the position of the signal feed point.

9. The antenna packaging structure as described in claim 4, wherein, The extension of the antenna body extends to the upper surface of the pre-construction.

10. The antenna packaging structure as described in claim 9, wherein, The antenna itself is suitable for the 5, 6 or 7 GHz frequency band.

11. The antenna packaging structure as described in claim 4, wherein, The extension of the antenna body extends to the upper surface of the pre-component and the side of the pre-component and the encapsulation layer.

12. The antenna packaging structure as described in claim 11, wherein, The encapsulation layer has four sides, and the antenna body extends to at least two of the sides of the encapsulation layer.

13. The antenna packaging structure as described in claim 11, wherein, The antenna itself is suitable for the 2.4 GHz frequency band.

14. The antenna packaging structure as described in claim 1, wherein, The antenna body is made of stainless steel.

15. The antenna packaging structure as described in claim 1, wherein, The material of the pre-component is liquid crystal polymer.

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