Film cutting apparatus

TWM687766UActive Publication Date: 2026-09-21C SUN MFG LTD
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Patent Information

Application Number
TW115204274
Authority / Receiving Office
TW · TW
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2026-05-13
Publication Date
2026-09-21
Estimated Expiration
2036-05-12

Smart Images

  • Figure TWG2TB001912780_001
    Figure TWG2TB001912780_001
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    Figure TWG2TB001912780_002
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    Figure TWG2TB001912780_003
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Abstract

A film cutting apparatus is disclosed for cutting portions of film material adhered to a substrate. The apparatus includes a carrier assembly, a laser assembly, and a vacuum unit, with the laser assembly and vacuum unit positioned above the carrier assembly and adjacent to the laser assembly. The carrier assembly supports the substrate, and the laser assembly provides a laser beam for cutting the film material. The vacuum unit includes a vacuum port facing the film material. The vacuum unit is used to draw gas from the film material through the vacuum port.
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Claims

1. A film cutting apparatus for cutting a portion of a film material adhered to a substrate, the film cutting apparatus comprising: a carrier assembly for carrying the substrate; a laser assembly disposed above the carrier assembly for providing a laser beam for cutting the film material; and a suction member disposed above the carrier assembly, the suction member adjacent to the laser assembly, the suction member including a suction port facing the film material, the suction member for suctioning gas from the film material through the suction port.

2. The film cutting apparatus as claimed in claim 1, wherein the laser assembly comprises: a light source; and a focusing element disposed between the light source and the carrier assembly, wherein the light source is used to provide the laser beam, and the focusing element is used to focus the laser beam onto the film material.

3. The film cutting apparatus as claimed in claim 2, wherein the laser assembly includes a first moving mechanism connected to the focusing element, the first moving mechanism being used to move the position of the focusing element relative to the light source.

4. The film cutting apparatus as claimed in claim 2, wherein the laser assembly includes a beam expander disposed between the light source and the focusing element, the beam expander being used to receive the laser beam from the light source, and the focusing element being used to receive the laser beam from the beam expander.

5. The film cutting apparatus as claimed in claim 2, wherein the laser assembly includes a second moving mechanism connected to the light source and the focusing element, the second moving mechanism being used to move the position of the light source and the focusing element relative to the carrier assembly.

6. The film cutting device as claimed in claim 1, wherein the air extraction member is fixedly connected to the carrier assembly, and the air extraction member is located on the side of the carrier assembly adjacent to the laser assembly.

7. The film cutting device as claimed in claim 1 further includes an air blowing member connected to the laser assembly, and the air blowing member and the laser assembly are displaced together.

8. The membrane cutting apparatus as claimed in claim 1 further comprises: a fan connected to the extraction member; and a filter connected to the fan, wherein the fan is used to draw gas from the extraction member, and the filter is used to receive gas from the fan.

9. The film cutting device as claimed in claim 1, wherein the air extraction member is connected to the laser assembly, and the air extraction member and the laser assembly are displaced together.

10. The film cutting apparatus as claimed in claim 1, wherein the carrier component includes a carrier surface for carrying the substrate.