Miniature display with improved heat dissipation structure

Abstract

This invention relates to a microdisplay with an improved heat dissipation structure, comprising a microdisplay chip carrier, on the front of which a light-emitting diode array chip is disposed for displaying projected information such as symbols, images, or text, and signal pins of the light-emitting diode array chip extending to the back of the microdisplay chip carrier; a circuit board unit having an opening in the middle, through which the microdisplay chip carrier covers the opening and fixes the signal pins to the circuit board unit; and a heat dissipation unit disposed on the other side of the circuit board unit relative to the microdisplay chip carrier, wherein a heat-conducting block extends from the surface of the heat dissipation unit, and the heat-conducting block passes through the opening and connects to the microdisplay chip carrier to conduct and dissipate the heat generated by the microdisplay chip carrier.

Claims

1. A microdisplay with an improved heat dissipation structure, comprising: a microdisplay chip carrier, wherein a light-emitting diode array chip is disposed on the front side of the microdisplay chip carrier for displaying projection information of symbols, images or text, and signal pins of the light-emitting diode array chip are extended and disposed on the back side of the microdisplay chip carrier; a circuit board unit having an opening in the middle, wherein the microdisplay chip carrier covers the opening and fixes the signal pins to the circuit board unit; and a heat dissipation unit disposed on the other side of the circuit board unit relative to the microdisplay chip carrier, wherein a heat-conducting block extends from the surface of the heat dissipation unit, and the heat-conducting block passes through the opening and connects to the microdisplay chip carrier to conduct and dissipate the heat generated by the microdisplay chip carrier.

2. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, The light-emitting diode array chip uses a micro light-emitting diode (Micro LED) array.

3. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, The opening can be square, rectangular, circular, elliptical, or rhomboid geometric shapes.

4. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, The opening is provided in one or more forms, and the size or number of the heat-conducting block is adjusted in accordance with the opening.

5. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, The heat dissipation unit consists of heat dissipation fins formed from aluminum, copper, or an aluminum-copper alloy.

6. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, Thermally conductive adhesive is placed between the microdisplay chip carrier and the heat dissipation unit to evenly disperse and accelerate heat dissipation.

7. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, The signal pin is soldered to the circuit board unit.

8. A microdisplay with an improved heat dissipation structure as described in claim 1, wherein, The circuit board unit is covered with a light-transmitting cover or an optical lens to enhance the display effect of the projected information projected by the light-emitting diode array chip.

Images